Abstract: The present invention provides a polyimide resin composition comprising:(a) a polyamide resin comprising a repeating unit represented by the general formula (1): ##STR1## wherein X represents a tetravalent organic group represented by the formula (2): ##STR2## Y represents a divalent organic group comprising a divalent siloxane residual group represented by the formula (3): ##STR3## wherein m is an integer of 60 to 120; and a divalent aromatic group represented by the formula (4): ##STR4## wherein R.sup.1 represents a hydrogen atom or a fluorine atom; and (B) cyclohexanone. From this composition, polyimide resin films can be obtained by heating at a lower temperature for a short time, and the films obtained show good adhesion under moisture-resistant conditions.

Abstract: Thermomechanical and thermo-oxidative stabilities in resin composites across the range of aerospace "engineering thermoplastic" resins are improved by forming four crosslinks at each addition polymerization site in the backbone of the resin using crosslinking functionalities of the general formula: ##STR1## in the oligomers, wherein Z= ##STR2## .beta.=the residue an organic radical selected from the group consisting of: ##STR3## --O--.O slashed.--COOH, --O--.O slashed.--COX, --X, --O.paren open-st.(R.sub.8 .paren close-st.OH, ##STR4## --O--.O slashed.--NH.sub.2 ; E= ##STR5## R.sub.8 =a divalent organic radical; X=halogen;Me=methylT=allyl or methallyl.G=--CH.sub.2 --, --S--, --CO--, --SO--, --O--, --CHR.sub.3 --, or --C(R.sub.3).sub.2 --;i=1 or 2;R.sub.3 =hydrogen, lower alkyl, lower alkoxy, aryl, or aryloxy; and.THETA.=--C.tbd.N; --O--C.tbd.N, --S--C.tbd.N, or --CR.sub.3 .dbd.C(R.sub.3).sub.2.

Abstract: The invention relates to a PMR type resin which comprises a mixture of:(a) nadic acid of Formula (Ia) or a derivative thereof ##STR1## (b) a diaminobisimide of Formula (Ib) ##STR2## (c) an aromatic tetracarboxylic acid of Formula (Ic) or a derivative thereof ##STR3## the components (a), (b) and (c) being present in the approximate molar proportions of 2:n:n-1 respectively.

Abstract: Novel thermoset polyimide and composite materials comprising the thermoset polyimides and a fibrous reinforcement are prepared according to this invention. The thermoset polyimides are obtained by heat-treating a linear polyamic acid or a linear polyimide prepared by using 4,4'-bis(3-aminophenoxy)biphenyl and pyromellitic dianhydride as essential monomers or by adding 4,4'-diaminodiphenyl ether or 3,3',4,4'-biphenyltetracarboxylic dianhydride to the essential monomers and by end-capping the molecular chain end with an aromatic dicarboxylic anhydride having a carbon-carbon triple bond. The thermoset polyimides have essential excellent properties of thermoplastic polyimide and additionally has enhanced heat resistance and improved mechanical properties. The thermoset polyimide can be used to provide various kinds of composite materials for aircraft matrices, electric and electronic appliances and others.

Abstract: Poly(ester-imides) containing t-butylhydroquinone and trimellitic anhydride as part of the repeat units, as well as other monomers, are useful as molding resins. The polymers have a high glass transition temperature and are particularly useful in applications requiring good wear resistance.

Abstract: High performance polyester sulfone oligomers are prepared for aerospace applications by condensing mono- or difunctional crosslinkable end caps (i.e. unsaturated hydrocarbons having one or two crosslinking sites) with dicarboxylic acid halides and dialcobols (i.e. diols). Multidimensional oligomers have an aromatic hub from which the polyester chains radiate. Blends of the linear and multidimensional oligomers can be made using compatible, non-crosslinking polymers. Prepregs and composites are formed from the oligomers or blends.

Abstract: Novel polyimides which are soluble in various organic solvents and excellent in thermal resistance, processability are disclosed. The polyimides comprise repeating units represented by the following formula (1) and/or (2) and having a number average molecular weight of 4,000-200,000. ##STR1## wherein Ar is a divalent group represented by the following formula (2) or (3): ##STR2## wherein Y is --O--, --CO--, --S--, --SO.sub.2 -- or --C(CH.sub.3).sub.2 --, ##STR3## wherein R.sup.1, R.sup.2, R.sup.3 and R.sup.4 are each a C.sub.1-4 alkyl group or a C.sub.1-4 alkoxy group, Ra is a divalent group having 2-6 benzene rings, X.sup.1 represents NH, NR (wherein R is a C.sub.1-4 alkyl group or a C.sub.1-4 alkoxy group) or S, Rb is C.sub.2-20 alkylene group, ether group or dimethylsiloxane group, and X.sub.2 represents NH, NR (wherein R is a C.sub.1-4 alkyl group or a C.sub.

Abstract: The present method provides a method for preparing the PI varnish which has the steps of: 1) preparing a mixed solution of 60-100% by weight aprotic solvent, and 0-40% by weight aromatic solvent; 2) adding into the mixed solution in a mole ratio of 1:9 two aromatic diamines; and 3) further adding in the mixed solution in a mole ratio of 1:5 two aromatic dianhydrides. Such PI has a suitable thermal expansion coefficient and characteristics different form those of the PI currently in use.

Abstract: The invention relates to a liquid crystal orientation film having a specific polymer, the main chain of the polymer formed of urea bonds and imide bonds, and a liquid crystal display element incorporating the film. The liquid crystal orientation film does not require high temperature heat treatment when prepared, allowing treatment below about 150.degree. C. Hence, the production of a liquid crystal display element using the liquid crystal orientation film is simplified. Furthermore, other element materials are protected, and the substrate used can be a plastic substrate lower in heat resistance than glass. Moreover, the liquid crystal orientation film is excellent in such properties as liquid crystal orienting capability, heat resistance, transparency, strength and adhesion to the substrate, and has an especially large and stable pre-tilt angle.

Abstract: A poly(imide amic ester) having repeating unit of formula (I) and a process for the preparation thereof are provided, wherein formula (I) has the structure ##STR1## wherein Ar is, ##STR2## Ar' is, ##STR3## Ar" is ##STR4## R is selected from the group consisting of CH.sub.3, CH.sub.2 CH.sub.3, CH(CH.sub.3).sub.2, CH.sub.2 CH.sub.2 CH.sub.3, CH.sub.2 (CH(CH.sub.3).sub.2 and C(CH.sub.3).sub.3. Further, processes for the preparation of polyimide, polyimide film and polyimide fiber using the above poly(imide amic ester) are provided.

Abstract: A sulfonated dicarboxylic acid and a diaromatic carbonate are reacted by a solution process to form a sulfonated aromatic diester such as dipbenyl sodium 5-sulfoisophthalate. The sulfonated aromatic diester is reacted with an aromatic polymer precursor mixture such as bisphenol A and diphenyl carbonate, polymer or combination thereof, at a temperature above the melting point of the polymer or a member of the aromatic polymer precursor to form a randomly positioned sulfonated aromatic moiety in a polymer chain of a thermoplastic non-crosslinked aromatic polymer such as a linear polycarbonate.

Abstract: A polyimide alignment film based on pyromellitic dianhydride and a 2,2'-bis(perfluoroalkoxy)benzidine, as major components, for use in liquid crystal display devices.

Abstract: A photosensitive resin composition comprising, as its main ingredient, a poly(amic acid) resin constituted of a diamino compound represented by formula: ##STR1## and optionally used other diamino compound and a tetracarboxylic acid dianhydride as its constituent monomers and/or a poly(amic acid) ester resin obtained by esterifying said poly(amic acid) resin and/or a polyimide resin obtained by a dehydrating or alcohol-eliminating ring-closure reaction of said poly(amic acid) resin or poly(amic acid) ester resin has an excellent developability and a high film strength and can form a relief patter of low thermal expansion.

Abstract: The invention provides novel thermoplastic polyimide featuring solid adhesive property under low temperature, low hygroscopic coefficient, and solid resistivity to radioactive rays. The invention also provides novel polyamide acid which is substantially precursor of the thermoplastic polyimide, and also provides novel thermally fusible laminated film for covering conductive wires, featuring solid adhesive property under low temperature, solid resistivity to radioactive rays, and distinct suitability for covering superconductive wires in particular.The novel thermoplastic polyimide is represented by general formula (1) corresponding to the chemical structure shown below; ##STR1## wherein, Ar.sub.1, Ar.sub.2, Ar.sub.4, and Ar.sub.6, respectively designate divalent organic radical, whereas Ar.sub.3 and Ar.sub.

Abstract: Disclosed are polymers and copolymers containing at least one repeating unit of the formula ##STR1## in which X is O or NH; R is a single bond or a hydrocarbon chain; R' is a hydrocarbon chain containing one or two carbon atoms, and P is the residue of an oligomer HX--P--XH whose solution viscosity determined in meta-cresol at 30.degree. C. at concentrations of 0.5 g/dl is lower than 0.50 dl/g.sup.-1. Also disclosed is a process for obtaining the polymers and copolymers.

Abstract: A diaminobenzene derivative of the formula (I): ##STR1## wherein each of P and Q which may be the same or different from each other, is a single bond, or a bivalent organic group selected from the group consisting of --O--, --COO-- and --CONH--, R.sub.1 is a C.sub.2-22 straight chain alkylene group, and R.sub.2 is a cyclic group selected from the group consisting of an aromatic ring, an aliphatic ring, a heterocyclic ring and substituted forms of such rings.

Abstract: We achieve solvent resistance and extended use life for advanced polyimides by including at least some solvent-resistant linkages in the backbone in place of phenoxyphenyl sulfone linkages and using diPEPA or PEPA crosslinking end caps.

Abstract: A process for producing a photosensitive resin, comprises reacting a diamine with a tetracarboxylic acid tetraester represented by the formula (1) at a temperature of 0.degree. to 50.degree. C. in an aprotic polar solvent: ##STR1## wherein R.sub.1 is a tetravalent organic group; R.sub.2 is a group represented by the formula: ##STR2## in which R.sub.5 is a divalent to hexavalent organic group, R.sub.6 is H or CH.sub.3 and p is an integer of 1 to 5; R.sub.3 is a group represented by --OCH.sub.3, --OC.sub.2 H.sub.5, --OC.sub.3 H.sub.7 or the formula: ##STR3## and R.sub.4 is a group of the formula: ##STR4## the tetracarboxylic acid tetraester of the formula (1) is obtained by subjecting to addition reaction a tetracarboxylic dianhydride, an alcohol compound represented by the formula R.sub.2 H in which R.sub.2 is as defined above and an alcohol compound represented by the formula R.sub.3 H in which R.sub.

Abstract: Polyimide copolymers were prepared by reacting different ratios of 3,4'-oxydianiline (ODA) and 1,3-bis(3-aminophenoxy)benzene (APB) with 3,3',4,4'-biphenylcarboxylic dianhydride (BPDA), and terminating with an effective amount of a reactive endcapper. The reactive endcappers employed include 4-phenylethynyl phthalic anhydride (PEPA), 3-aminophenoxy-4'-phenylethynylbenzophenone (3-APEB), maleic anhydride (MA) and nadic anhydride (5-norbornene-2,3-dicarboxylic anhydride) (NA). Within a relatively narrow ratio of diamines, from .sup..about. 50% ODA/50% APB to .sup..about. 95% ODA/5% APB, the copolyimides prepared with BPDA and terminated with reactive endgroups have a unique combination of properties that make them very attractive for a number of applications. This unique combination of properties includes low pressure processing (200 psi and below), long term melt stability (several hours at 300.degree. C.

Abstract: In accordance with the present invention, there are provided blow molded articles which are composed of specific copolyesters or specific polyester resin compositions and which are highly oriented so that the stretch index as defined by the following equations becomes not less than 130 cm. ##EQU1## The blow molded articles thus provided are excellent in transparency and also excellent in moldability and gas barrier properties and, moreover, excellent also in economical efficiency.

Abstract: A process for preparing a tough, soluble, aromatic, thermoplastic copolyimide is provided. The process comprises the steps of (a) providing 4,4'-oxydiphthalic anhydride to 3,4,3',4'-biphenyltetracarboxylic dianhydride at a mole ratio ranging from about 25 mole percent to 75 mole percent to 75 mole percent to about 25 mole percent; (b) adding 3,4'-oxydianiline to form a mixture; c) adding a polar aprotic or polar protic solvent to the mixture to form a solution having a percentage of solids capable of maintaining polymer solubility; (d) stirring the solution to allow it to react; (e) adding an azeotropic solvent to the solution and heating to remove water; (f) cooling the solution of step (e) to room temperature and recovering the tough, soluble, aromatic, thermoplastic copolyimide.

Abstract: Polyamide esters which can be prepared from tetracarboxylic dianhydrides and can be converted into polyimides by alcohol cleavage with cyclization, characterized in that the radicals OR of the ester groups --COOR which are substituted during the polyimide formation are alkoxy radicals having 2 to 5 C atoms which are monosubstituted or polysubstituted by fluorine.Polyimides prepared therefrom are suitable as orientation layers in liquid-crystal display elements and in optical wave guides.

Abstract: Wholly aromatic polyamides and their shaped articles containing at least 85 mole percent of repeat units of m-phenylene isophthalamide: ##STR1## and repeat units of selected aromatic diamines and diacid chlorides exhibit improved flame resistance while retaining good thermal stability.

Abstract: A thermoplastic polyimide film comprising a thermoplastic polyimide polymer, a polyimide laminate, respectively being suited for use as cover-lay adhesive agent and a cover-lay film capable of exerting distinguished thermal resistant property, processability and adhesion property useful for the manufacture of flexible printed circuit boards, and yet, suited for use as the adhesive-agent layers of flexible copper-coated laminates and bilateral adhesive sheets; and a method of manufacturing the polyimide laminate. The thermoplastic polyimide polymer represented by the general formula (1) specified below: ##STR1## wherein Ar.sub.1, Ar.sub.2, Ar.sub.4 and Ar.sub.6, represents divalent organic radical, whereas Ar.sub.3 and Ar.sub.5 represent quadrivalent organic radical, wherein l, m amd n designate positive integer of 0 to 15, wherein the sum of 1 and m is 1 or more than 1, and wherein t designates positive integer of 1 or more than 1.

Abstract: The invention provides a method of preparing a polyimide by reacting together a dianhydride and a diisocyanate or equivalent, the polyimide having repeating units of the general formula (I): ##STR1## in which D is a group comprising one or more aromatic rings, to which the imide carbon atoms are directly bonded, andE is a group comprising one or more cycloaliphatic or aromatic rings, to which the imide nitrogen atoms are bonded directly or via an aliphatic group, provided that the imide nitrogen atoms are not bonded directly to an aromatic ring. Such polyimide is colourless or of low colour.

Abstract: Polyamic acids and corresponding polyimides are prepared by reacting polyfunctional amines, aromatic polyfunctional anhydrides or esters thereof, and allyl-nadic anhydride end capping agents, the resulting products exhibiting excellent properties and being suitable for the preparation of prepregs, composites, adhesives, coatings, and the like.

Abstract: A liquid crystal aligning agent comprising a polyamic acid containing an aliphatic and/or alicyclic hydrocarbon group and a polyimide containing an aliphatic and/or alicyclic hydrocarbon group; and a liquid crystal display device using the liquid crystal aligning agent. This liquid crystal aligning agent gives a liquid crystal aligning film which has good liquid crystal aligning property and in which pretilt angle can be changed by radiation with a small energy and which is suitable for domain-divided alignment type liquid crystal display having a wide view angle.

Abstract: A polymeric orientating material for a liquid crystal display including a charged pair electrostatically bound to the main chain of the polymer, and a ferroelectric liquid crystal display adopting the same as an orientation. The ferroelectric liquid crystal display of the present invention has improved memory stability through fast reduction of the anti-electrical field formed when an external electrical field is applied.

Abstract: A rigid-rod aromatic polyimide having repeating units of the formula: ##STR1##

Abstract: A liquid crystal alignment film made of a polyimide which has, on its side chain, a benzene or biphenyl ring substituted by a monovalent substituent having a positive value as the .sigma.p value under Hammett's rule.

Abstract: Controlled molecular weight imide oligomers and co-oligomers containing pendent phenylethynyl groups (PEPIs) and endcapped with nonreactive or phenylethynyl groups have been prepared by the cyclodehydration of the precursor amide acid oligomers or co-oligomers containing pendent phenylethynyl groups and endcapped with nonreactive or phenylethynyl groups. The amine terminated amide acid oligomers or co-oligomers are prepared from the reaction of dianhydride(s) with an excess of diamine(s) and diamine containing pendent phenylethynyl groups and subsequently endcapped with a phenylethynyl phthalic anhydride or monofunctional anhydride. The anhydride terminated amide acid oligomers and co-oligomers are prepared from the reaction of diamine(s) and diamine containing pendent phenylethynyl group(s) with an excess of dianhydride(s) and subsequently endcapped with a phenylethynyl amine or monofunctional amine. The polymerizations are carried out in polar aprotic solvents such as under nitrogen at room temperature.

Abstract: Polyamic acids and corresponding polyimides are prepared by reacting phenylindane diamines, aromatic polyfunctional anhydrides or esters thereof, and nadic anhydride or allylnadic anhydride end capping agents, the resulting products exhibiting excellent properties and being suitable for the preparation of prepregs, composites, adhesives, coatings, and the like.

Abstract: The present invention relates to solutions which can be directly shaped in anhydrous dimethylalkyleneurea, based on a polyimide obtained from an aromatic dianhydride and an aromatic diisocyanate.It also relates to the process for the production of the above solutions, as well as to a process for spinning these solutions and to the yarns and fibres thus obtained.

Abstract: A nonlinear optical polymer material comprising at least one polymer selected from the group consiting of polyimides, acrylic resins and benzocyclobutene resins containing, as a guest molecule, as a side chain, or in the main chain, a molecule or a chemical moiety having a basic structure of merocyanine dye represented by the formula (I): ##STR1## wherein R.sup.1, R.sup.2, R.sup.3, R.sup.4, and R.sup.5 independently represent hydrogen or an organic group, provided that R.sup.1 and R.sup.2 or R.sup.3 and R.sup.5 may independently combine together to form an organo ring structure, and n is an integer of 1 to 3.

Abstract: The invention relates to a polyamide-imide containing recurring units according to the formula ##STR1## where Y is an arylene group, andR and R' are alkylene groups, in which at least 50 mole % of R and/or R' is a butylene group.The polyamide-imides are semi-crystalline.They are suitable for injection moulding applications, structural moulded parts, films, coatings and fibres. They can preferably be used in fields of application where temperatures above 200.degree. C. occur.

Abstract: A block copolymer resin containing structural units conforming to ##STR1## and a method for its preparation are disclosed. Accordingly, the block copolymer is prepared by reactive blending of an ester-containing polyether sulfone with a polyester. The block copolymer resin thus produced is characterized by its homogeneous morphology. The high level of its mechanical properties makes the resin suitable for a variety of applications.

Abstract: Unimolecular micelies, generally referred to as cascade polymers, are constructed via the addition of successive layers, or tiers, of designed monomers, or building blocks, that possess a predetermined, branched superstructure consisting of connected physical matter inherently defining an internal void volume or void area within the molecular framework. Each of the branches define a flexible arm from a central core atom and terminate with a hydrodynamic reactive group. A method is described for manipulating such cascade polymers.

Abstract: A class of soluble polymers having a rigid rod backbone, which when used to cast films, undergo a self-orientation process whereby the polymer backbone becomes more or less aligned parallel to the film surface. This in-plane orientation results in a film that displays negative birefringence. The degree of in-plane orientation and thus, the magnitude of the negative birefringence is controlled by varying the backbone linearity and rigidity of the class of polymers which includes polyesters, polyamides, poly(amide-imides) and poly(ester-imides) through selection of substituents in the polymer backbone chain. By increasing the polymer backbone linearity and rigidity, the degree of in-plane orientation and associated negative birefringence can be increased, and that conversely, by decreasing the polymer backbone linearity and rigidity, the negative birefringence can be decreased.

Abstract: A polyimide precursor having a molecular structure obtained by polymerizing (a) 0.97 to 1.03 molar equivalent of a diamine component containing 0.40 molar equivalent or more of aromatic diamine compound represented by the general formula (DA1), and (b) an acid anhydride component containing (1-n.sub.1 /2) molar equivalent of a tetracarboxylic dianhydride and n.sub.1 molar equivalent of at least one selected from the group consisting of maleic anhydride and maleic derivative anhydride, wherein n.sub.1 ranges from 0.02 to 0.40.

Abstract: A heat-resistant adhesive film, an adhesion structure obtained using the same, and an adhesion method using the same are disclosed, the film comprising a polyisoimide resin containing at least 40 mol % of an isoimide unit represented by formula (I): ##STR1## wherein R.sub.1 represents a tetravalent aromatic or aliphatic residue; R.sub.2 represents a divalent aromatic or aliphatic residue; and the arrow represents a bond replaceable on isomerization, in the molecule thereof. The isoimide unit of the polyisoimide resin is easily converted to an imide unit on heating, e.g., hot pressing with an adherend, to provide a cover-lay film or a single-sided or double-sided base for printed circuit boards having excellent adhesion, heat resistance, dimensional precision, and workability.

Abstract: In accordance with the present invention, there are provided blow molded articles which are composed of specific copolyesters or specific polyester resin compositions and which are highly oriented so that the stretch index as defined by the following equations becomes not less than 130 cm. ##EQU1## The blow molded articles thus provided are excellent in transparency and also excellent in moldability and gas barrier properties and, moreover, excellent also in economical efficiency.

Abstract: This invention relates to melt processable copolymer of etherimideimide/etherimide herein-after identified as PEII/PEI copolymer of following structural formula(I). ##STR1## wherein, R and R' are independently selected from the groups of ##STR2## Ar and Ar' are independently selected from the groups of ##STR3## (wherein, R1 is H or C1-C6 alkyl group,R2 is II or C1-C4 alkyl group, andR3 is --O--, --CO--, --SO--, --SO2--.); andn and m are independently an integer between 5 and 500.

Abstract: Controlled molecular weight phenylethynyl terminated imide oligomers (PETIs) have been prepared by the cyclodehydration of precursor phenylethynyl terminated amic acid oligomers. Amino terminated amic acid oligomers are prepared from the reaction of dianhydride(s) with an excess of diamine(s) and subsequently endcapped with phenylethynyl phthalic anhydride(s) (PEPA). The polymerizations are carried out in polar aprotic solvents such as N-methyl-2-pyrrolidinone or N,N-dimethylacetamide under nitrogen at room temperature. The amic acid oligomers are subsequently cyclodehydrated either thermally or chemically to the corresponding imide oligomers. Direct preparation of PETIs from the reaction of dianhydride(s) with an excess of diamine(s) and endcapped with phenylethynyl phthalic anhydride(s) has been performed in m-cresol. Phenylethynyl phthalic anhydrides are synthesized by the palladium catalyzed reaction of phenylacetylene with bromo substituted phthalic anhydrides in triethylamine.

Abstract: A process is disclosed for making circuit elements by photolithography comprising depositing an antireflective polyimide or polyimide precursor layer on a substrate and heating the substrate at 200.degree. C. to 500.degree. to provide a functional integrated circuit element that includes an antireflective polyimide layer. The antireflective polyimide layer contains a sufficient concentration of at least one chromophore to give rise to an absorbance sufficient to attenuate actinic radiation at 405 or 436 nm. Preferred chromophores include those arising from perylenes, naphthalenes and anthraquinones. The chromophore may reside in a dye which is a component of the polyimide coating mixture or it may reside in a residue which is incorporated into the polyimide itself.

Abstract: A process for preparing polyamideimide resins having high molecular weights as described wherein major problems of prior art processes such as low heat resistance and low melt flowability are improved. Polyamideimide resins having an intrinsic viscosity of 0.4 to 1.50 dl/g as measured on a solution of dimethylacetamide as a solvent at a concentration of 0.5 g/dl at 30.degree. C., are prepared by reacting an aromatic tricarboxylic acid anhydride with an aromatic diamine in N-methyl pyrrolidone solvent in the presence of a first catalyst selected from a group consisting of thionyl chloride, p-toluenesulphonly chloride, sulfuryl chloride, cyanuric chloride and phosphorus trichloride at a temperature of 50.degree. C. to 130.degree. C. over a period of 1 to 5 hours and further reacting the resultant reaction mixture in the presence of a second catalyst which is a compound of the formula (RO).sub.

Abstract: Polyamideimide resins having the formula (I) ##STR1## in which repeating units are bound in a head to tail or head to head manner,R is at least two divalent groups selected from the group consisting of ##STR2## (cis-, trans- conformational mixture) wherein one divalent group is ##STR3## group in a PAI molecule, produced by introducing isophorone diamine into the conventional aromatic polyamideimide resins.

Abstract: This invention concerns positive-working photodefinable polyimide precursors which make use of chemical amplification based on photoacid catalyzed cleavage of acid labile-poly(amic acetal esters).

Abstract: This invention relates to a novel polyimide or polyimide copolymer having excellent heat resistance and greatly improved processability, and has a novel aromatic diamino compound used for the polyimide, a preparation process thereof, a polyimide-based resin composition comprising the polyimide or polyimide copolymer and a fibrous reinforcement, a process for preparing the resin composition, an injection molded article of the resin composition.The polyimide comprise a requisite structural unit having one or more recurring structural units of the formula: ##STR1## wherein L is an oxygen atom, carbonyl, isopropylidene or hexafluoroisopropylidene, and X is ##STR2## and Ar is a tetravalent radical having 6 to 27 carbon atoms and being selected from the group consisting of a monoaromatic radical, condensed polyaromatic radical and noncondensed polyaromatic radical having aromatic radicals connected to each other with a direct bond or a bridge member.

Abstract: Thermoplastically processable aromatic polyether amideThermoplastically processable aromatic polyether amide of the formula (I) ##STR1## in which the symbols Ar, Ar', Ar.sub.1, Ar.sub.2, R, R', Y, x, y and z have the following meanings:Ar is a divalent, substituted or unsubstituted, aromatic or heteroaromatic radical or a group--Ar*--Q--Ar*--in whichQ is a bond or an --O--, --C(CH.sub.3).sub.2, --CO--, --S--, --SO-- or --SO.sub.2 -- bridge and Ar* is an aromatic radical. The carbonyl groups of the Ar radical are on non-adjacent ring carbon atoms.A is up to three different radicals.Ar' has the meaning given for Ar or is an Ar--Z--Ar group.In this case, Z is a --C(CH.sub.3).sub.2 -- or --O--Ar*--O--bridge.Y is a --C(CH.sub.3).sub.2 --, --SO.sub.2 --, --S-- or a --C(CF.sub.3).sub.2 --bridge and has up to two different meanings in the same polymer.Ar.sub.1 and Ar.sub.2 are identical or different from one another and are each a substituted or unsubstituted para- or meta-arylene radical.

Abstract: It is possible to manufacture articles out of thermoplastic materials and to metallize the articles at their surface. In this way one can manufacture reflectors and similar articles. Most thermoplastic materials require extra processing steps prior to the metallization like application of primers, chemical etching and the like.The invention is based on the discovery that a certain type of materials can be metallized without any extra processing steps. The materials involved are polyestercarbonates or blends of polyestercarbonates and polycarbonate. This is quite surprising since polycarbonates can not be metallized in good quality without extra processing steps prior to the metallization step.