Phenolic Reactant Contains At Least One Nitrogen, Phosphorus, Or Sulfur Atom Patents (Class 528/99)
  • Patent number: 11279797
    Abstract: A curing agent for epoxy resin compositions containing at least one amine of formula (I) and at least one amine of formula (II). The curing agent is a low-odor, low-viscosity, low-toxicity curing agent and has a low propensity for carbamatization and a high reactivity toward epoxy resins. It enables low-odor and low-emission epoxy resin products which are readily processable and which even at low temperatures and high humidities undergo rapid and problem-free curing to afford high-quality plastics having a high hardness and a regular, non-tacky surface with high gloss.
    Type: Grant
    Filed: February 14, 2017
    Date of Patent: March 22, 2022
    Assignee: SIKA TECHNOLOGY AG
    Inventors: Edis Kasemi, Andreas Kramer, Ursula Stadelmann, Urs Burckhardt
  • Patent number: 10279375
    Abstract: Methods, processes, compositions and systems for preventing leaching effects from water pipes (such as lead, steel and copper) having an inner diameter of at least approximately 12 mm. 2-part thermoset resin coating is applied to the inner surfaces of the pipes where the curing agent can be a phenol free and plasticizer free adduct type. The coating can reduce heavy metals, such as lead, from leaching from installed pipes to less than approximately 10 ?g/L (10 ppb). When cured, specific leachates, Bisphenol A and Epichlorohydrin from the coatings will be (less than) <1 ?g/L (1 ppb) with overall TOC levels measured at (less than) <2.5 mg/L (2.5 ppm). Pipes can be returned to service within approximately 24 hours, and preferably within approximately 4 hours.
    Type: Grant
    Filed: September 1, 2017
    Date of Patent: May 7, 2019
    Assignee: Pipe Restoration Technologies, LLC
    Inventors: Larry L. Gillanders, Steven A. Williams
  • Patent number: 9512341
    Abstract: The present invention relates to heat-curing sealant compositions including at least epoxy resin, dicyanodiamide or an amine complex of a Lewis acid, polyurethane polymer (PUP) containing isocyanate groups and polyaldimine. These single component sealant compositions are characterized by a rapid skin formation and high tensile strength. Because of the short skin formation time, said compositions are optimally suitable for use as sealants in autobody work because they can be excellently layered on top of same.
    Type: Grant
    Filed: December 19, 2011
    Date of Patent: December 6, 2016
    Assignee: SIKA TECHNOLOGY AG
    Inventors: Antonio Voci, Andreas Kramer, Jan Olaf Schulenburg, Michael Gutgsell, Urs Burckhardt
  • Patent number: 9371438
    Abstract: Disclosed herein is a method of preparing a high-melting point flame retardant crystal, comprising the steps of: reacting 9,10-dihydro-9-oxa-10-phosphaphenanthrene-10-oxide with 1,4-naphthoquinone in an inert solvent having a dielectric constant of 10 or less to reduce a content of by-products, thereby obtaining a reaction composition; and dissolving the reaction composition in any one solvent selected from the group consisting of ethyleneglycol, propyleneglycol, diethyleneglycol, cyclohexanone, benzyl alcohol, acetate ester, benzoate ester and a mixture thereof to recrystallize and refine the reaction composition, thereby obtaining high-melting point retardant crystal, represented by Formula 1, having a start melting point of 280° C. or more and a melting point of 291° C. or more, which are measured by differential thermogravimetric analysis.
    Type: Grant
    Filed: August 16, 2012
    Date of Patent: June 21, 2016
    Assignee: SANKO CO., LTD.
    Inventors: Daishiro Kishimoto, Yoichi Umeki
  • Patent number: 9357630
    Abstract: Disclosed are an epoxy resin compound and a radiant heat circuit board using the same. The epoxy resin compound mainly includes an epoxy resin, a curing agent, and an inorganic filler. The curing agent comprises epoxy adducts formed to add the curing agent to a crystalline epoxy resin. The epoxy resin is used on a printed circuit board as an insulating material, so that a substrate having a high heat radiation property is provided.
    Type: Grant
    Filed: July 27, 2012
    Date of Patent: May 31, 2016
    Assignee: LG INNOTEK CO., LTD.
    Inventors: Sung Bae Moon, Jae Man Park, Jong Heum Yoon, Hae Yeon Kim, In Hee Cho
  • Patent number: 9102787
    Abstract: Embodiments include curable compositions including a resin component and a hardener component. The resin component can include an epoxy compound that is selected from the group consisting of aromatic epoxy compounds, alicyclic epoxy compounds, aliphatic epoxy compounds, and combinations thereof, and a reactive diluent that includes a polymeric glycidyl ether. The hardener component can include an adduct and a Mannich base.
    Type: Grant
    Filed: November 12, 2010
    Date of Patent: August 11, 2015
    Assignee: Blue Cube IP LLC
    Inventors: Markus Schroetz, Eva-Maria Michalski, Klaus Reinhold, Christina Fritsche
  • Publication number: 20150005458
    Abstract: The present invention relates to a matrix material for a carbon fiber-reinforced composite. The matrix material for the carbon fiber composite contains a matrix resin as a resin component. The matrix resin contains at least a first epoxy resin containing a polyfunctional glycidylamine-type epoxy resin having four epoxy groups in one molecule. The matrix resin may further contain at least one of a p-aminophenol-type epoxy resin having three epoxy groups in one molecule, and a tetramethylbiphenol-type solid epoxy resin having two epoxy groups in one molecule. The matrix resin has an average epoxy equivalency of 99 to 163.
    Type: Application
    Filed: June 17, 2014
    Publication date: January 1, 2015
    Inventor: Shuichiro Yoshida
  • Patent number: 8816038
    Abstract: Disclosed is a polymer which is useful for the preparation of an epoxy resin composition or a cured product thereof in film or sheet exhibiting high heat resistance, high thermal conductivity, low thermal expansion, high gas barrier property, and high toughness. The polymer is a thermoplastic aromatic ether polymer comprising a unit represented by the following general formula (1) at a ratio of 10 to 100 mol % and having a weight average molecular weight of 3,000 or more; in formula (1), X is an oxygen atom or a sulfur atom, R1 and R2 each is a hydrogen atom, an alkyl group of 1 to 8 carbon atoms, an aryl group, an alkoxy group, an aralkyl group, or a halogen atom, and n is a number of 1 to 3.
    Type: Grant
    Filed: January 10, 2007
    Date of Patent: August 26, 2014
    Assignee: Nippon Steel & Sumikin Chemical Co., Ltd.
    Inventors: Masashi Kaji, Koichiro Ogami
  • Patent number: 8742589
    Abstract: A semiconductor embedded module 1 of the present invention has a configuration in which a semiconductor device 20, which is an electronic component such as a semiconductor IC (die) in a bare chip state, is embedded in a resin layer 10 (second insulating layer). In the semiconductor device 20, a redistribution layer 22 is connected to land electrodes. A protective layer 24 (first insulating layer) is provided on the redistribution layer 22, and is provided with openings such that external connection pads P of the redistribution layer 22 are exposed. Also, the resin layer 10 is formed to cover the protective layer 24, and vias V are formed at the positions of the respective external connection pads P of the redistribution layer 22. The grinding rate of the resin layer 10 is larger than that of the protective layer 24.
    Type: Grant
    Filed: July 17, 2009
    Date of Patent: June 3, 2014
    Assignee: TDK Corporation
    Inventors: Kenichi Kawabata, Toshikazu Endo
  • Patent number: 8729212
    Abstract: Bioresorbable or biodegradable polymers formed from the monomers including sulphonyl diphenol, hydroxybenzoic acid and dicarboxylic acid. The dicarboxylic acid can include aliphatic dicarboxylic acid or a mixture of aliphatic dicarboxylic acid and aromatic dicarboxylic acid. Between 25 and 85 molar percent of the polymer is formed from the hydroxybenzoic acid, between 7.5 and 37.5 molar percent of the polymer is formed from the sulphonyl diphenol, and between 7.5 and 37.5 molar percent of the polymer is formed from the dicarboxylic acid. Polymers can be used for manufacturing fibers and composite devices.
    Type: Grant
    Filed: March 23, 2007
    Date of Patent: May 20, 2014
    Assignee: Smith & Nephew, Inc.
    Inventors: Anthony Dagger, De Oca Horacio Montes
  • Patent number: 8722840
    Abstract: There is provided a composition for forming a resist underlayer film that has a high selectivity of dry etching rate even though the composition contains an aromatic ring such as a benzene ring, and that is useful in lowering LER that presents a large problem in EUV (wavelength 13.5 nm) lithography. Moreover, another object is to obtain a composition for forming a resist underlayer film that provides a resist pattern having a desired shape on the resist underlayer film. A resist underlayer film forming composition for lithography which includes a polymer and a solvent, wherein in the polymer, diphenyl sulfone or a derivative thereof is introduced in the main chain of the polymer through an ether bond.
    Type: Grant
    Filed: November 11, 2011
    Date of Patent: May 13, 2014
    Assignee: Nissan Chemical Industries, Ltd.
    Inventors: Rikimaru Sakamoto, Noriaki Fujitani, Takafumi Endo, Ryuji Ohnishi, BangChing Ho
  • Patent number: 8691930
    Abstract: A polymer represented by Formula 1 below: wherein functional groups and n are defined as in the specification.
    Type: Grant
    Filed: March 30, 2011
    Date of Patent: April 8, 2014
    Assignee: Samsung Display Co., Ltd.
    Inventors: Jae-Yong Lee, Hee-Yeon Kim, Seung-Gak Yang, Yoon-Hyun Kwak, Jeoung-In Yi
  • Publication number: 20130203894
    Abstract: Embodiments of the present invention disclose a method for limiting peak exotherm temperatures in epoxy systems comprising the step of: combining an amine hardener, an epoxy and a diluent to form an epoxy system, wherein the diluent is selected from the group consisting of: ethylene carbonate, propylene carbonate, butylene carbonate, delta-valerolactam, delta-valerolactone, gamma valerolactone, butyrolactam, beta butyrolactone, gamma butyrolactone, and combinations thereof.
    Type: Application
    Filed: March 3, 2011
    Publication date: August 8, 2013
    Applicant: Huntsman Petrochemical LLC
    Inventor: Bruce L. Burton
  • Patent number: 8476397
    Abstract: A polymer compound comprising a residue of a compound represented by the following formula (0): wherein Ar0 represents a substituent such as a hydrogen atom, an alkyl group, an alkoxy group, an aryl group and the like, or a group represented by the following formula (A), at least two Ar0s are groups represented by the following formula (A), R0 represents a substituent such as an alkyl group, an alkoxy group, an aryl group and the like, l and m represent an integer of 0 to 3, wherein A0 represents —N? or —C(R2)?. R2 represents a substituent such as a hydrogen atom, an alkyl group, an alkoxy group, an aryl group and the like.
    Type: Grant
    Filed: June 26, 2009
    Date of Patent: July 2, 2013
    Assignee: Sumitomo Chemical Company, Limited
    Inventor: Satoshi Kobayashi
  • Patent number: 8426547
    Abstract: A phosphorus-containing epoxy resin and a method for synthesizing the same are disclosed. The method includes the step of catalytically reacting compound (i) with compound (ii) to synthesize the phosphorus-containing epoxy resin having the structure of compound (I). R is methyl or phenyl, and n is the integer from 1 to 9.
    Type: Grant
    Filed: March 29, 2010
    Date of Patent: April 23, 2013
    Assignee: Chang Chun Plastics Co., Ltd
    Inventors: Fang-Hsien Su, Chi-Hung Liu, Chun-Hsiung Kao, An-Pang Tu, Kuen-Yuan Hwang
  • Publication number: 20120309923
    Abstract: The present invention is a solventless one liquid type cyanate ester-epoxy composite resin composition comprised of (A) a multifunctional cyanate ester or a mixture thereof represented by the following formula (1), wherein an average cyanate group number is 2.5 or more, (B) a multifunctional liquid epoxy resin or a mixture thereof represented by the following formula (2), wherein an average epoxy group number is 2.5 or more and (C) an amine latent curing agent. [ Average ? ? cyanate ? ? group ? ? number ] = ? i = 1 n ? ? ( Ai × Xi ) 100 Formula ? ? ( 1 ) Ai is a cyanate group number of the component i, and Xi is a content ratio of the component i (percent by mass) in the formula (1). [ Average ? ? epoxy ? ? group ? ? number ] = ? k = 1 n ? ? ( Bk × Yk ) 100 Formula ? ? ( 2 ) Bk is an epoxy group number of the component k, and Yk is a content ratio of the component k (percent by mass) in the formula (2).
    Type: Application
    Filed: February 10, 2011
    Publication date: December 6, 2012
    Applicant: ADEKA CORPORATION
    Inventors: Ryo Ogawa, Yoko Masamune
  • Patent number: 8247051
    Abstract: A coating composition is provided for use in laminate substrates useful in packaging of liquids and solids where the coating provides and increased resistance to the permeability of gases such as oxygen and carbon dioxide. In one embodiment the coating composition is a dispersion or a solution that comprises at least one hydroxyl functional polyetheramine, phosphoric acid and a defoamer. The backbone of the polyetheramine has diglycidyl ether linkages that comprise about 5 to about 70 mole percent resorcinol diglycidyl ether. The coating composition can be applied to substrates by coating applications such as spraying, rolling reverse and direct, rolling direct and reverse gravure, kiss coat, flow coating, brushing, dipping and curtain-wall coating, for example.
    Type: Grant
    Filed: August 1, 2006
    Date of Patent: August 21, 2012
    Assignee: The Glidden Company
    Inventors: Daniel Bode, Cathy Li, Kenneth J. Gardner
  • Patent number: 8067523
    Abstract: It is an object of the present invention to provide a thermosetting resin composition having satisfactory adhesiveness, good processability, high heat resistance, and excellent dielectric characteristics in the GHz band; and a laminate and a circuit board including the thermosetting resin composition. The present invention provides a thermosetting resin composition including an imide oligomer component (A) containing at least one imide oligomer having a specific structure and an epoxy resin component (B) containing at least one epoxy resin. Furthermore, the present invention provides the thermosetting resin composition further including a polyimide resin component (C).
    Type: Grant
    Filed: October 4, 2006
    Date of Patent: November 29, 2011
    Assignee: Kaneka Corporation
    Inventors: Shigeru Tanaka, Kanji Shimoohsako, Takashi Ito, Mutsuaki Murakami
  • Patent number: 8008405
    Abstract: The present invention is directed to a passivating material suitable for passivating a metal surface. The passivating material comprises a polymer which comprises (a) at least one nitro group, and/or pyridine group, and/or phenolic hydroxyl group; and (b) at least one group selected from a phosphorous-containing group and/or a carboxylic acid group, wherein the at least one phosphorous-containing group is selected from a phosphate, a phosphite, or a non-nitrogen substituted phosphonate.
    Type: Grant
    Filed: August 12, 2008
    Date of Patent: August 30, 2011
    Assignee: PPG Industries Ohio, Inc.
    Inventors: Cathy A. Taylor, Daniel Rardon, Paul Lamers, Kapiappa G. Ragunathan, Shanti Swarup, Michael Hart
  • Publication number: 20110172384
    Abstract: A phosphorus-containing epoxy resin and a method for synthesizing the same are disclosed. The method includes the step of catalytically reacting compound (i) with compound (ii) to synthesize the phosphorus-containing epoxy resin having the structure of compound (I). R is methyl or phenyl, and n is the integer from 1 to 9.
    Type: Application
    Filed: March 29, 2010
    Publication date: July 14, 2011
    Applicant: CHANG CHUN PLASTICS CO., LTD
    Inventors: Fang-Hsien SU, Chi-Hung LIU, Chun-Hsiung KAO, An-Pang TU, Kuen-Yuan HWANG
  • Patent number: 7923492
    Abstract: An inexpensive and durable polymer electrolyte composition exhibiting high ionic conductivity even in the absence of water or a solvent, characterized by comprising a molten salt and an aromatic polymer having a carbonyl bond and/or a sulfonyl bond in the main chain thereof and containing a cation exchange group. The aromatic polymer is preferably an aromatic polyether sulfone having a specific structural unit and containing a cation exchange group, an aromatic polyether ketone having a specific structural unit and containing a cation exchange group, or an aromatic polyether sulfone block copolymer and/or an aromatic polyether ketone block copolymer, the block copolymers comprising a hydrophilic segment containing a cation exchange group and a cation exchange group-free hydrophobic segment. The polymer electrolyte composition containing the block copolymer as an aromatic polymer exhibits high structural retention even in high temperatures.
    Type: Grant
    Filed: April 23, 2009
    Date of Patent: April 12, 2011
    Assignee: UBE Industries, Ltd.
    Inventors: Masayuki Kinouchi, Tetsuji Hirano, Nobuharu Hisano
  • Patent number: 7858173
    Abstract: A novel flame-retardant thermoplastic polyhydroxy polyether resin obtained by reacting at least one epoxy resin (A) selected from glycidyl esters of divalent aliphatic carboxylic acids having 15 to 64 carbon atoms or glycidyl ethers of divalent aliphatic alcohols having 15 to 64 carbon atoms with a phosphorus atom-containing divalent phenol compound (B) as essential components, wherein the component (A) accounts for 2 to 52 mol % with respect to the whole resin, the weight average molecular weight thereof is 10,000 to 200,000, and the phosphorus content thereof is 1 to 5 wt %.
    Type: Grant
    Filed: March 24, 2008
    Date of Patent: December 28, 2010
    Assignee: Nippon Steel Chemicals Co., Ltd.
    Inventors: Masao Gunji, Chiaki Asano
  • Publication number: 20100119805
    Abstract: A novel flame-retardant thermoplastic polyhydroxy polyether resin obtained by reacting at least one epoxy resin (A) selected from glycidyl esters of divalent aliphatic carboxylic acids having 15 to 64 carbon atoms or glycidyl ethers of divalent aliphatic alcohols having 15 to 64 carbon atoms with a phosphorus atom-containing divalent phenol compound (B) as essential components, wherein the component (A) accounts for 2 to 52 mol % with respect to the whole resin, the weight average molecular weight thereof is 10,000 to 200,000, and the phosphorus content thereof is 1 to 5 wt %.
    Type: Application
    Filed: March 24, 2008
    Publication date: May 13, 2010
    Applicant: TOHTO KASEI CO., LTD.
    Inventors: Masao Gunji, Chiaki Asano
  • Patent number: 7632626
    Abstract: There is provided an anti-reflective coating forming composition for lithography comprising a polymer having an ethylenedicarbonyl structure and a solvent; an anti-reflective coating formed from the composition; and a method for forming photoresist pattern by use of the composition. The anti-reflective coating obtained from the composition can be used in lithography process for manufacturing a semiconductor device, has a high preventive effect for reflected light, causes no intermixing with photoresists, and has a higher etching rate than photoresists.
    Type: Grant
    Filed: April 13, 2006
    Date of Patent: December 15, 2009
    Assignee: Nissan Chemical Industries, Ltd.
    Inventor: Rikimaru Sakamoto
  • Patent number: 7563850
    Abstract: An inexpensive and durable polyelectrolyte composition includes both an aromatic polymer containing carbonyl linkages and/or sulfonyl linkages in the backbone chain and bearing cation-exchange groups and a fused salt exhibits a high ionic conductivity even in the absence of water or a solvent. The aromatic polymer is preferably an aromatic polyether sulfone comprising specific structural units and bearing cation-exchange groups, an aromatic polyether ketone comprising specific structural units and bearing cation-exchange groups, an aromatic polyether sulfone block copolymer consisting of at least one hydrophilic segment bearing cation-exchange groups and at least one hydrophobic segment free from cation-exchange groups, and/or an aromatic polyether ketone block copolymer consisting of at least one hydrophilic segment bearing cation-exchange groups and at least one hydrophobic segment free from cation-exchange groups.
    Type: Grant
    Filed: November 29, 2002
    Date of Patent: July 21, 2009
    Assignee: Ube Industries, Ltd.
    Inventors: Masayuki Kinouchi, Tetsuji Hirano, Nobuharu Hisano
  • Publication number: 20090036631
    Abstract: Disclosed is a polymer which is useful for the preparation of an epoxy resin composition or a cured product thereof in film or sheet exhibiting high heat resistance, high thermal conductivity, low thermal expansion, high gas barrier property, and high toughness. The polymer is a thermoplastic aromatic ether polymer comprising a unit represented by the following general formula (1) at a ratio of 10 to 100 mol % and having a weight average molecular weight of 3,000 or more; in formula (1), X is an oxygen atom or a sulfur atom, R1 and R2 each is a hydrogen atom, an alkyl group of 1 to 8 carbon atoms, an aryl group, an alkoxy group, an aralkyl group, or a halogen atom, and n is a number of 1 to 3.
    Type: Application
    Filed: January 10, 2007
    Publication date: February 5, 2009
    Applicant: NIPPON STEEL CHEMICAL CO., LTD.
    Inventors: Masashi Kaji, Koichiro Ogami
  • Publication number: 20080312404
    Abstract: The present invention relates to novel diepoxides having the formulas I. and II. R*SO2N(A)RN(A)SO2R* where A=2,3-epoxypropyl, R* is a monovalent hydrocarbon radical or an inertly substituted hydrocarbon radical and R is a divalent hydrocarbon radical or an inertly substituted divalent hydrocarbon radical. The epoxies are useful in preparing novel epoxide resins.
    Type: Application
    Filed: August 14, 2008
    Publication date: December 18, 2008
    Inventor: R. Garth Pews
  • Patent number: 7268193
    Abstract: Branched polyarylene polymers are provided comprising monovalent endcappers, divalent linear units, and polyvalent branching units. The composition of the polymers is controlled by adjusting the ratio of the three types of monomers.
    Type: Grant
    Filed: March 4, 2005
    Date of Patent: September 11, 2007
    Assignee: Mississippi Polymer Technologies, Inc.
    Inventors: Matthew L. Marrocco, III, Mark S. Trimmer, Ying Wang
  • Patent number: 7150902
    Abstract: Articles are coated by applying a coating composition of a high Tg phenoxy-type material having a Tg of at least about 75° C. to at least a portion of a surface of an article, and forming a dried/cured coating of the high Tg phenoxy-type material on the article surface, where the coating has the high Tg phenoxy-type material and a PHAE; or the article surface comprises a coating includes a PHAE; or the coating has the high Tg phenoxy-type material and a PHAE, and the article surface includes a coating layer of a PHAE.
    Type: Grant
    Filed: April 7, 2004
    Date of Patent: December 19, 2006
    Assignee: Pepsico, Inc.
    Inventor: Said Farha
  • Patent number: 7135537
    Abstract: The present invention is directed to sulfonimide-containing polymers, specifically sulfonimide-containing poly(arylene ether)s and sulfonimide-containing poly(arylene ether sulfone)s, and processes for making the sulfonimide-containing poly(arylene ether)s and sulfonimide-containing poly(arylene ether sulfone)s, for use conductive membranes and fuel cells.
    Type: Grant
    Filed: April 28, 2004
    Date of Patent: November 14, 2006
    Assignee: E.I. du Pont de Nemours and Company
    Inventor: Michael A. Hofmann
  • Patent number: 7108807
    Abstract: Poly-o-hydroxyamides include binaphthyl substituents as repeating units. The poly-o-hydroxyamides can be cyclized to give the polybenzoxazole by heating. Pore formation occurs, so that a dielectric having a very low dielectric constant k of less than 2.5 is obtained.
    Type: Grant
    Filed: April 28, 2003
    Date of Patent: September 19, 2006
    Assignee: Infineon Technologies AG
    Inventors: Recai Sezi, Andreas Walter, Klaus Lowack, Anna Maltenberger, Robert Banfic
  • Patent number: 7109286
    Abstract: A phosphorus-containing hydroquinone derivative represented by a general formula (1): (where R1 and R2 represent linear or branched alkyl groups that are identical or may be different, and/or R1 and R2 may form a circular group; X represents an oxygen atom or sulfur atom; Y and Z represent hydrogen atom, hydroxy group, linear or branched alkyl group, aralkyl group, alkoxy group, allyl group, aryl group or cyano group, and/or Y and Z may form a circular group). The present invention provides phosphorus-containing hydroquinone derivatives that are useful for intermediate materials for reactive type flame-retardant agents or phosphorus-containing epoxy resins.
    Type: Grant
    Filed: June 20, 2001
    Date of Patent: September 19, 2006
    Assignee: Nippon Chemical Industrial Co., Ltd.
    Inventors: Ken Tamura, Eiichi Tatsuya, Yoshirou Kaneda, Natsuhiro Sano
  • Patent number: 7049353
    Abstract: High-use temperature, lightweight polymer/inorganic nanocomposite materials are described having enhanced thermal stability and performance characteristics. These materials are made possible by new methods for synthesizing composite materials that enhance the thermal stability of the nanocomposite systems from 100–150° C. to over 450° C. These materials and techniques for their formation are enabled at least in part by the use of polar organic phthalonitrile monomers and oligomers that can exfoliate layered phyllosilicates, such as smectite clays, in percentages greater than 10% inorganic by weight. This approach offers a solvent-free direct melt intercalation technique that greatly reduces the cost of processing nanocomposites. Additionally, the use of unmodified phyllosilicates overcomes temperature limitations of prior art, which uses organically-modified layered silicates.
    Type: Grant
    Filed: March 26, 2002
    Date of Patent: May 23, 2006
    Assignee: Eikos, Inc.
    Inventors: Jeffrey L. Conroy, Joseph W. Piche, Paul J. Glatkowski, David H. Landis
  • Patent number: 6986960
    Abstract: A novel poly(arylene ether sulfone) having a sulfoalkoxy group, which has both of heat resistance and electroconductivity, is suitable as polymer electrolyte membranes used for high performance polymer electrolyte fuel cells, and does not use fluorine so that loads to the environment are small in the synthesis or disposal, a process of producing the same, and a polymer electrolyte membrane comprising the same. The poly(arylene ether sulfone) having a sulfoalkoxy group has a structural unit represented by the formula (1) mentioned hereinabove, and is produced by reacting a poly(arylene ether sulfone) having a hydroxyl group with a specific alkali metal compound and/or an organic base compound, followed by reacting with a specific sulfonating agent and then with a specific acid. A polymer electrolyte membrane is produced by film formation of the polymer.
    Type: Grant
    Filed: November 19, 2002
    Date of Patent: January 17, 2006
    Assignee: Tosoh Corporation
    Inventors: Motohiro Oguri, Ryuji Ikeda, Fumio Okisaki
  • Patent number: 6955851
    Abstract: The invention provides new compositions of matter that are capable of forming cross-linked polymeric materials upon reaction with various known epoxy-containing compositions. Thus, the compositions of this invention are useful in the manufacturing of prepregs and laminates for PWB applications among many other uses. Preferred compositions of this invention include substituted hydroxyarylphosphine oxide mixtures, the glycidyl ether derivatives, or the epoxy resin oligomer adducts derived therefrom. The materials provide for laminates that have higher glass transition temperatures, improved thermal stability, and that are free of halogen.
    Type: Grant
    Filed: December 10, 2003
    Date of Patent: October 18, 2005
    Assignee: PABU Services, Inc.
    Inventors: Mark V. Hanson, Larry D. Timberlake
  • Patent number: 6933050
    Abstract: The present invention features phosphorus containing epoxy resin compositions useful for imparting flame retardant properties to prepregs, resin-clad metal foils, and laminate boards constructed therefrom. The phosphorus containing epoxy resin composition (a) comprises a phosphorus containing epoxy resin (A) and a hardener. The phosphorus containing epoxy resin (A) has an epoxy equivalent of 300-500 g/eq. and comprises the reaction product of a phosphorus containing organic compound (B) and at least one epoxy resin (C). Phosphorus containing compound (B) is the reaction product of organic phosphorus compounds (b) having one active hydrogen atom bonded to a phosphorus atom and a quinone compound, wherein the molar ratio of (b) to quinone is from 1.25:1 to 2:1. This molar excess of (b) yields a phosphorus containing compound (B) that comprises both the reaction product of (b) and quinone, as well as un-reacted (b).
    Type: Grant
    Filed: February 6, 2003
    Date of Patent: August 23, 2005
    Assignees: Matsushita Electric Works, Ltd., Tohto Kasei Co., Ltd.
    Inventors: Takashi Sagara, Toshiharu Takata, Kiyoaki Ihara, Hidetaka Kakiuchi, Kazuo Ishihara, Chiaki Asano, Masao Gunji, Hiroshi Sato
  • Patent number: 6903180
    Abstract: This invention relates to novel epoxy resins and epoxy resin compositions comprising said epoxy resins or cured articles thereof. The cured articles have excellent properties in respect to flame retardance, adhesiveness, moisture resistance and heat resistance and can be used in applications such as lamination, molding, casting and adhesion. The epoxy resins of this invention are represented by the following formula (3) wherein Y1 denotes a glycidyloxyarylmethyl group represented by —CH2—Ar—OG, Y2 and Y3 denote independently a glycidyl group or the aforementioned glycidyloxyarylmethyl group, Ar denotes a phenylene group which can be substituted with up to two hydrocarbon groups and G denotes a glycidyl group.
    Type: Grant
    Filed: December 10, 2001
    Date of Patent: June 7, 2005
    Assignee: Nippon Steel Chemical Co., Ltd.
    Inventors: Masashi Kaji, Koichiro Ogami
  • Patent number: 6894091
    Abstract: A semiconductor encapsulating epoxy resin composition comprising (A) an epoxy resin, (B) a phenolic resin curing agent, (C) a molybdenum compound, and (D) 300-900 parts by weight per 100 parts by weight of components (A) and (B) combined of an inorganic filler contains nitrogen atoms in an amount of 1.5-20% by weight based on the weight of components (A) and (B) combined. Cured parts of the composition exhibit high-temperature capabilities and flame retardance despite the absence of halogenated epoxy resins and antimony trioxide.
    Type: Grant
    Filed: June 19, 2001
    Date of Patent: May 17, 2005
    Assignee: Shin Etsu Chemical Co., Ltd.
    Inventors: Shoichi Osada, Toshio Shiobara, Eiichi Asano, Kazutoshi Tomiyoshi, Takayuki Aoki, Shigeki Ino
  • Patent number: 6818727
    Abstract: Provided is an epoxy resin having glycidylamino group, wherein the content of hydrolyzable chlorine is 1000 ppm or less. The epoxy resin is useful for adhesives, paints and electric/electronic materials(e.g. insulation materials, laminated plate, etc.).
    Type: Grant
    Filed: May 27, 1999
    Date of Patent: November 16, 2004
    Assignee: Sumitomo Chemical Company, Limited
    Inventors: Akira Yokota, Nobuyuki Nakajima
  • Patent number: 6765043
    Abstract: An epoxy resin that contains, in a molecule, two mesogens coupled by a folded chain, is provided using a method that ensures easy synthesis of such an epoxy resin, and a uniform epoxy resin composition is provided based on this epoxy resin. The epoxy resin includes a major compound having a structure expressed by the Chemical Formula (1), and a method is provided for manufacturing the epoxy resin by reaction of (A) an epoxy resin with one mesogen contained in a molecule and (B) a compound with two elements of active hydrogen contained in a molecule, with the percentage composition of (B) active hydrogen with respect to (A) epoxy group being 0.25 and over, up to and including 0.7.
    Type: Grant
    Filed: September 19, 2002
    Date of Patent: July 20, 2004
    Assignee: Hitachi, Ltd.
    Inventors: Masaki Akatsuka, Yoshitaka Takezawa, Hisashi Morooka
  • Patent number: 6762251
    Abstract: The present invention is a thermoplastic polyhydroxypolyether resin having flame retardancy by itself represented by general formula (1), wherein phosphorus content is from 1% to 6% by weight, and weight-average molecular weight is from 10,000 to 200,000, and an insulation film produced therefrom.
    Type: Grant
    Filed: September 4, 2002
    Date of Patent: July 13, 2004
    Assignee: Tohto Kasei Co., Ltd.
    Inventors: Masao Gunji, Chiaki Asano, Hiroshi Sato
  • Patent number: 6756418
    Abstract: New polymers, compositions comprising these polymers, and methods of using these compositions are provided. The polymers comprise styrene and maleic anhydride monomers with at least some of the maleic anhydride monomers having certain functional groups bonded thereto. Preferred functional groups include those derived from adhesion promoters (e.g., 2-aminophenol), photoinitiators (e.g., 4-aminoacetophenone), and solubilizers (e.g., 4-aminobenzoic acid). The polymers can be incorporated according to conventional processes into compositions which are then used to form a color filter to be used in a liquid crystal display. The final color filter has a high resolution, is highly resistant to solvents typically used in the color filter manufacturing process, is strongly adhered to the color filter substrate, has superior optical clarity, is highly soluble in a wide range of alkali developers, and has excellent heat and UV light stability.
    Type: Grant
    Filed: June 7, 2002
    Date of Patent: June 29, 2004
    Assignee: Brewer Science Inc.
    Inventors: Gu Xu, Dan W. Brewer, Timothy Limmer, Mike Stroder, Shelly Fowler, Jonathon Mayo
  • Patent number: 6723763
    Abstract: The present invention provides a new class of materials effective as accelerators for curing anaerobic adhesives. The addition of these materials into anaerobic adhesives as a replacement for conventional curatives, such as APH and/or toluidines, surprisingly provides at higher cure speeds and comparable physical properties for the reaction products formed therefrom.
    Type: Grant
    Filed: March 15, 2002
    Date of Patent: April 20, 2004
    Assignee: Henkel Loctite Corporation
    Inventors: Qinyan Zhu, Shabbir Attarwala
  • Publication number: 20040062969
    Abstract: An object of the present invention is to obtain a novel polymeric material capable of forming a solid polymer electrolyte excellent not only in processability, solvent resistance and durability/stability but also in ion conductivity by introducing sulfonic acid group or phosphonic acid group into a polybenzazole compound having excellent properties in view of heat resistance, solvent resistance, mechanical characteristics and the like.
    Type: Application
    Filed: October 28, 2003
    Publication date: April 1, 2004
    Inventors: Yoshimitsu Sakaguchi, Kota Kitamura, Hiroaki Taguchi, Junko Nakao, Shiro Hamamoto, Hiroshi Tachimori, Satoshi Takase
  • Patent number: 6646064
    Abstract: A method for imparting flame retardance to an epoxy resin comprises reacting an epoxy resin with a phosphorus-containing dihydric phenol or naphthol derived from the reaction of 9,10-dihydro-9-oxa-10-phosphaphenanthrene-10-oxide (i.e., DOPO) with a benzoquinone or naphthoquinone.
    Type: Grant
    Filed: September 10, 2001
    Date of Patent: November 11, 2003
    Assignee: National Science Council
    Inventors: Chun-Shan Wang, Jeng-Yueh Shieh
  • Patent number: 6646016
    Abstract: Resins useful in methods of breaking oil-water emulsions. The resins obtained by reacting a compound of formula 1 with an aldehyde and alkoxylating, in any order: wherein X is —NHR1; —COOH; or —CONHR2; and is ortho—, meta— or para— to X and is a radical of —O—R3; —C(O)R4; —OC(O)R5; —NR6R7; wherein R1-R7 values are defined herein.
    Type: Grant
    Filed: May 14, 2002
    Date of Patent: November 11, 2003
    Assignee: Clariant GmbH
    Inventors: Frank Holtrup, Elisabeth Wasmund, Wolfram Baumgärtner, Michael Feustel
  • Patent number: 6627683
    Abstract: Curable compositions, reaction products of which are reworkable through thermal decomposition, are provided. Specific compounds useful in such curable compositions, as well as curable compositions and thermosets incorporating such compounds, are provided in the present invention. The compounds include a cyclic hydrocarbon moiety including an oxirane or thiirane group and an aromatic ether moiety including an oxirane or thiirane group. The cyclic hydrocarbon moiety and the aromatic ether moiety are joined to each other through an oxycarbonyl-containing linkage or a thiocarbonyl-containing linkage, preferably a secondary or tertiary linkage. Compositions incorporating such compounds are capable of curing by exposure to a specific temperature, and are decomposable at a temperature in excess of the curing temperature, thus providing a composition which is reworkable.
    Type: Grant
    Filed: September 5, 2000
    Date of Patent: September 30, 2003
    Assignee: Henkel Loctite Corporation
    Inventors: Philip T. Klemarczyk, Lie-Zhong Gong
  • Patent number: 6613849
    Abstract: The terminal glydidyl groups of a diglycidyl ether of a hydroxyaliphatic bisphenol is optionally reacted with (meth)acrylic acid to obtain a vinyl ester. The internal hydroxyaliphatic groups are reacted with (meth)acrylic acid or cyanoacrylic acid to prepare a diglycidyl and/or (meth)acrylate-terminated (meth)acrylate or urethane acrylate.
    Type: Grant
    Filed: November 16, 2001
    Date of Patent: September 2, 2003
    Assignee: The Dow Chemical Company
    Inventors: Louis L. Walker, Robert E. Hefner, Jr., Katherine S. Clement
  • Patent number: 6576690
    Abstract: The present invention relates to a phosphorous-containing flame retarding epoxy resin and their composition comprising the nitrogen-containing flame retarding epoxy resin. More specifically, the present invention relates to a flame retarding epoxy resin having a pendent phosphorous-containing functional group and their composition comprising the nitrogen-containing flame retarding epoxy resin. The flame retarding phosphorous-containing epoxy resin and the epoxy resin composition containing the same of the present invention possess excellent flame retarding property and heat resistance without containing halogen and diantimony trioxide. Therefore they are useful as an encapsulating material in the semiconductor industry and the cured article prepared from the composition exhibits excellent molding ability and excellent reliance.
    Type: Grant
    Filed: March 22, 2002
    Date of Patent: June 10, 2003
    Assignee: Chang Chung Plastics Co., Ltd.
    Inventors: Kuen-Yuan Hwang, Hong-Hsing Chen, Chih-Fu Chen
  • Patent number: 6569983
    Abstract: A water-soluble branched polyhydroxyetheramine, wherein the branched polyhydroxyetheramine is prepared by reacting an amine having two reactive hydrogen atoms with a diepoxide to form a polyhydroxyetheramine and then reacting the polyhydroxyetheramine with an N-alkylating agent, an aqueous composition comprising the branched polyhydroxyetheramine and use of the branched polyhydroxyetheramine to modify the permeability to water of a subterranean formation are disclosed.
    Type: Grant
    Filed: December 20, 2001
    Date of Patent: May 27, 2003
    Assignee: Ondeo Nalco Energy Services, L.P.
    Inventors: Duane Treybig, Kin-Tai Chang, Dennis Williams