Gravity Plunger Or Platen Patents (Class 53/99)
With drop control (Class 53/100)
  • Method of packaging compound semiconductor substrates
    Patent number: 8381493
    Abstract: Affords a compound semiconductor substrate packaging method for preventing oxidation of the surface of compound semiconductor substrates.
    Type: Grant
    Filed: March 27, 2009
    Date of Patent: February 26, 2013
    Assignee: Sumitomo Electric Industries, Ltd.
    Inventors: Takayuki Nishiura, Yoshio Mezaki, Yoshiki Yabuhara
  • Method for creating a package pressure differential
    Publication number: 20090320411
    Abstract: A method for making a two component device where the two component are in separate containers with one container inside the other. The method includes placing a first container between the top and bottom of a second container in a die that draws a vacuum between the top and bottom of the second container when they are sealed to form the container. The vacuum preferably ranges from about 8 to about 13 psi. The two components are selected to react to achieve a result, such as the generation of heat.
    Type: Application
    Filed: June 30, 2008
    Publication date: December 31, 2009
    Inventor: Raquel Carvallo