Abstract: A method of forming an optical interconnect between first and second photonic chips located on an optical printed circuit board includes applying a flexible, freestanding film onto the first and second chips so that the film extends over a gap and/or step between the chips. The film includes a photosensitive layer having a refractive index that decreases by exposure to radiation and a backing layer. The film is exposed to a flood exposure having a radiation dosage penetrating the backing layer and only a surface sublayer of the photosensitive layer. After curing the film, the backing layer is removed so that the photosensitive layer remains on the first and second chips. The photosensitive layer is selectively exposed to a second radiation dosage to define waveguide core(s) in unexposed regions of the photosensitive layer below the surface sublayer. The photosensitive layer is heated to cure the selectively exposed portions.

Abstract: In various example embodiments, hybrid waveguide devices are disclosed based on a silicon nitride waveguide conformally coated with a tellurium oxide layer. A tellurium oxide layer is deposited over a silicon nitride waveguide such that the tellurium oxide layer forms a conformal layer that inherits the underlying shape of the silicon nitride waveguide, thereby forming a conformal raised region above the silicon nitride waveguide, while also forming planar regions that extend laterally from the silicon nitride waveguide. The present example hybrid waveguide structures enable the formation of a guided single mode that extends from the raised region of the tellurium oxide layer that resides above the silicon nitride waveguide into the silicon nitride waveguide, and the dimensions of the structure may be selected such that a majority of the optical mode is confined within the tellurium oxide layer, at least over a portion of the infrared region.

Abstract: An integrated multilayer structure including a substrate film having a first side and an opposing second side; electronics including at least one light source, provided upon the first side and a number of electrical conductors, at least electrically coupled to the at least one light source which is configured to emit light in selected one or more frequencies or wavelengths; an optically transmissive element including thermoplastic optically transmissive material having a first refractive index and produced onto the first side of the substrate film so as to at least partially embed the at least one light source therewithin; and optical cladding including material having a lower refractive index than the first refractive index and provided adjacent the optically transmissive element upon the first side of the substrate film.

Abstract: Optical waveguide coupling ratios can be modified for a package by providing a substrate with a photonic circuit disposed on a first section of the substrate and a plurality of optical waveguides formed in glass disposed on a second section of the substrate, the waveguides being connected to the photonic circuit, adjacent ones of the waveguides having a fixed coupling ratio. A three-dimensional region of the glass abutting an end of one or more of the waveguides is lased to change a refractive index of the glass in each three-dimensional region, and thereby extend a length of each waveguide abutting one of the three-dimensional regions so that the coupling ratio between that waveguide and an adjacent waveguide is changed as a function of the extended length. The lasing is controlled based on feedback so that each coupling ratio changed by the lasing varies by less than a target amount.

Abstract: A method for making an interferometric taper waveguide (I-TWG) with high critical dimension uniformity and small line edge roughness for a heat assisted magnetic recording (HAMR) head, wherein the method includes creating an I-TWG film stack with two hard mask layers on top of an I-TWG core layer sandwiched between two cladding layers, defining a photoresist pattern over the I-TWG film stack using deep ultraviolet lithography, transferring the pattern to the first hard mask layer using reactive ion etching (RIE), forming a temporary I-TWG pattern on the second hard mask layer using RIE, transferring the temporary pattern to the I-TWG core using RIE, refilling the cladding layer, and planarizing using chemical mechanical planarization (CMP).

Abstract: Novel processing methods for production of high-refractive index contrast and low loss optical waveguides are disclosed. In one embodiment, a “channel” waveguide is produced by first depositing a lower cladding material layer with a low refractive index on a base substrate and a refractory metal layer. Then, an etch mask layer is deposited on the refractory layer, followed by selective etching of the refractory metal layer with a dry-etch tool with high selectivity to the etch mask layer. Then, the refractory metal layer is oxidized to form an oxidized refractory metal region, and a top cladding layer made of a second low refractive index material to encapsulate the oxidized refractory metal region. In another embodiment, a “ridge” waveguide is produced by using similar process steps with an added step of depositing a high-refractive-index material layer and an optional optically-transparent layer.

Abstract: An optical communication device includes a planar optical waveguide, a first substrate, a light emitting element, and a light receiving element. The planar optical waveguide includes a top surface and a light guide portion. The light guide portion includes a first sloped surface and a second sloped surface. The first substrate includes a mounting surface. The first substrate is supported on the top surface. An end of the first substrate defines a first receiving hole. The other end of the first substrate defines a second receiving hole. The light emitting element is received in the first receiving hole and faces the first sloped surface at about a 45 degree angle. The light receiving element is received in the second receiving hole and faces the second sloped surface at about a 45 degree angle.

Abstract: Provided are a spot size converter and a method of manufacturing the spot size converter. The method includes stacking a lower clad layer, a core layer, and a first upper clad layer on a substrate, tapering the first upper clad layer and the core layer in a first direction on a side of the substrate, forming a waveguide layer on the first upper clad layer and the lower clad layer, and etching the waveguide layer, the first upper clad layer, the core layer, and the lower clad layer such that the waveguide layer is wider than a tapered portion of the core layer on the side of the substrate and has the same width as that of the core layer on another side of the substrate.

Abstract: A downsized, low-power electro-optical modulator that achieves reducing both of the additional resistance in the modulation portion and the optical loss each caused by electrodes at the same time is provided. The electro-optical modulator includes a rib waveguide formed by stacking a second semiconductor layer 9 having a different conductivity type from a first semiconductor layer 8 on the first semiconductor layer 8 via a dielectric film 11, and the semiconductor layers 8 and 9 are connectable to an external terminal via highly-doped portions 4 and 10, respectively. In a region in the vicinity of contact surfaces of the semiconductor layers 8 and 9 with the dielectric film 11, a free carrier is accumulated, removed, or inverted by an electrical signal from the external terminal, and whereby a concentration of the free carrier in an electric field region of an optical signal is modulated, so that a phase of the optical signal can be modulated.

Abstract: An apparatus and method for compensating for mode-profile distortions caused by bending optical fibers having large mode areas. In various embodiments, the invention micro-structures the index of refraction in the core and surrounding areas of the inner cladding from the inner bend radius to the outer bend radius in a manner that compensates for the index changes that are otherwise induced in the index profile by the geometry and/or stresses to the fiber caused by the bending. Some embodiments of an apparatus and method include a fiber having a plurality of substantially parallel cores, the fiber including a straight section and a curved section; guiding signal light primarily in a second core in the straight section; guiding the signal light from the second core into a first core between the straight section and the curved section; and guiding the signal light primarily in the first core in the curved section.

Abstract: An optical device including an active core layer of silica glass doped with ions which serve as optical emitters, the active core layer being on a silica glass substrate and having a layer thickness of at least 5 ?m, and wherein the layer is sintered at a temperature range of 1500-1600 C. and subsequently heat treated by a laser.

Abstract: A solid state light having a solid state light source such as LEDs, and optical guide, and a thermal guide. The optical guide is coupled to the light source for receiving and distributing light from the light source, and the thermal guide is integrated with the optical guide for providing thermal conduction from the solid state light source and dissipating heat through convection for cooling the light.

Abstract: An optical device including an active core layer of silica glass doped with ions which serve as optical emitters, the active core layer being on a silica glass substrate and having a layer thickness of at least 5 ?m, and wherein the layer is sintered at a temperature range of 1500-1600 C and subsequently heat treated by a laser.

Abstract: Methods to fabricate an optical preform for draw into Polarization Maintaining (PM) or Polarizing (PZ) optical fiber are provided. The methods involve assembly of pre-shaped and pieced together bulk glass elements into preforms (“assembled preforms”) for simultaneous fusing and drawing into optical fiber. These preforms form a stress-induced birefringent optical core when drawn to fiber.

Abstract: The present invention, even in the case where the size of a preform itself is increased, enables production of a multi-core optical fiber in which cores are arranged with high accuracy. A plurality of core members each being rod-like are fixed by an array fixing member while a relative positional relation of the plurality of core members is fixed, and the plurality of core members and a cladding member are integrated into one piece, and thus a preform is obtained. By drawing the obtained preform, a multi-core optical fiber in which core arrangement is controlled with high accuracy is obtained.

Abstract: A production method of an optical film, including: a stretching step of stretching a film, wherein the film has a longitudinal direction, a width direction and a thickness direction, wherein the stretching is in either of the longitudinal direction or the width direction of the film; and a shrinking step of shrinking the film in either of the longitudinal direction or the width direction of the film, that is not the direction in which the film is stretched, wherein the film thickness in the thickness direction is increased as compared with the film thickness before at least one of the stretching step and the shrinking step.

Abstract: A deterministic methodology is provided for designing optical fibers that support field-flattened, ring-like higher order modes. The effective and group indices of its modes can be tuned by adjusting the widths of the guide's field-flattened layers or the average index of certain groups of layers. The approach outlined here provides a path to designing fibers that simultaneously have large mode areas and large separations between the propagation constants of its modes.

Abstract: A method for forming buried ion-exchanged waveguides involves a two-step process. In a first step a waveguide is formed at the surface of a substrate using an ion-exchange technique. After formation of the waveguide, a field-assisted annealing is carried out to move the waveguide away from the surface of the substrate so that it is buried in the substrate. Exemplary field-assisted annealing is carried out at a temperature close to the ion-exchange temperature ±10° C. to optimize results.

Abstract: Disclosed herein is a printed circuit board for an optical waveguide, including a base board, and an optical waveguide formed on the base board. The optical waveguide includes a lower clad layer formed on the base board, an insulation layer formed on the lower clad layer and having a core-forming through-hole, a core part formed on a region of the lower clad layer, which is exposed through the through-hole, and an upper clad layer formed in the through-hole and on the insulation layer.

Abstract: A channel is created within a planar layer. At least a portion of an optical path is formed within the channel. An optical core medium may be deposited into the channel. In various embodiments, reflective layers are deposited within and over the channel to form the optical path. In another embodiment, a photosensitive sheet is exposed to an optical path mask in the presence of an optical source to define an optical path lying within the plane of the sheet.

Abstract: To obtain an optical component having excellent secondary optical nonlinear properties by irradiating a surface and/or inside of glass having at least one member selected from Ni, Fe, V, Cu, Cr and Mn as a heat source material for absorbing and converting a laser beam to heat, incorporated to a glass matrix comprising at least one glass-forming oxide-selected from SiO2, GeO2, B2O3, P2O5, TeO2, Ga2O3, V2O5, MoO3 and WO3 and at least one member selected from alkali metals, alkaline earth metals, rare earth elements and transition elements, with a laser beam with a wavelength to be absorbed by the heat source material, to convert the irradiated portion to a single crystal or a group of crystal grains comprising components contained in the glass matrix and not containing the heat source material, thereby to form a pattern.

Abstract: Multi-core optical fiber ribbons and methods for making multi-core optical fiber ribbons are described herein. In one embodiment, a multi-core optical fiber ribbon includes at least two core members formed from silica-based glass and oriented in parallel with one another in a single plane. Adjacent core members have a center-to-center spacing ?15 microns and a cross-talk between adjacent core members is ??25 dB. In this embodiment each core member is single-moded with an index of refraction nc, and a core diameter dc. In an alternative embodiment, each core member is multi-moded and the center-to-center spacing between adjacent core members is ?25 microns. A single cladding layer is formed from silica-based glass and surrounds and is in direct contact with the core members. The single cladding layer is substantially rectangular in cross section with a thickness ?400 microns and an index of refraction nc1?nc.

Abstract: A magneto-optical structure is provided. The magneto-optical structure includes a substrate. A waveguide layer is formed on the substrate for guiding electromagnetic radiation received by the magneto-optical structure. The waveguide layer includes magnetic oxide material that comprises ABO3 perovskite doped with transition metal ions on the B site, or transition metal ions doped SnO2, or transition metal ions doped CeO2.

Abstract: True time delay silica waveguides and related fabrication methods are disclosed. Also disclosed are true time delay silica waveguides comprising wedged silica structures.

Abstract: There is provided a method of manufacturing an optical waveguide, the method including: allowing a beam to be incident in an optical waveguide direction of an optical waveguide material; generating an optical soliton in the optical waveguide material by adjusting intensity of the incident beam according to the optical waveguide material; allowing the incident beam to be re-incident at an intensity higher than an intensity of the incident beam after checking generation of the optical soliton in the optical waveguide material; and increasing a refractive index of an optical soliton-generating area of the optical waveguide material by the re-incident beam to thereby form an optical waveguide.

Abstract: Provided is an optical waveguide manufacturing method that makes the thickness of a clad layer in the vicinity of a core portion uniform. A first lamination film is fabricated by forming a clad layer by forming a first curable resin layer for clad formation on a first base film and curing the first curable resin layer, and forming a core portion by forming a second curable resin layer for core formation having a higher refractive index than that of the clad layer after cured on the clad layer and selectively curing the second curable resin layer. A second lamination film is fabricated by forming a clad layer by forming a third curable resin layer for clad formation on a second base film and curing the third curable resin layer.

Abstract: An optoelectric composite substrate of the present invention includes an insulating film, an optical waveguide embedded in the insulating film in a state that an upper surface is exposed from the insulating film, a via hole formed to pass through the insulating film, a conductor formed in the via hole, and a connection terminal on which an optical device is mounted and which is connected to an upper end side of the conductor, wherein the connection terminal is embedded in an upper-side portion of the via hole or is projected from the insulating film.

Abstract: A method for fabricating a distributed Bragg reflector waveguide is disclosed, which includes forming a first distributed Bragg reflector on a substrate; forming a sacrificial pattern on the first distributed Bragg reflector; forming a second distributed Bragg reflector on the sacrificial pattern and the first distributed Bragg reflector; and removing the sacrificial pattern. A distributed Bragg reflector waveguide is also disclosed.

Abstract: Devices and systems are provided for free space optical communication using optical films. Some embodiments involve using an optical film for the transmission and/or reception of light in a free space optical communication system. Some free space optical communication systems may involve devices, such as laptop computers, desktop computers, mobile communications devices, etc., that are configured for communication via an optical film. The optical film may be disposed on a device, on a wall, a window, furniture, etc., according to the implementation. Many types of free space optical communication systems are provided, including line of sight and non line of sight free space optical communication systems.

Abstract: Optical waveguide device has waveguide strip-shaped in the depth direction of the drawing and protruding from peripheral portion. A core (not illustrated) is disposed inside waveguide. Wall to be cut is integrated with waveguide to form one core layer. No unevenness occurs in a cutting line of wall indicated with broken line. Accordingly, high-precision cutting is enabled by cutting wall along the cutting line.

Abstract: A system and method for fabricating an electro-optical hybrid module (100). The electro-optical hybrid module (100) may comprise an electro-optical component, an electronic component (110), a planar light wave circuit (PLC) embedded with at least an optical waveguide (120). The electro-optical component may transmit or receive energy through a micro-folding mirror (160) while the electronic component may amplify and transfer an electric signal to the electro-optical component. The planar light wave circuit may typically provide an opto-electronic signal communication path via the plurality of optical waveguides that may be embedded in the planar light wave circuit.

Abstract: A method of making optical quality films is described. A silica film is deposited on a wafer by PECVD (Plasma Enhanced Chemical Vapor Deposition). The deposited film is then subjected to a first heat treatment to reduce optical absorption, wafer warp, and compressive stress. A second film is deposited. This step is then followed by a second heat treatment to reduce optical absorption, wafer warp and tensile stress. The two heat treatments have similar temperature profiles.

Abstract: Structures including optical waveguides disposed over substrates having a chamber or trench defined therein, and methods for formation thereof.

Abstract: The present invention is a method of fabricating a waveguide using a sacrificial spacer layer. The first step in this process is to fabricate the underlying optical semiconductor structure. A trench is then etched in this structure and a sacrificial spacer layer is deposited in the trench. The waveguide is then created in the trench on the sacrificial spacer layer. User-defined portions of the sacrificial spacer layer are subsequently removed to create air gaps between the waveguide and the sidewalls of the trench in the optical semiconductor.

Abstract: Adding at least one non-silicon precursor (such as a germanium precursor, a carbon precursor, etc.) during formation of a silicon nitride, silicon oxide, silicon oxynitride or silicon carbide film improves the deposition rate and/or makes possible tuning of properties of the film, such as tuning of the stress of the film. Also, in a doped silicon oxide or doped silicon nitride or other doped structure, the presence of the dopant may be used for measuring a signal associated with the dopant, as an etch-stop or otherwise for achieving control during etching.

Abstract: A printed circuit board and a method of manufacturing the printed circuit board are disclosed. The printed circuit board can include: an optical waveguide, in one side of which a circuit pattern and a pad are buried; an insulation layer stacked over one side of the optical waveguide; a first insulating material stacked over the insulation layer; a first electrical wiring layer stacked over the first insulating material; a second insulating material stacked over the other side of the optical waveguide; a second electrical wiring layer stacked over the second insulating material; and a via penetrating the optical waveguide. Certain embodiments of the invention enable the efficient transmission of optical and electrical signals, reduce loss in the optical signals transferred to the photoelectric converters, and allow more efficient designs for the wiring in the board.

Abstract: Thermal 3-D microstructuring of photonic structures is provided by depositing laser energy by non-linear absorption into a focal volume about each point of a substrate to be micromachined at a rate greater than the rate that it diffuses thereout to produce a point source of heat in a region of the bulk larger than the focal volume about each point that structurally alters the region of the bulk larger than the focal volume about each point, and by dragging the point source of heat thereby provided point-to-point along any linear and non-linear path to fabricate photonic structures in the bulk of the substrate. Exemplary optical waveguides and optical beamsplitters are thermally micromachined in 3-D in the bulk of a glass substrate. The total number of pulses incident to each point is controlled, either by varying the rate that the point source of heat is scanned point-to-point and/or by varying the repetition rate of the laser, to select the mode supported by the waveguide or beamsplitter to be micromachined.

Abstract: In general, in one aspect, a method includes forming conductive layers on a wafer. A through cavity is formed in alignment with the conductive layers. The through cavity is to permit an optical signal from an optical waveguide within an optical connector to pass therethrough. Alignment holes are formed on each side of the through cavity to receive alignment pins. The wafer having the conductive layers, the through cavity in alignment with the conductive layers, and the alignment holes on each side of the through cavity forms an optical-electrical (O/E) interface. An O/E converter is mounted to the metal layers in alignment with the through cavity. The alignment pins and the alignment holes are used to passively align the optical waveguide and the O/E converter.

Abstract: A reflection-type display apparatus that includes cavities dispersed on a light guide plate and is a type of flexible thin film, and a method for manufacturing a light guide plate. The reflection-type display apparatus includes: a reflection-type display; a light source provided on one side of the reflection-type display; a light guide plate bonded to the upper surface of the reflection-type display to scatter light introduced from the light source and having cavities transversely and longitudinally disposed by predetermined intervals on the upper surface thereof; and a film bonded to the upper surface of the light guide plate to protect the upper surface of the light guide plate.

Abstract: A method of manufacturing an optical board is disclosed. The method of manufacturing an optical board may include stacking an optical waveguide core layer over a first optical waveguide cladding layer, forming an inclined surface by diffracting a laser with a mask to remove a portion of the optical waveguide core layer, and stacking a reflective layer over the inclined surface.

Abstract: An optical waveguide includes: a center layer including at least two core layers whose edges are on substantially the same plane, and a first cladding layer provided between adjacent core layers; and a second cladding layer provided at least on both of front and rear surfaces of the center layer. At least surfaces of the core layer and the first cladding layer that are in contact with the second cladding layer include at least one resin selected from the group consisting of a resin having a hydroxyl group and a resin containing a silicon-silicon bond at a main chain thereof, and the second cladding layer includes a silicone resin.

Abstract: The present invention provides a method of producing an optical element without the need for high vacuum, unlike the thin film deposition methods, and without using a molten salt. More specifically, the invention provides a method of producing an optical element comprising applying a paste containing at least one compound selected from lithium compounds, potassium compounds, rubidium compounds, cesium compounds, silver compounds, and thallium compounds, an organic resin, and an organic solvent to a glass substrate containing an alkali metal component as a glass component and then performing heat treatment at a temperature below the softening temperature of the glass substrate.

Abstract: The present invention prefers to an optical device with a channel waveguide structure as well as a method of fabrication. A thin waveguide layer (2) of a fluoride glass, in particular a Zirkonium fluoride glass, especially ZBLAN, is applied on a substrate (1) and structured to form waveguide channels (7) by pressing a stamp (3) onto said layer (2). The stamp (3) is designed having cutting edges (4) formed according to desired contours of channels (7) of the waveguide structure and providing free space for displacement of material of the waveguide layer (2). The stamp (3) and/or the waveguide layer (2) are preheated to a temperature allowing the displacement of the material of the waveguide layer (2) by the cutting edges (4). The invention allows a fast and cheep production of a channel waveguide structure.

Abstract: The present invention provides an optical waveguide including: a cladding; at least one core embedded in the cladding; and a colored layer that is provided at a portion substantially overlapping with the core when viewed from a direction substantially perpendicular to the principal surfaces of the optical waveguide, and that is not in contact with the core.

Abstract: The present invention discloses a light guiding system, applied to a portable device configured with at least a keying unit; an illuminator producing incident light to illuminate said portable device. The light guiding system comprising: a light guiding structure; at least an incident portion provided on a side of the light guiding structure to receive the incident light from the illuminator; a plurality of light guiding portions to guide the incident light to the at least one keying unit; and a chemical layer provided on the light guiding structure.

Abstract: An electro-optical printed circuit board and a method of making an electro-optical printed circuit board are provided. The method comprises: forming a trench or groove on an outer surface of an electrical printed circuit board; providing optical material in the trench thereby to form an optical waveguide.

Abstract: An optical device which includes a GI-type photonic crystal slab which includes: a first member which has a distribution of refractive indexes reduced in both directions from an optical axis of incident light as to a first direction vertical to the optical axis; and a second member periodically placed in substance among the first members as to a second direction different from the first direction, wherein the distribution of refractive indexes of the first member which relates to the first direction, a thickness which relates to the first direction of the GI-type photonic crystal slab, a wavelength of the incident light and an incident end beam spot radius ?1 which relates to the first direction inside an incident end of the GI-type photonic crystal slab entered by the light of the incident light are determined to have the incident light substantially confined inside the GI-type photonic crystal slab as to the first direction.

Abstract: A system and method for fabricating an electro-optical hybrid module (100). The electro-optical hybrid module (100) may comprise an electro-optical component, an electronic component (110), a planar light wave circuit (PLC) embedded with at least an optical waveguide (120). The electro-optical component may transmit or receive energy through a micro-folding mirror (160) while the electronic component may amplify and transfer an electric signal to the electro-optical component. The planar light wave circuit may typically provide an opto-electronic signal communication path via the plurality of optical waveguides that may be embedded in the planar light wave circuit.

Abstract: Optical waveguide device has waveguide strip-shaped in the depth direction of the drawing and protruding from peripheral portion. A core (not illustrated) is disposed inside waveguide. Wall to be cut is integrated with waveguide to form one core layer. No unevenness occurs in a cutting line of wall indicated with broken line. Accordingly, high-precision cutting is enabled by cutting wall along the cutting line.

Abstract: An as-deposited waveguide structure is formed by a vapor deposition process without etching of core material. A planar optical device of a lighthouse design includes a ridge-structured lower cladding layer of a low refractive index material. The lower cladding layer has a planar portion and a ridge portion extending above the planar portion. A core layer of a core material having a higher refractive index than the low refractive index material of the lower cladding layer overlies the top of the ridge portion of the lower cladding. A slab layer of the core material overlies the planar portion of the lower cladding layer. The lighthouse waveguide also includes a top cladding layer of a material having a lower refractive index than the core material, overlying the core layer and the slab layer. A method of forming an as-deposited waveguide structure includes first forming a ridge structure in a layer of low refractive index material to provide a lower cladding layer.