Abstract: A resin composition comprising a resin composition comprising 5 to 95% by weight of a polyphenylene oxide and 95 to 5% by weight of a polyamide and 0.01 to 30 parts by weight of a member selected from the group consisting of (A) liquid diene polymers, (B) epoxy compounds and (C) compounds having in the molecule both of (a) an ethylenic carbon-carbon double bond or a carbon-carbon triple bond and (b) a carboxylic acid, acid anhydride, acid amide, imido, carboxylic acid ester, amino or hydroxyl group per 100 parts by weight of the total of the polyphenylene oxide and polyamide.

Abstract: A strand prepreg which comprises (i) a resin composition comprising 100 parts by weight of thermosetting resin having a softening point of 60.degree. C. or less and about 5 to 60 parts by weight of epoxy resin having a number average molecular weight of 5,000 or more and (ii) about 20 to 80% by volume strands of carbon fibers, glass fibers, aromatic polyamide fibers and the like, wherein the strands are impregnated with the resin composition.

Abstract: A semipermeable membrane composed of a water-insoluble, cross-linked, membrane-forming polymer (hereinafter referred to as "polymer (II)") which is obtained by partially converting the hydroxyl groups of a polymer represented by the following formula (hereinafter referred to as "polymer (I)"): ##STR1## wherein R and R' are halogen, nitro, methyl or ethyl,X stands for a divalent group selected from methylene, ethylene, isopropylidene, ether (--O--), carbonyl (--CO--), sulfide (--S--), sulfoxide (--SO--) and sulfone (--SO.sub.2 --),l and m are integers of from 0 to 4, p is 0 or 1, andn is an integer of from 100 to 1000,to sulfuric acid groups or alkali metal, ammonium or nitrogen-containing basic organic compound salts thereof, and then cross-linking the "polymer (II)".

Abstract: The thermosetting heat bondable lacquer comprises a solution of a thermosetting mixture of various resins in a solvent or mixture of solvents which boils at a temperature in the range of 50.degree. to 230.degree. C., preferably 130.degree. to 210.degree. C. The thermosetting mixture consists of a polyhydantoin resin, a polyhydroxy polyether or phenoxy resin and a polyurethane resin, each of which must have a pre-determined structure and a pre-determined specific viscosity. The composition of the thermosetting mixture must be within the hatched area in FIG. 1.The thermosetting heat bondable lacquer can be obtained by mixing solutions of the three resin components and can contain auxiliaries and additives and/or catalysts. If the solvent or mixture of solvents is removed from the heat bondable lacquer, e.g.

Abstract: A heat resistant resin composition comprises 100 wt. parts of a mixture [I] and 0 to 10 wt. parts of a phenoxy resin [II] wherein the mixture [I] comprises 80 to 5 wt. parts of (a) a mixture of 0 to 95 wt. parts of the first maleimide compound obtained by reacting an aromatic amine with maleic anhydride and/or a maleic anhydride derivative and 100 to 5 wt. parts of the second maleimide obtained by reacting an aromatic amine with a cyclic acid anhydride having no unsaturated double bond and maleic anhydride and/or a maleic anhydride derivative and 20 to 95 wt. parts of (b) and epoxy resin.

Abstract: An epoxy resin composition for flexible products having excellent electrical and mechanical characteristics and having long pot-life is provided by incorporating (A) a liquid epoxy compound having 2 or more epoxy groups in one molecule, (B) an acid anhydride type hardener and (C) a reaction product obtained by reacting a phenoxy resin or a high molecular weight epoxy resin with a monohydric alcohol glycidyl ether and a metal salt of carboxylic acid.