Abstract: A method for producing a polysilane includes a step of reacting (i) at least two silane monomers and (ii) at least one alkali metal. The silane monomers contain the following structural units: at least one aryl group, at least one alkyl group, at least one alkenyl group, and at least three halogen atoms. At least three of the halogen atoms are bonded to a silicon atom of one of the silane monomers.

Abstract: [Object] To provide a negative-working photosensitive siloxane composition developable inorganically, and also to provide a cured film-manufacturing method employing that. [Means] The present invention provides a negative-working photosensitive siloxane composition comprising a polysiloxane, a silicon-containing compound having a pKa of 2.0 to 15.7, a photo-polymerization initiator, and a solvent. This composition is coat on a substrate, exposed to light, developed with an inorganic developer, and heated, so that a cured film can be obtained.

Abstract: Provided is an organopolysiloxane and its use. The organopolysiloxane may exhibit excellent processibility and workability. In addition, when the organopolysiloxane is used as an encapsulant, it exhibits excellent light extraction efficiency, crack resistance, hardness, thermal and shock resistance and an adhesive property. Moreover, the organopolysiloxane may provide an encapsulant exhibiting stable durability and reliability under severe conditions for a long time and having no whitening and surface stickiness.

Abstract: Compositions for use in microelectronic applications: Ra comprises one or more multiple bonds, provided that, if Ra comprises more than one multiple bond, these multiple bonds are not in a conjugated configuration; and R1, R2, R3 are independently selected from alkoxyl, hydroxyl, halide, OC(O)R, OC(O)OR, wherein R is alkyl or a substituted alkyl; and Rb is selected from H or a saturated group comprising alkyl, alkylene, or alkylidene; and R4, R5, R6 are independently alkoxyl, hydroxyl, halide, OC(O)R, OC(O)OR, wherein R is alkyl or a substituted alkyl; and Rc comprises more than one multiple bond, and these multiple bonds are in a conjugated configuration; and R7, R8, R9 are independently alkoxyl, hydroxyl, halide, OC(O)R, OC(O)OR, wherein R is alkyl or a substituted alkyl; and R10, R11, R12, R13 are independently alkoxyl, hydroxyl, halide, OC(O)R, OC(O)OR, wherein R is alkyl or a substituted alkyl.

Abstract: Provided herein are silicon-based compositions, which after curing is a coating composition having strong substrate adhesion and scratch resistance. The compositions are formed from a mixture of constituents comprising: from about 20% to about 90% (w/w) of a first siloxane selected from the group consisting of silsesquioxane, methylmethoxysiloxane, and combinations thereof; and from about 10% to about 80% (w/w) of one or more silicon compounds selected from the group consisting of a second siloxane, silane, and silazane. Optionally, the compositions may comprise from about 0.1% to about 5% (w/w) alkyltitanate.

Abstract: This application relates to a curable composition and its use. The curable composition may exhibit excellent processibility and workability. The curable composition has excellent light extraction efficiency, crack resistance, hardness, thermal and shock resistance and an adhesive property after curing. The curable composition may provide a cured product exhibiting stable durability and reliability under severe conditions for a long time and having no whitening and surface stickiness.

Abstract: Aqueous emulsions of epoxy- and organo-substituted, branched organopolysiloxanes are prepared by emulsifying the latter in water with the aid of a dispersing agent. The emulsions are storage stable and are useful in multi-component coating, adhesive, and binder systems.

Abstract: Provided are a curable composition and its use. The curable composition can exhibit excellent processibility and workability. The curable composition exhibits excellent light extraction efficiency, hardness, thermal and shock resistance, moisture resistance, gas permeability and adhesiveness, after curing. In addition, the curable composition can provide a cured product that exhibits long-lasting durability and reliability even under harsh conditions, and that does not cause whitening and surface stickiness.

Abstract: Provided are a curable composition and its use. The curable composition can exhibit excellent processability and workability. The curable composition exhibits excellent light extraction efficiency, hardness, thermal and shock resistance, moisture resistance, gas permeability and adhesiveness, after curing. In addition, the curable composition can provide a cured product that exhibits long-lasting durability and reliability even under harsh conditions, and that does not cause whitening and surface stickiness.

Abstract: A curable composition and use thereof are provided. The exemplary curable composition can show excellent processability and workability. Also, the curable composition can have a high refractive index before or after curing. The composition has low moisture permeability before or after curing and shows excellent crack resistance, thermal shock resistance, adhesive property and hardness. In addition, the composition does not cause color change such as whitening under a high-temperature or high-humidity condition, and does not exhibit stickiness on a surface thereof. The curable composition may be used as an adhesive material or as an encapsulation material for semiconductor devices such as an LED, a CCD, a photo coupler, or a photovoltaic cell.

Abstract: A curable composition and use thereof are provided. The exemplary curable composition can show excellent processability and workability. Also, the curable composition can have a high refractive index before or after curing. The composition has low moisture permeability before or after curing and shows excellent crack resistance, thermal shock resistance, adhesive property and hardness. In addition, the composition does not cause color change such as whitening, under a high-temperature or high-humidity condition, and does not exhibit stickiness on a surface thereof. The curable composition may be used as an adhesive material or as an encapsulation material for semiconductor devices such as an LED, a CCD, a photo coupler, or a photovoltaic cell.

Abstract: The present invention relates to a method for preparing poly(organic oxidized silicon) particles having UV-absorbing groups, including reacting an organoalkoxysilane precursor having a UV-absorbing group selected from a group consisting of organotrialkoxysilane, diorganoalkoxysilane and a mixture thereof, in the presence of a base, with a silane compound selected from a group consisting of tetraalkoxysilane, alkyltrialkoxysilane, tetraalkoxysilane, aryltrialkoxysilane, dialkyldialkoxysilane, diaryldialkoxysilane, arylalkyldialkoxysilane and a mixture thereof, serving as a crosslinking regulator and UV stability enhancer, so as to prepare poly(organic oxidized silicon) particles selected from a group consisting of polysilsesquioxane, silsesquioxane-siloxane copolymer, silsesquioxane-silica copolymer, silsesquioxane-siloxane-silica copolymer and silsesquioxane-siloxane copolymer, having UV-absorbing groups.

Abstract: A silicone resin is provided. The silicone resin may be effectively used to encapsulate a semiconductor element, for example, a light-emitting element of a light-emitting diode.

Abstract: A curable composition and the use thereof are provided. The exemplary curable composition can show excellent processability and workability. Also, the curable composition can have a high refractive index before or after curing. The composition has low moisture permeability before or after curing and shows excellent crack resistance, thermal shock resistance, adhesive property and hardness. In addition, the composition does not cause color change such as whitening under a high-temperature or high-humidity condition, and does not exhibit stickiness on a surface thereof. The curable composition may be used as an adhesive material or as an encapsulation material for semiconductor devices such as an LED, a CCD, a photo coupler, or a photovoltaic cell.

Abstract: A curable composition and use thereof are provided. The exemplary curable composition can show excellent processability and workability. Also, the curable composition can have a high refractive index before or after curing. The composition has low moisture permeability before or after curing and shows excellent crack resistance, thermal shock resistance, adhesive property and hardness. In addition, the composition does not cause color change such as whitening under a high-temperature or high-humidity condition, and does not exhibit stickiness on a surface thereof. The curable composition may be used as an adhesive material or as an encapsulation material for semiconductor devices such as an LED, a CCD, a photo coupler, or a photovoltaic cell.

Abstract: A silicone resin composition contains a silicon-containing component including a silicon atom to which a monovalent hydrocarbon group selected from a saturated hydrocarbon group and an aromatic hydrocarbon group is bonded and a silicon atom to which an alkenyl group is bonded. The number of moles of alkenyl group per 1 g of the silicon-containing component is 200 to 2000 ?mol/g.

Abstract: A light-emitting device including: a substrate; a light-emitting diode; and an optical resonance layer to resonate light emitted from the light-emitting diode. The optical resonance layer includes a first layer, including a polysilsesquioxane-based copolymer. A linking group connecting two different silicon (Si) atoms of the polysilsesquioxane-based copolymer can be —O—, or a substituted or unsubstituted C1-C30 alkylene group.

Abstract: A curable composition includes: 100 parts by mass of a silicon-containing polymer having a Mw of 3,000 to 100,000 obtainable by hydrolysis-condensation of an organosilane mixture including R1SiX3, R2SiX3, R3R4SiX2 and R5SiX3, the total of R2SiX3 and R3R4SiX2 being 5 to 60 mol %, optionally a prepolymer, optionally a cyclic siloxane compound, 0.0001 to 10 parts by mass of an organic peroxide and optionally a metal catalyst, and 10 to 1,500 parts by mass of a filler, wherein R1 is a C2-6 alkenyl group, R2 is a C1-6 alkyl group, R3 and R4 are each a C1-6 alkyl group, R5 is a phenyl group optionally substituted with a C1-6 alkyl group, and X is a C1-6 alkoxy group, one or more of R2 to R4 is a methyl group, f represents a number of 2 to 10, g represents a number of 0 to 8, and n represents 1 or 2.

Abstract: This invention pertains to silsesquioxane resins useful in antireflective coatings wherein the silsesquioxane resin comprises the units (Ph(CH2)rSiO(3-x)/2(OR?)x)m (HSiO(3-x)/2(OR?)x)n (MeSiO(3-x)/2(OR?)x)o (RSiO(3-x)/2(OR?)x)p (R1SiO(3-x)/2(OR?)x)q where Ph is a phenyl group, Me is a methyl group; R? is hydrogen atom or a hydrocarbon group having from 1 to 4 carbon atoms; R is selected from a carboxylic acid group, a carboxylic acid forming group, and mixtures thereof; and R1 is selected from substituted phenyl groups, ester groups, polyether groups; mercapto groups, sulfur-containing organic functional groups, hydroxyl producing group, aryl sulphonic ester groups, and reactive or curable organic functional groups; and r has a value of 0, 1, 2, 3, or 4; x has a value of 0, 1 or 2; wherein in the resin m has a value of 0 to 0.90; n has a value of 0.05 to 0.99; o has a value of 0 to 0.95; p has a value of 0.01 to 0.5; q has a value of 0 to 0.5; and m+n+o+p+q?1.

Abstract: This invention concerns a polymer coating composition for use as non-focal optical power limiting dye containing polymeric materials. This composition contains: (1) one or more Modified Polymers comprising a Polymer, such as a hyperbranched polymer family, especially HB-PCS, HB-PU, HB-PUSOX or PC with one or more of: a) reverse saturable dye (RSA), b) multi-photon absorption dye (MPA), c) an azo dye, or d) absorption dye, which dye is chemically bonded to the pendant groups of the Polymer (along its chain and/or termini) or which forms a part of the backbone of the Polymer; (2) carbon nanotubes (CNT) as optical power limiters (OPL); and (3) a self-focusing component.

Abstract: The invention provides a curable silicone resin composition comprising: (A) an organopolysiloxane containing an aromatic group having two or more alkenyl groups, and having a viscosity at 25° C. of 10 to 1,000,000 mPa·s, (B) an organopolysiloxane having a resin structure, comprising 10 to 80 mol % of a SiO4/2 unit, 1 to 80 mol % of a (R1)2SiO2/2 unit, and 1 to 60 mol % of a (R2)3SiO1/2 unit, and containing a SiOH group in a range of 0.1 to 5.0 mol %, (C) an organohydrogenpolysiloxane having two or more SiH group, and among whole substituents bonded to the silicon atom, 20 to 80 mol % is a phenyl group, and a SiO4/2 unit is less than 5 mol %, and (D) a platinum group metal catalyst, and the component (B) is contained in an amount of 20 to 80% by mass based on a sum of the component (A) and the component (B).

Abstract: A silicon polymer material, which has a silicon polymer backbone with chromophore groups attached directly to at least a part of the silicon atoms, the polymer further exhibiting carbosilane bonds. The film forming composition and resulting coating properties can be tailored to suit the specific exposure wavelength and device fabrication and design requirements. By using two different chromophores the refractive index and the absorption co-efficient can be efficiently tuned. By varying the proportion of carbosilane bonds, and a desired Si-content of the anti-reflective coating composition can be obtained.

Abstract: The present invention relates to a curable composition. A curable composition may be provided; which shows excellent processability and workability; which shows excellent light extraction efficiency, crack resistance, hardness, thermal shock resistance and adhesive strength after curing; and which has excellent reliability and long-term reliability under high-temperature and/or high-moisture conditions. Also, turbidity and surface stickiness may be prevented in the cured product.

Abstract: A fixing material includes a silane compound polymer as the main component, the silane compound polymer being produced by condensing a silane compound mixture that includes at least one silane compound (1) shown by the following formula (1): R1Si(OR2)p(X1)3-p (wherein R1 represents a group including an ester structure or a cyanoalkyl group, R2 represents an alkyl group having 1 to 6 carbon atoms or the like, X1 represents a halogen atom, and p is an integer from 0 to 3), and at least one silane compound (2) shown by the following formula (2): Si(OR3)q(X2)4-q (wherein R3 represents an alkyl group having 1 to 6 carbon atoms, X2 represents a halogen atom, and q is an integer from 0 to 4). A sealed optical device includes an optical device that is sealed with a cured product of the fixing material. The fixing material produces a cured product that exhibits high hardness, excellent transparency and heat resistance, and rarely undergoes coloration even when subjected to high-energy light or heat for a long time.

Abstract: A process for the manufacture of polyorganosiloxanes having ionic groups and reactive functional groups includes (a) conversion of a low molecular weight aralkylene modified polysiloxane to a corresponding sulfonic acid functional material by treating the low molecular weight aralkylene modified polysiloxane with a sulfonating agent; (b) subjecting the reaction product obtained in step (a) to an equilibration reaction with an acid catalyzed ring opening polymerization-effective polyorganosiloxane; and (c) subjecting the reaction product obtained in step (b) to a hydrosilylation reaction with an unsaturated hydrocarbon containing at least one epoxy group, an unsaturated hydrocarbon containing at least two unsaturation moieties, an unsaturated hydrocarbon containing at least one sulfur heteroatom, an unsaturated hydrocarbon containing a monovalent organosilane group, an unsaturated hydrocarbon containing one hydroxyl containing group, an unsaturated hydrocarbon containing one or more of a halogen, carboxylate,

Abstract: This invention relates to methods for preparing polyheterosiloxane materials having at least two different non-Si metal elements. The polyheterosiloxane materials prepared by these methods are solid materials which can be easily dispersed in a solvent of choice.

Abstract: A silicon-containing polymer represented by the following average unit formula: (O2/2SiR1-R2-C6H4-R2-SiR1O2/2)x [R3 SiO(4-a)/2]y(R4O1/2)z (wherein R1 designates identical or different, substituted or unsubstituted monovalent hydrocarbon groups; R2 designates identical or different, substituted or unsubstituted alkylene groups; R3 designates substituted or unsubstituted monovalent hydrocarbon groups; R4 designates alkyl groups or hydrogen atoms; ‘a’ is a positive number that satisfies the following condition: 0=a=3; and ‘x’, ‘y’, and ‘z’ are positive numbers that satisfy the following conditions: 0<x<0.1; 0<y<1; 0=z<0.1; and (x+y+z)=1); and a curable polymer composition comprising: (A) the aforementioned silicon-containing polymer; (B) an organosilicon compound that contains in one molecule at least two silicon-bonded hydrogen atoms; and (C) a hydrosilylation catalyst.

Abstract: A method of forming an antireflective coating on an electronic device comprising (A) applying to an electronic device an ARC composition comprising (i) a silsesquioxane resin having the formula (PhSiO(3-X)/2(OH)x)mHSiO(3-x)/2(OH)x)N(MeSiO(3-x)/2(OH)x)p where Ph is a phenyl group, Me is a methyl group, x has a value of 0, 1 or 2; m has a value of 0.05 to 0.95, n has a value of 0.05 to 0.95, p has a value of 0.05 to 0.95, and m+n+p?1; and (ii) a solvent; and (B) removing the solvent and curing the silsesquioxane resin to form an antireflective coating on the electronic device.

Abstract: Compositions for use in tri-layer applications are described herein, wherein the composition has a matrix and includes: a formulated polymer comprising at least one type of silicon-based moiety forming the matrix of the polymer, a plurality of vinyl groups coupled to the matrix of the polymer, and a plurality of phenyl groups coupled to the matrix of the polymer, at least one condensation catalyst, and at least one solvent. Tri-layer structures are also contemplated herein that comprise an organic underlayer (first layer), antireflective compositions and/or films contemplated herein (second layer) and a photoresist material (third layer) that are coupled to one another.

Abstract: A thermally conductive grease includes 2 vol % to 15 vol % of a combination of three polyorganosiloxanes and 65 vol % to 98 vol % of a thermally conductive filler. The grease may be used as a thermal interface material for dissipating heat from (opto)electronic devices, in both TIM1 and TIM2 applications.

Abstract: The present invention relates to a process for producing a composite material composed of a) at least one oxidic phase and b) an organic polymer phase. The copolymerization of at least one compound of the formula I [(ArO)mMOnRrHp]q??(I) in which M is B, Al, Ga, In, Si, Ge, Sn, P, As or Sb, Ar is phenyl or naphthyl, R is alkyl, alkenyl, cycloalkyl or aryl, where aryl is unsubstituted or may have one or more substituents, with formaldehyde or formaldehyde equivalents, in a reaction medium which is essentially anhydrous, to obtain a composite material having an arrangement of phase domains similar to those nanocomposite materials obtainable by twin polymerization, and to the use of the composite material for production of gas storage materials, rubber mixtures, low-K dielectrics and electrode materials for lithium ion batteries.

Abstract: A silicone resin composition comprising (A) an organopolysiloxane containing silicon-bonded aryl and alkenyl groups in a molecule, (B) an organohydrogenpolysiloxane, and (C) an addition reaction catalyst is low gas permeable. An optoelectronic device encapsulated therewith is highly reliable.

Abstract: A composition for coating comprising at least one compound of formula I and optionally at least one compound of formula II RaSi(R1)n(X1)3-n??I RbSi(R2)m(X2)3-m??II wherein Ra is a straight-chain or branched C(1-24) alkyl group, Rb is an aromatic group, such as an optionally substituted carbocyclic and heterocyclic group comprising five-, six- or ten-membered ring systems, which is linked by a single covalent bond or a spacer unit, such as a straight-chain or branched alkyl residue having 1 to 8 carbon atoms, to the Si— atom, R1 and R2 are independently of each other a lower alkyl group, such as a straight chain and branched hydrocarbon radical having 1 to 6 carbon atoms, X1 and X2 are independently of each other a hydrolysable group, such as a halogen or an alkoxy group and n, m are independently of each other 0 or 1, with the proviso that if n and m are independently of each other 0 or 1, X may represent the same or different groups.

Abstract: Methods of preparing silicone materials using electron beam curing are described. The materials are hot melt processed and cured in the absence of an effective amount of catalysts and initiators. Both functional and nonfunctionalized silicone materials may be used. Exemplary cured materials include silicone pressure sensitive adhesives, silicone foams, and non-tacky silicone films.

Abstract: An optical semiconductor device that combines low gas permeability and high reliability. A curable silicone resin composition comprising: (A) an alkenyl group-containing organopolysiloxane comprising an organopolysiloxane represented by an average composition formula (1) and containing at least two alkenyl groups per molecule: (R1SiO3/2)a(R22SiO)b(R3R42SiO1/2)c??(1) wherein R1 represents an alkyl group, R2 represents an aryl group, R3 represents an alkenyl group, and R4 represents an alkyl group or an aryl group, (B) an organohydrogenpolysiloxane represented by an average composition formula (2) and containing at least two silicon atom-bonded hydrogen atoms per molecule: R1dR2eHfSiO(4-d-e-f)/2??(2) wherein R1 and R2 are as defined above, and (C) an addition reaction catalyst.

Abstract: The disclosure provides methods and materials for imparting corrosion resistance to a substrate, as well as the corrosion-resistant substrates prepared accordingly. Compositions and methods include nonpyrolyzed, silicon-based polymer coatings prepared on substrates. The prepared coatings are highly stable and resistant to corrosion. The invention finds utility, for example, in the fields of surface and coating chemistry. The composition contains silicon-containing polymers having units of the following formulae: [R1Si(OH)O]k??(III) [R1Si(OR10)O]m??(IV) [R1SiO1.5]n??(V) [R1Si(H)O]p??(VI) [R2R3SiO]q??(VII).

Abstract: The present invention provides a triblock copolymer and a viscoelastic biostable foam comprising the same.

Abstract: Described herein are photo-patternable sol-gel precursors and their methods of preparation. The sol-gel precursors are thermally stable and form compositions that have high refractive indices and low optical loss values. The precursors can be used to make sol-gel compositions that are ideally suited toward optical waveguide applications in the realm of telecommunications wavelengths.

Abstract: A transparent resin for an encapsulation material, including a polymetallosiloxane obtained from at least one metal compound represented by Chemical Formulae 1A to 1D copolymerized with a silicon compound including a compound represented by Chemical Formula 2:

Abstract: The present invention provides a silicon-containing surface modifier wherein the modifier contains one or more of a repeating unit shown by the following general formula (A) and a partial structure shown by the following general formula (C).The present invention has an object to provide a resist underlayer film applicable not only to a negatively developed resist pattern formed by a hydrophilic organic compound but also to a conventional positively developed resist pattern formed by a hydrophobic compound.

Abstract: A thermosetting fluoropolyether adhesive composition is provided. This composition cures at lower than 100° C., and the cured product exhibits good adhesion to various substrates and excellent adhesion durability at a temperature of up to 150° C. A method for adhering the composition to the substrate is also provided.

Abstract: The present invention provides a positive-type radiation-sensitive composition containing (A) a siloxane polymer, and (B) a quinone diazide compound, in which the content of aryl groups relative to Si atoms in the siloxane polymer (A) is greater than 60% by mole and no greater than 95% by mole.

Abstract: Provided are a curable composition for semiconductor encapsulation which produces a cured product that is excellent in heat resistance, electrical insulation properties at high temperatures, flexibility and heat cycle resistance, and a semiconductor device encapsulated by curing this curable composition. Specifically, there is provided a curable composition for semiconductor encapsulation containing, as component (A), a particular SiH group-containing siloxane compound; as component (B), a particular vinyl group-containing siloxane compound; as component (C), a compound having at least three SiH groups or at least three vinyl groups; and as component (D), a hydrosilylation catalyst.

Abstract: A sealing material for optical elements with excellent transparency, crack resistance, and heat resistance which can produce a cured product of the sealing material and a sealed optical element are provided.

Abstract: The present invention relates to a porous polymer and a synthetic method thereof. The porous polymer has the following general formula: wherein, the positions marked with the numeral 1-10 are C, CH, N, or CH with its H being substituted by methyl, ethyl, amido, carboxyl, methoxyl, hydroxyl, or ester group; the positions marked with letter a or b are C, N+, or B?.

Abstract: Disclosed is a method form making a thermo-stable and transparent resin. In the method, at first, polyborosiloxane is syhthesized by hydrolyzing and condensing a boron-containing compound, used as a precursor, and a silane compound. Then, epoxy group-containing polyborosiloxane is synthesized by grafting an epoxy group to the polyborosiloxane. Finally, an epoxy/PGB composite is synthesized by reacting the epoxy group-containing polyborosiloxane with epoxy for consolidation, thus providing a homogenous, stable, net-shaped composite.

Abstract: Polysilanes, inks containing the same, and methods for their preparation are disclosed. The polysilane may have the formula H-[(AHR)n(c-AmHpm-2)q]—H, where A is independently Si or Ge; R is H, -AaHa+1Ra, halogen, aryl or substituted aryl; (n+a)?10 if q=0, q?3 if n=0, and (n+q)?6 if both n and q?0; p is 1 or 2; and m is from 3 to 12. The method may include combining a silane compound of the formula AHaR14-a, AkHgR1?h and/or c-AmHpmR1rm with a catalyst of the formula R4xR5yMXz (or an immobilized derivative thereof) to form a poly(aryl)silane; then washing the poly(aryl)silane with an aqueous washing composition and contacting the poly(aryl)silane with an adsorbent to remove the metal M. Alternatively, the method may include halogenating a polyarylsilane and reducing the halopolysilane with a metal hydride to form the polysilane.

Abstract: A curable liquid polysiloxane/TiO2 composite for use as a light emitting diode encapsulant is provided, comprising: a polysiloxane with TiO2 domains having an average domain size of less than 5 nm, wherein the curable liquid polysiloxane/TiO2 composite contains 20 to 60 mol % TiO2 (based on total solids); wherein the curable liquid polysiloxane/TiO2 composite exhibits a refractive index of >1.61 to 1.7 and wherein the curable liquid polysiloxane/TiO2 composite is a liquid at room temperature and atmospheric pressure. Also provided is a light emitting diode manufacturing assembly.

Abstract: A method of making a light emitting diode (LED) having an optical element is provided, comprising: providing a curable liquid polysiloxane/TiO2 composite, which exhibits a refractive index of >1.61 to 1.7 and which is a liquid at room temperature and atmospheric pressure; providing a semiconductor light emitting diode die having a face, wherein the semiconductor light emitting diode die emits light through the face; contacting the semiconductor light emitting diode die with the curable liquid polysiloxane/TiO2 composite; and, curing the curable liquid polysiloxane/TiO2 composite to form an optical element; wherein at least a portion of the optical element is adjacent to the face.

Abstract: A polymer having a structural unit represented by Formula (3): wherein R1 is phenyl in which any hydrogen may be replaced by halogen or alkyl having 1 to 5 carbon atoms; in the alkyl having 1 to 5 carbon atoms, any —CH2—, which is not adjacent to each other, may be replaced by —O—, and any hydrogen may be replaced by halogen; Q1 is hydrogen, halogen, alkyl having 1 to 10 carbon atoms, cyclopropyl, cyclobutyl, cyclopentyl, cyclohexyl, cyclohexenyl, or phenyl in which any hydrogen may be replaced by halogen or alkyl having 1 to 5 carbon atoms; in the alkyl having 1 to 10 carbon atoms and alkyl having 1 to 5 carbon atoms which is a substituent of phenyl, any —CH2—, which is not adjacent to each other, may be replaced by —O—, —CH?CH— or —C?C—, and any hydrogen may be replaced by halogen; and Q3 is a group represented by Formula (4): <—Z0A1-Z1lA2-Z2mA3-Z3nA4p-Z5—??(4) wherein a code <represents a bonding point with silicon; l, m, n and p are independently 0, 1, 2 or 3; and A1, A2, A3, A4, Z0, Z1, Z2, Z