Polyphenylene Oxide Patents (Class 525/905)
  • Patent number: 11814479
    Abstract: A composition includes particular amounts a poly(phenylene ether), a first polyamide, hydrogenated block copolymer of an alkenyl aromatic and a conjugated diene, pentaerythritol tetrastearate, and bisphenoxyethanol fluorene. The composition can be particularly well-suited for use in a reinforced thermoplastic composition including a reinforcing carbon filler.
    Type: Grant
    Filed: March 23, 2021
    Date of Patent: November 14, 2023
    Assignee: SHPP Global Technologies B.V.
    Inventors: Yi Li, Kayoko Onda
  • Patent number: 11584851
    Abstract: The present application provides a resin component, and a prepreg and a circuit material using the same. The resin component comprises unsaturated polyphenylene ether resin, polyolefin resin, terpene resin and an initiator. When the total weight of the unsaturated polyphenylene ether resin, polyolefin resin and terpene resin is defined as 100 parts by weight, the terpene resin is in an amount of 3-40 parts by weight. The polyolefin resin is one or a combination of at least two selected from the group consisting of unsaturated polybutadiene resin, SBS resin and styrene butadiene resin. The present application discloses that the resulting resin composition has good film-forming properties, adhesion and dielectric properties through the coordination of unsaturated polyphenylene ether resin, unsaturated polyphenylene ether resin, polyolefin resin and terpene resin, and the circuit boards using the same have higher interlayer peel strength and lower dielectric loss.
    Type: Grant
    Filed: January 27, 2021
    Date of Patent: February 21, 2023
    Assignee: Shengyi Technology Co., Ltd.
    Inventors: Jianying Shi, Weifeng Yin, Yongjing Xu, Shanyin Yan
  • Patent number: 11434329
    Abstract: The invention relates to polymers comprising sulfonated 2,6-diphenyl-1,4-phenylene oxide repeating units, to a method for their preparation, and to their use in a membrane electrode assembly, in a proton exchange membrane, in a fuel cell, in an electrolyser, in an electrolytic hydrogen compressor or in a flow battery. The invention further relates to a proton exchange membrane comprising said polymer and to a method for the preparation of a proton exchange membrane from said polymer. The invention also relates to the use of the polymers in ion exchange materials.
    Type: Grant
    Filed: July 5, 2018
    Date of Patent: September 6, 2022
    Assignee: MxPolymers B.V.
    Inventor: Doetze Jakob Sikkema
  • Patent number: 8461264
    Abstract: Disclosed is a thermoplastic resin composition comprising a cross-copolymer which meets specific requirements; and a polyphenylene ether resin, wherein the cross-copolymer is contained in an amount of 5 to 95 mass % and the polyphenylene ether resin is contained in an amount of 95 to 5 mass %. The thermoplastic resin composition has excellent heat resistant, excellent softness, excellent flexibility, excellent stretching properties, and excellent scratch-abrasion resistance.
    Type: Grant
    Filed: April 14, 2009
    Date of Patent: June 11, 2013
    Assignee: Denki Kagaku Kogyo Kabushiki Kaisha
    Inventors: Toru Arai, Masaru Hasegawa, Akira Miyama, Kunihiko Konishi, Shigeru Suzuki
  • Patent number: 7923492
    Abstract: An inexpensive and durable polymer electrolyte composition exhibiting high ionic conductivity even in the absence of water or a solvent, characterized by comprising a molten salt and an aromatic polymer having a carbonyl bond and/or a sulfonyl bond in the main chain thereof and containing a cation exchange group. The aromatic polymer is preferably an aromatic polyether sulfone having a specific structural unit and containing a cation exchange group, an aromatic polyether ketone having a specific structural unit and containing a cation exchange group, or an aromatic polyether sulfone block copolymer and/or an aromatic polyether ketone block copolymer, the block copolymers comprising a hydrophilic segment containing a cation exchange group and a cation exchange group-free hydrophobic segment. The polymer electrolyte composition containing the block copolymer as an aromatic polymer exhibits high structural retention even in high temperatures.
    Type: Grant
    Filed: April 23, 2009
    Date of Patent: April 12, 2011
    Assignee: UBE Industries, Ltd.
    Inventors: Masayuki Kinouchi, Tetsuji Hirano, Nobuharu Hisano
  • Patent number: 7071266
    Abstract: A curable resin composition containing a polyfunctional cyanate ester resin and a bifunctional phenylene ether oligomer having a number average molecular weight of 500 to 3,000 and having a specific structure represented by the formula (1), and a cured product thereof.
    Type: Grant
    Filed: December 30, 2003
    Date of Patent: July 4, 2006
    Assignee: Mitsubishi Gas Chemical Company, Inc.
    Inventors: Kenji Ishii, Yasumasa Norisue, Daisuke Ohno, Michio Nawata
  • Patent number: 7037986
    Abstract: Disclosed herein is a high temperature composition comprising a polyarylene ether consisting essentially of plurality of structural units of the formula (I): wherein for each structural unit, each Q1 and Q2 are independently a halogen, a primary or secondary lower alkyl, a phenyl, a haloalkyl, an aminoalkyl, a hydrocarbonoxy, a halohydrocarbonoxy wherein at least two carbon atoms separate the halogen and oxygen atoms, and wherein the polyarylene ether has an intrinsic viscosity of less than or equal to about 0.15 deciliters per gram; a polyarylene sulfide; and glass fibers.
    Type: Grant
    Filed: November 22, 2004
    Date of Patent: May 2, 2006
    Assignee: General Electric Company
    Inventor: Bo Liu
  • Patent number: 7015285
    Abstract: This invention provides a composition and method for improving adhesion between a resinous thermoplastic substrate and polyurethane foam, said composition comprising at least one polyphenylene ether, at least one poly(alkenylaromatic) compound, and at least one carboxylic acid containing copolymer and optionally, further comprising at least one curing catalyst. Another embodiment of the invention provides articles derived from the composition of the present invention.
    Type: Grant
    Filed: December 18, 2002
    Date of Patent: March 21, 2006
    Assignee: General Electric
    Inventors: Vijay Mhetar, Ganesh Kannan
  • Patent number: 6894102
    Abstract: A syndiotactic polystyrene blend comprises syndiotactic polystyrene and poly(arylene ether) wherein the poly(arylene ether) has an intrinsic viscosity less than about 0.25 deciliters per gram (dl/g) when measured in chloroform at 25° C.
    Type: Grant
    Filed: May 20, 2002
    Date of Patent: May 17, 2005
    Assignee: General Electric
    Inventor: Glen David Merfeld
  • Patent number: 6875812
    Abstract: An object of the present invention is to provide an agent serving both as a compatibilizer and an impact strength-imparting agent, which is freed from layer separation phenomenon and capable of improving compatibility to a polyphenylene ether and/or a polyolefin without detriment to weld tensile strength and low temperature impact strength. Another object is to provide a resin composition, which is obtained by blending the agent serving both as a compatibilizer and an impact strength-imparting agent with other thermoplastic resin, and which is superior in its impact resistance, particularly impact strength at low temperature, heat resistance and processability.
    Type: Grant
    Filed: July 29, 2003
    Date of Patent: April 5, 2005
    Assignee: Asahi Kasei Kabushiki Kaisha
    Inventors: Yoshikuni Akiyama, Minoru Sakata, Goro Yamamoto
  • Patent number: 6849695
    Abstract: A resin composite covered piping material is provided having high heat resistance and excellent flame retardation property, anti-corrosion property, chemical resistance, insulation property and sufficiently high adhesion property with steel material and moreover, is highly economical. The piping material having a covering layer of a resin composite wherein said resin composite comprises: (A) 10 to 80 weight percent of polyphenylene ether resin, (B) 10 to 80 weight percent of polystyrene polymer possessing syndiotactic structure, and (C) 10 to 80 weight percent of polystyrene resin other than component (B) wherein the total of (A), (B) and (C) is 100 weight percent. The resin composite described above may further contain an impact resistance improving agent (D) in a quantity of 1 to 50 parts by weight, with respect to the total of 100 parts by weight of components (A), (B) and (C).
    Type: Grant
    Filed: December 13, 2002
    Date of Patent: February 1, 2005
    Assignee: General Electric Company
    Inventor: Sho Sato
  • Publication number: 20040214960
    Abstract: The present invention provides a welded article having improved weld line strength, said article comprising a resin composition wherein said resin composition comprises at least one polyphenylene ether, at least one poly(alkenylaromatic) compound and at least one polyalkyleneimine. In a preferred embodiment, the welded article has been manufactured using at least one of ultrasonic welding and vibration welding, e.g., linear friction welding and spin friction welding. In another preferred embodiment, the welded article has a peak weld line stress of at least 800 psi, preferably of at least 1000 psi.
    Type: Application
    Filed: April 22, 2003
    Publication date: October 28, 2004
    Applicant: General Electric Company
    Inventors: Ganesh Kannan, Vijay Mhetar
  • Patent number: 6693149
    Abstract: A process for preparing an epoxy group-containing curable polyphenylene ether (PPE) resin. The process involves introducing an epoxy group-containing functional group to the terminal end of PPE (Mn>3000) by modifying the hydroxy and ester groups on the terminal end. Thus, a curable PPE resin (Mn>3000) including an epoxy group on the terminal end can be obtained. The modified PPE resin contains epoxy groups and has high glass transition temperature.
    Type: Grant
    Filed: April 25, 2002
    Date of Patent: February 17, 2004
    Assignee: Industrial Technology Research Institute
    Inventors: Meng-Song Yin, Chien-Ting Lin, Hung-Chou Kang
  • Patent number: 6350514
    Abstract: Improved thermal stability and good adhesion to polyurethane foam are provided by polyphenylene ether thermoplastic blends containing a polystyrene and an aromatic amine. Preferred compositions additionally containing tackifier resins are described. These compositions are particularly useful for molding automobile interior parts.
    Type: Grant
    Filed: February 2, 2000
    Date of Patent: February 26, 2002
    Assignee: General Electric Co.
    Inventor: Robert Walter Venderbosch
  • Patent number: 6291593
    Abstract: A methacrylate ester or acrylate ester adhesive composition including a retarding additive to extend the open time and/or reduce the peak exotherm temperature. The retarding additive is selected from the group consisting of non-protonic Lewis acids and zinc salts and mixtures thereof.
    Type: Grant
    Filed: December 1, 1999
    Date of Patent: September 18, 2001
    Assignee: Loctite Corporation
    Inventor: Haitao Cheng
  • Patent number: 6258881
    Abstract: There is provided a polyphenylene ether resin composition comprising: a component (A) containing a polyphenylene ether resin; and a component (B) containing an organopolysiloxane comprising respective structure units represented by the following formulas (I), (II) and (III) R1R2SiO1.0  (I) R3SiO1.5  (II) R4R5R6SiO0.5  (III) wherein R1, R2 and R3 are independently of one another an alkyl group having 1 to 3 carbon atoms or an aryl group having 6 to 10 carbon atoms, and R4, R5 and R6 are independently of one another an alkyl group having 1 to 6 carbon atoms, an aryl group having 6 to 12 carbon atoms, an alkoxy group having 1 to 6 carbon atoms or a hydroxyl group; and wherein: (i) the component (B) is present in an amount of from about 0.5 to 100 parts by weight based on 100 parts by weight of the component (A); and (ii) the component (A) forms a continuous phase, and the component (B) forms a dispersed phase containing dispersed particles.
    Type: Grant
    Filed: October 5, 1999
    Date of Patent: July 10, 2001
    Assignee: Sumitomo Chemical Company, Limited
    Inventor: Satoru Moritomi
  • Patent number: 6225373
    Abstract: A composition comprising a thermoset resin which may or may not contain fluorine, bromine or both and containing at least one bromine-containing homo- or multicomponent thermoplastic polymer modifier optionally containing a different halogen which is soluble in the thermoset. Said thermoplastic polymer undergoes an in-situ phase separation process during cure to form a microphase-separated multiphase thermoset material.
    Type: Grant
    Filed: June 24, 1996
    Date of Patent: May 1, 2001
    Assignee: International Business Machines Corporation
    Inventors: Jeffrey Thomas Gotro, Jeffrey Curtis Hedrick, Konstantinos Papathomas, Niranjan Mohanlal Patel, Alfred Viehbeck, William Joseph
  • Patent number: 6203143
    Abstract: Disclosed is a composition which comprises (a) a polymer containing at least some monomer repeat units with photosensitivity-imparting substituents which enable crosslinking or chain extension of the polymer upon exposure to actinic radiation, said polymer being of the formula wherein x is an integer of 0 or 1, A is one of several specified groups, such as B is one of several specified groups, such as or mixtures thereof, and n is an integer representing the number of repeating monomer units, wherein said photosensitivity-imparting substituents are hydroxyalkyl groups; (b) at least one member selected from the group consisting of photoinitiators and sensitizers; and (c) an optional solvent. Also disclosed are processes for preparing the above polymers and methods of preparing thermal ink jet printheads containing the above polymers.
    Type: Grant
    Filed: September 23, 1998
    Date of Patent: March 20, 2001
    Assignee: Xerox Corporation
    Inventors: Ram S. Narang, Timothy J. Fuller
  • Patent number: 6117943
    Abstract: A blend of a polyarylene ether and a dispersible reactive solvent such as a thermoplastic polyurethane or a cyclopentadiene can be processed at temperatures below the oxidative degradation temperature of the polyarylene ether, yet form an article upon cooling that substantially retains the properties of the polyarylene ether.
    Type: Grant
    Filed: March 1, 1999
    Date of Patent: September 12, 2000
    Assignee: The Dow Chemical Company
    Inventors: Edward Louis d'Hooghe, Jeno Kurja
  • Patent number: 6093771
    Abstract: Thermoplastic molding compositions compriseA) from 5 to 97.9% by weight of a vinylaromatic polymer with syndiotactic structure,B) from 2 to 90% by weight of a low-viscosity polyamide with a viscosity number VN in the range from 50 to 150 ml/g andC) from 0.1 to 50% by weight of a polar-group-modified polyphenylene ether.
    Type: Grant
    Filed: September 21, 1998
    Date of Patent: July 25, 2000
    Assignee: BASF Aktiengesellschaft
    Inventors: Josef Wunsch, Martin Weber, Gunter Pipper, Alexander Gluck, Wilfried Vogel, Thomas Heitz, Stefan Grutke
  • Patent number: 6031049
    Abstract: Disclosed is a syndiotactic, polystyrenic resin composition comprising (A) 100 parts by weight of a component composed of (a) from 10 to 98% by weight of a styrene-based polymer having a syndiotactic configuration and (b) from 2 to 90% by weight of a polyolefin, (B) from 0.5 to 50 parts by weight of a block or graft styrene-olefin copolymer having a styrene content of from 40 to 85% by "weight, and (C) from 0.5 to 10.0 parts, relative to 100 parts by weight of component (a) of (A), of a polyphenylene ether. The ". composition can be formed into articles having good heat resistance, a high modulus of elasticity and good toughness. In addition, the articles are advantageous in that their surface layers are hardly peeled.
    Type: Grant
    Filed: April 13, 1998
    Date of Patent: February 29, 2000
    Assignee: Idemitsu Petrochemical Co., Ltd.
    Inventors: Shinji Chino, Akihiko Okada, Nobuyuki Satoh
  • Patent number: 6007877
    Abstract: Disclosed is a composition which comprises a polymer containing at least some monomer repeat units with water-solubility- or water-dispersability-imparting substituents and at least some monomer repeat units with photosensitivity-imparting substituents which enable crosslinking or chain extension of the polymer upon exposure to actinic radiation, said polymer being of the formula ##STR1## wherein x is an integer of 0 or 1, A is one of several specified groups, such as ##STR2## B is one of several specified groups, such as ##STR3## or mixtures thereof, and n is an integer representing the number of repeating monomer units. In one embodiment, a single functional group imparts both photosensitivity and water solubility or dispersability to the polymer. In another embodiment, a first functional group imparts photosensitivity to the polymer and a second functional group imparts water solubility or dispersability to the polymer.
    Type: Grant
    Filed: August 29, 1996
    Date of Patent: December 28, 1999
    Assignee: Xerox Corporation
    Inventors: Ram S. Narang, Timothy J. Fuller
  • Patent number: 5952417
    Abstract: The invention provides a composition for a platable resinous substrate having enhanced heat performance comprising: a thermoplastic mixture of at least one polyphenylene ether and at least one poly(alkenylaromatic) compound, at least one rubber compound, and at least one inorganic filler material.
    Type: Grant
    Filed: December 17, 1996
    Date of Patent: September 14, 1999
    Assignee: General Electric Co.
    Inventors: Herbert Shin-I Chao, Geoffrey Henry Riding, Carol Lynn Fasoldt
  • Patent number: 5939488
    Abstract: The subject invention provides reactive hot melt adhesive compositions comprising polyurethane prepolymers which have an isocyanate index greater than one and which are prepared from a low hydroxyl number composition comprising high molecular weight polyester diols which have a relatively low melting point. These reactive hot melt adhesive compositions have a faster setting speed than conventional reactive hot melt adhesive compositions. The subject invention also provides a method for bonding articles together which uses such reactive hot melt adhesive compositions and articles which comprise the reactive hot melt adhesive compositions.
    Type: Grant
    Filed: October 15, 1997
    Date of Patent: August 17, 1999
    Assignee: National Starch and Chemical Investment Holding Corporation
    Inventors: James W. Nowicki, Robert S. Wallach
  • Patent number: 5922815
    Abstract: The present invention provides an improved process for producing blends of tackifying resins and low molecular weight polyphenylene ether resins. This invention involves combining the resin solutions or redissolving one of the resins once isolated, in the other resin solution and isolation of the resin blend by devolatilization, precipitation, evaporation, spray drying, and/or stripping of the organic solvent.
    Type: Grant
    Filed: December 15, 1997
    Date of Patent: July 13, 1999
    Assignee: General Electric Company
    Inventors: David Frederick Aycock, Gary Gelvin, Marc G. Davidson
  • Patent number: 5910526
    Abstract: The specification discloses a polyphenylene oxide delivery system for use in preparing an A-B-A block copolymer adhesive formulation having an increased service temperature. The delivery system comprises a preblend of polyphenylene oxide (PPO) resin having a T.sub.g within the range of from about 150.degree. to about 210.degree. C. and a B-block compatible resin. The PPO/B-block resin preblend enables introduction of more PPO into the composition thereby increasing the service temperature of the adhesive formulation.
    Type: Grant
    Filed: September 14, 1998
    Date of Patent: June 8, 1999
    Assignee: Arizona Chemical Company
    Inventors: Wayne K. Chu, Erwin R. Ruckel
  • Patent number: 5859176
    Abstract: Disclosed is a polyamide resin composition comprising a melt-kneaded product of (A) a polyamide; (B) a polyphenylene ether; (C) a styrene polymer; and (D) a compound having in a molecule thereof a carbon-to-carbon double bond and at least one functional group selected from a carboxylic acid group, an acid anhydride group, an epoxy group, an amino group and a hydroxyl group, wherein the polyamide (A) is present as a continuous phase in which the polyphenylene ether (B) and the styrene polymer (C) are dispersed individually, independently or in mixture thereof to form a dispersion phase having an average particle diameter of 5 .mu.m or less, and wherein the (B)/(C) weight ratio is from 20/80 to 70/30, and the styrene polymer (C) in the melt-kneaded product has a reduced viscosity of 0.70 dl/g or more.
    Type: Grant
    Filed: March 10, 1997
    Date of Patent: January 12, 1999
    Assignee: Asahi Kasei Kogyo Kabushiki Kaisha
    Inventors: Jun-ichi Nakahashi, Mitsuhiro Horio, Kazuo Yoshida
  • Patent number: 5834537
    Abstract: The present invention relates to a curable thermosetting resin composition having enhanced fracture toughness as a results of the incorporation of reactive thermoplastic oligomers therein. More specifically, the present invention relates to a composition comprising a thermoset resin which contains fluorine and containing at least one fluorine containing thermoplastic homopolymer component which is soluble in the thermoset. Said thermoplastic polymer undergoes an in-situ phase separation process during cure to form a microphase separated multiphase thermoset material.
    Type: Grant
    Filed: June 24, 1996
    Date of Patent: November 10, 1998
    Assignee: IBM Corporation
    Inventors: Jeffrey Thomas Gotro, Jeffrey Curtis Hedrick, Konstantinos Papathomas, Niranjan Mohanlal Patel, Alfred Viehbeck, William Joseph
  • Patent number: 5834561
    Abstract: Thermoplastic resin compositions consisting of 1 to 40 wt % a polyether ester amide (A) and 99 to 60 wt % of at least one thermoplastic resin (B) selected from styrene based resins, further containing (C) 0.1-10% of a modified vinyl polymer containing carboxyl groups, area permanently antistatic, excellent in mechanical properties represented by impact resistance, heat resistance moldability and also in the appearance and gloss of the moldings, and suitable for housings of optical or magnetic recording media.
    Type: Grant
    Filed: November 20, 1995
    Date of Patent: November 10, 1998
    Assignee: Toray Industries, Inc.
    Inventors: Tadao Fukumoto, Masatoshi Iwamoto, Akihiko Kishimoto
  • Patent number: 5827907
    Abstract: A composition having enhanced fracture resistance comprising a heat curable reaction product of a fluorine-containing thermoset material and a fluorine-containing homopolymer, wherein the cured reaction product comprises the thermoset material having a plurality of discrete phases of said fluorine-containing homopolymer dispersed therein, the homopolymer phases being in the range of micron to submicron size.
    Type: Grant
    Filed: August 30, 1993
    Date of Patent: October 27, 1998
    Assignee: IBM Corporation
    Inventors: Jeffrey Thomas Gotro, Jeffrey Curtis Hedrick, Konstantinos Papathomas, Niranjan Mohanlal Patel, Alfred Viehbeck, William Joseph
  • Patent number: 5780548
    Abstract: Resin compositions are provided with improved compatibility between polyphenylene ether resin and thermoplastic polyester resin from which molded articles with high mechanical strength, especially impact resistance, can be obtained.
    Type: Grant
    Filed: November 6, 1996
    Date of Patent: July 14, 1998
    Assignee: General Electric Company
    Inventors: Akifumi Oshima, Hiromi Ishida, Toshihiko Shinohara
  • Patent number: 5710212
    Abstract: A thermoplastic resin composition includes 40-75 parts by weight of a polyamide resin (A), 5-30 parts by weight of a modified polyphenylene ether (B) which is a polyphenylene ether modified with an .beta., .beta.-unsaturated carboxylic acid or a derivative thereof, 1-30 parts by weight of an aromatic vinyl compound-aliphatic hydrocarbon copolymer (C), and 1-30 parts by weight of an ethylene-.alpha.-olefin copolymer (D) or a polypropylene resin (E) with the total amount of the components (A), (B), (C), and (D) or (E) being 100 parts by weight. The polyamide resin (A) is present as a matrix phase and the other components (B), (C), and (D) or (E) are present as a disperse phase consisting of core-shell structure grains, in each of which grains the modified polyphenylene ether (B) forms a shell phase, the aromatic vinyl compound-aliphatic hydrocarbon copolymer (C) forms an intermediate phase and the ethylene-.alpha.-olefin copolymer(D) or the polypropylene resin (E) forms a core phase.
    Type: Grant
    Filed: June 27, 1996
    Date of Patent: January 20, 1998
    Assignee: Ube Industries, Ltd.
    Inventors: Yukihiko Asano, Kazuhiro Doi
  • Patent number: 5587427
    Abstract: A resin composition prepared by melting and kneading (A) a thermoplastic resin comprising a polyolefin resin together with (B) a functional compound having one or more bond(s) or one or more functional group(s) selected from the group consisting of non-aromatic carbon-carbon multiple bonds, oxirane groups and substituted carboxyl groups, and subsequently mixing thereinto (C) a polar compound having in one molecule one or more polar group(s) selected from the group consisting of substituted carboxyl groups, substituted hydroxyl groups, substituted amino groups, substituted mercapto groups, substituted sulfonic acid groups, oxazoline groups, isocyanato groups and oxirane groups, provided that at least one of the polar groups of (C) is different from at least one of the functional groups of the functional compound (B), as well as a process for producing said resin composition.
    Type: Grant
    Filed: June 2, 1995
    Date of Patent: December 24, 1996
    Assignee: Sumitomo Chemical Company, Limited
    Inventors: Hiroomi Abe, Kenji Nagaoka, Takashi Sanada
  • Patent number: 5583179
    Abstract: Compatible blends of poly(phenylene ether) resins and polyester resins are provided comprising electrophile-containing poly(phenylene ether) resins, polyester resins and an impact modifier mixture comprising a functionalized polyolefin-based resin and an elastomeric block copolymer to afford articles having good impact, ductility and tensile properties. The compositions may further comprise reinforcing agents, flame retardants, and flow promoters. Articles made from the compositions are useful for automotive components.
    Type: Grant
    Filed: June 7, 1995
    Date of Patent: December 10, 1996
    Assignee: General Electric Company
    Inventors: Chorng-Fure R. Hwang, James J. Scobbo, Jr., John B. Yates
  • Patent number: 5559186
    Abstract: A thermoplastic resin composition having excellent appearance and moldability contains:(A) 1 to 99% by weight of a polyphenylene ether resin,(B) 99 to 1% by weight of a polystyrene resin prepared by copolymerization of: (i) a styrene compound, 100 to 500 ppm by weight of a compound containing 2-6 vinyl groups, and if necessary, a compound capable of copolymerizing with the styrene compound, or (ii) a polystyrene resin obtained by copolymerization of a styrene compound, 100 to 500 ppm by weight of a compound containing 2-6 vinyl groups, a first rubber, and if necessary, a compound capable of copolymerizing with said styrene compound, or a mixture of (i) and (ii). Component (C) is a second rubber which can be present in amounts of about 0 to 100 parts by weight relative to (A) and (B).
    Type: Grant
    Filed: March 29, 1995
    Date of Patent: September 24, 1996
    Assignee: Sumitomo Chemical Company, Limited
    Inventors: Takeshi Fujii, Yasuro Suzuki, Hayato Kihara, Takashi Anbo
  • Patent number: 5554677
    Abstract: A blow-molded article made from a polyphenylene ether/polyamide composition reinforced with glass fibers is provided. The article is excellent in mechanical properties and blow moldability. The composition comprises a mixture consisting of (A) 10-65 parts by weight of a polyphenylene ether and (B) 90-35 parts by weight of a polyamide and, on the basis of 100 parts by weight of said mixture, (C) 10-100 parts by weight of a glass fiber, (D) 1-35 parts by weight of a polyolefin and (E) 0.01-10 parts by weight of an unsaturated polar monomer compound having in its molecule both (a) carbon-carbon double bond or carbon-carbon triple bond and (b) carboxyl group, acid anhydride group, amino group, acid amide group, imide group, epoxy group, carboxylic acid ester group, isocyanate group, methylol group or hydroxyl group as a compatibilizing agent, amounts of (C), (D) and (E) being based on 100 parts by weight of [(A)+(B)].
    Type: Grant
    Filed: March 7, 1995
    Date of Patent: September 10, 1996
    Assignee: Sumitomo Chemical Company, Limited
    Inventors: Kenji Nagaoka, Hiroshi Hagimori, Kaoru Kitadono
  • Patent number: 5539062
    Abstract: Compositions are provided for comprising a compatibilizing PPE and a naphthalate-type polyester resin wherein the compositions have a drop in the elastic modulus occurring at least about 15.degree. C. higher than the corresponding blend wherein the polyester does not contain a substantial portion of naphthalate moieties. The compositions can further comprise impact modifiers, reinforcing agents, fillers, stabilizers, antistatic agents, plasticizers, lubricants, and other additives to provide compositions with enhanced physical properties. Articles molded from these compositions are useful in the automotive industry.
    Type: Grant
    Filed: June 7, 1995
    Date of Patent: July 23, 1996
    Assignee: General Electric Company
    Inventors: Sterling B. Brown, Chorng-Fure R. Hwang, Steven T. Rice, James J. Scobbo, Jr., John B. Yates
  • Patent number: 5506305
    Abstract: Disclosed is a thermoplastic resin composition comprising a polyphenylene ether and a polyamide and excellent in impact strength wherein an impact strength modifier having structure A--B--A (A or B is styrene) is partially dispersed in said polyphenylene ether and has layered or spherical structure of about 0.02-0.07 .mu.m.A process for producing the thermoplastic resin composition is also disclosed which comprises (1) previously melt kneading (i) at least one compatibilizing agent in an amount effective for compatibilization and (ii) a polyphenylene ether, and then (2) adding (iii) a polyamide in an amount necessary for formation of continuous phase and (iv) an impact strength modifier having structure A--B--A (A or B is styrene) and melt kneading the mixture at a maximum shear rate of 700 sec.sup.-1 or more.
    Type: Grant
    Filed: December 1, 1993
    Date of Patent: April 9, 1996
    Assignee: Sumitomo Chemical Company Limited
    Inventors: Kenji Nagaoka, Takashi Sanada, Yasuhito Ijichi
  • Patent number: 5504165
    Abstract: Thermoplastic resin compositions comprising in admixture a poly(phenylene ether) resin and a poly(arylene sulfide) resin are provided. The poly(phenylene ether) resin comprises an ortho ester moiety which enhances the compatibility and mechanical properties of the composition. The compositions may optionally comprise impact modifiers and other additives. The compositions are useful for making molded articles.
    Type: Grant
    Filed: March 17, 1995
    Date of Patent: April 2, 1996
    Assignee: General Electric Company
    Inventors: Sterling B. Brown, Chorng-Fure R. Hwang, Farid F. Khouri, Steven T. Rice, James J. Scobbo, Jr., John B. Yates, III
  • Patent number: 5496885
    Abstract: There are disclosed a thermoplastic resin composition which comprises(a) 4 to 95% by weight of a polyphenylene ether,(b) 95 to 4% by weight of a saturated polyester,(c) 0.5 to 40% by weight of an impact modifier and(d) 0.01 to 50% by weight of a compatibilizer and(e) 0.1 to 3 parts by weight of a polycarbonate based on 100 parts by weight of the above (a) to (d) in total; and a process for preparing a thermoplastic resin composition which comprises the steps of melting and kneading(a) 50 to 95% by weight of a polyphenylene ether,(e) 0.
    Type: Grant
    Filed: May 27, 1993
    Date of Patent: March 5, 1996
    Assignee: Mitsubishi Chemical Corporation
    Inventors: Kiyoji Takagi, Koji Nishida, Tosio Itou
  • Patent number: 5475054
    Abstract: A resin composition comprising (A) a polyphenylene ether resin, (B) a polyolefin resin, and optionally (C) an elastomer, and (D) an aliphatic polycarboxylic acid derivative represented by the following general formula:(R.sub.1 O).sub.m R(COOR.sub.2).sub.n (CORN.sub.3 R.sub.4).sub.swherein R represents a saturated hydrocarbon group having 2 to 20 carbon atoms with a linear or branched chain; R.sub.1 represents a hydrogen atom or an alkyl, aryl, acyl or carbonyldioxy group having 1 to 10 carbon atoms; each R.sub.2 represents a hydrogen atom or an alkyl or aryl group having 1 to 20 carbon atoms; R.sub.3 and R.sub.4 each represents a hydrogen atom or an alkyl or aryl group having 1 to 10 carbon atoms; m represents a number equal to 1 or 2; (n+s) is larger than or equal to 2 and, n and s are each larger than or equal to 0; (OR.sub.1) is in an alpha or beta position with respect to a carbonyl group, and in which at least two carbonyl groups are separated by 2 to 6 carbon atoms.
    Type: Grant
    Filed: September 28, 1994
    Date of Patent: December 12, 1995
    Assignee: Sumitomo Chemical Company, Limited
    Inventors: Hiroomi Abe, Kenji Nagaoka, Takashi Sanada
  • Patent number: 5434220
    Abstract: A polyphenylene ether resin composition containing (A) 100 parts by weight of a polyphenylene-ether-base resin composed of 100-60 wt. % of a polyphenylene ether resin and 0-40 wt. % of a polystyrene resin and (B) 1-40 parts by weight of a dicarboxylic acid ester copolymer obtained from a vinyl monomer and an unsaturated dicarboxylic acid ester as copolymerizable components. The dicarboxylic acid ester copolymer has a weight average molecular weight not greater than 60,000. The polyphenylene ether resin composition, if necessary, can further comprise (C) 1-40 parts by weight of conductive carbon or an A-B-A' type or A-B'-B" type block copolymer elastomer. Owing to its excellent mechanical properties, heat resistance and moldability, the resin composition is useful in the fields of automotive vehicles, home electronic or electric appliances and industrial parts or components.
    Type: Grant
    Filed: August 10, 1994
    Date of Patent: July 18, 1995
    Assignee: Mitsui Toatsu Chemicals, Incorporated
    Inventors: Masaji Yoshimura, Kazuharu Kanezaki, Takashi Satoh, Tomoyuki Nakata, Minoru Takiguchi
  • Patent number: 5428091
    Abstract: A thermoplastic resin composition which comprises 100 parts by weight of a composition comprising 95-5 % by weight of at least one polyolefinresin (A) selected from homopolymers of ethylene or .alpha.-olefin or copolymers thereof and these homopolymers or copolymers modified with a polyfunctional compound (E) and/or an unsaturated monomer (L) and 5-95 % by weight of at least one polyphenylene-ether-resin (B) selected from polyphenylene ether, modified polyphenylene ether with the above (E) and/or (L) and a composition comprising the polyphenylene or modified polyphenylene ether and an aromatic vinyl polymer resin (M) and 0.001-10 parts by weight of a dinitrodiamine (D) of the following formula (I). ##STR1## (wherein X represents a divalent chain aliphatic group, a cyclic aliphatic group or an aromatic group which may contain a halogen or an oxygen atom, R.sup.1 represents a hydrogen atom, a chain aliphatic group, a cyclic aliphatic group or an aromatic group and when both of X and R.sup.
    Type: Grant
    Filed: December 22, 1993
    Date of Patent: June 27, 1995
    Assignee: Sumitomo Chemical Co., Ltd.
    Inventors: Hiroomi Abe, Takeshi Fujii, Masashi Yamamoto, Shinichi Yachigo, Hideo Nagasaki, Naoki Inui
  • Patent number: 5424360
    Abstract: A thermoplastic resin composition having a good balance among rigidity, impact strength and adhesion of coating is provided, which comprises:a total of 100 parts by weight of (a)-(c) wherein (a) is 1-60% by weight of a polyphenylene ether, (b) 0-60% by weight of an alkenyl aromatic resin excluding unhydrogenated alkenyl aromatic block copolymer of tile following component (e) and (c) 40-99% by weight of a polyamide,(d) 1-50 parts by weight of a polyolefin having a modulus of 10000 kg/cm2 or more at room temperature,(e) 1-50 parts by weight of an unhydrogenated alkenyl aromatic block copolymer, and(f) a compatibilizing agent in an amount necessary to improve compatibility of the above components (a) and (c), said (d)-(f) being every 100 parts by weight of (a)-(c), and wherein the thermoplastic resin composition is obtained by melt kneading firstly said (a), (d) and (f) and then secondly said (c) therewith.
    Type: Grant
    Filed: January 19, 1994
    Date of Patent: June 13, 1995
    Assignee: Sumitomo Chemical Company, Limited
    Inventors: Kenji Nagaoka, Hiroshi Hagimori, Takashi Sanada
  • Patent number: 5418291
    Abstract: A resin composition comprising(a) a polyphenylene ether resin or a mixture of it and a polystyrene resin,(b) a co-oligomer of ethylene and an alpha-olefin,(c) optionally an elastomeric hydrogenated A-B-A block copolymer, and(d) optionally an elastomeric hydrogenated A-B block copolymer.The chemical resistance of the polyphenylene ether is improved.
    Type: Grant
    Filed: January 18, 1994
    Date of Patent: May 23, 1995
    Assignee: Mitsubishi Gas Chemical Company, Inc.
    Inventors: Hideo Uno, Hiroshi Murayama, Yasumasa Norisue, Ryu Iwasaki
  • Patent number: 5418287
    Abstract: A resin composition comprising the following component A, component B and component C:component A of polyphenylene ether resin; component B of crystalline polyolefin resin; and component C of graft modified copolymer in which an unsaturated copolymer consisting of ethylene or at least one of .alpha.-olefins having 3 to 12 carbon atoms and at least one of chain nonconjugated dienes of the following general formula is modified with a monomer capable of radical polymerization such as styrene. ##STR1## This resin composition has an improved impact strength, keeping heat resistance and mechanical strength characteristic of polyphenylene ether resins, and molding properties and resistance to organic solvents characteristic of polyolefin resins.
    Type: Grant
    Filed: January 10, 1994
    Date of Patent: May 23, 1995
    Assignee: Mitsubishi Petrochemical Company, Ltd.
    Inventors: Tomohiko Tanaka, Hiroshi Nakano, Hiroyuki Satoh, Shiroh Gotoh
  • Patent number: 5405902
    Abstract: A novel thermoplastic resin composition excellent in heat resistance, mechanical properties and processability is provided which comprises a composition containing (A) a dispersing phase of polyphenylene ether obtained by oxidation polymerization of at least one phenol compound represented by the formula: ##STR1## wherein R.sub.1, R.sub.2, R.sub.3, R.sub.4 and R.sub.5 each represents a hydrogen atom, a halogen atom or a substituted or unsubstituted hydrocarbon residue and at least one of them is a hydrogen atom and (B) a crystalline thermoplastic resin matrix phase and (C) a mutual compatibilizer compatible with (A) and/or (B), an average particle diameter in said dispersing phase having of 0.01-10.mu..
    Type: Grant
    Filed: December 15, 1993
    Date of Patent: April 11, 1995
    Assignee: Sumitomo Chemical Company, Ltd.
    Inventors: Taichi Nishio, Takashi Sanada, Satoru Hosoda, Kenji Kagaoka, Takayuki Okada
  • Patent number: 5403888
    Abstract: A novel thermoplastic resin composition excellent in heat resistance, mechanical properties and processability is provided which comprises a composition containing (A) a dispersing phase of polyphenylene ether obtained by oxidation polymerization of at least one phenol compound represented by the formula: ##STR1## wherein R.sub.1, R.sub.2, R.sub.3, R.sub.4 and R.sub.5 each represents a hydrogen atom, a halogen atom or a substituted or unsubstituted hydrocarbon residue and at least one of them is a hydrogen atom and (B) a crystalline thermoplastic resin matrix phase and (C) a mutual compatibilizer compatible with (A) and/or (B) , an average particle diameter in said dispersing phase having of 0.01-10 .mu..
    Type: Grant
    Filed: February 23, 1993
    Date of Patent: April 4, 1995
    Assignee: Sumitomo Chemical Company, Ltd.
    Inventors: Taichi Nishio, Takashi Sanada, Satoru Hosoda, Kenji Nagaoka, Takayuki Okada
  • Patent number: 5399610
    Abstract: The present invention relates to a readily molded engineering plastic composition comprising:polyphenylene ether polymer; optionallya second polymer chosen from polyesters, polyamides and polycarbonates; andabout 0.05 to about 5 weight percent hydrogenated poly (alpha-olefin) fluid.
    Type: Grant
    Filed: March 18, 1993
    Date of Patent: March 21, 1995
    Assignee: General Electric Company
    Inventors: John B. Yates, Alexandros Hasson
  • Patent number: RE35695
    Abstract: Disclosed is a stabilized polyphenylene ether resin which comprises a plurality of polyphenylene ether chains, which chains collectively contain terminal 6-chroman groups in an amount of at least 0.01 in terms of the number of the terminal 6-chroman groups per 100 polyphenylene ether units in the resin. This polyphenylene ether resin has excellent resistance to thermal oxidation. A composition comprising this stabilized polyphenylene ether resin and a polystyrene resin has not only high resistance to thermal oxidation but also excellent moldability.
    Type: Grant
    Filed: October 26, 1994
    Date of Patent: December 16, 1997
    Assignee: Asahi Kasei Kogyo Kabushiki Kaisha
    Inventors: Akihiro Kanayama, Sumio Ueda, deceased, Yoshiko Ueda, heiress, Sadao Ibe