Abstract: A system and method for measuring the R-value of thermal insulation. The temperature difference between the insulation surface and the surrounding air layer is measured, as is the temperature difference between the air at the outer and inner surface of the insulation. Using these measurements and the resistance value of the surrounding air layer, the R-value of the insulation is calculated.

Abstract: Method of determining the melt mass flow rate of an ethylene polymer in the polymerization of ethylene or of ethylene with further comonomers, which is carried out at temperatures of from 140° C. to 350° C. and pressures of from 40 MPa to 350 MPa in a reactor to form the ethylene polymer and the ethylene polymer is subsequently cooled in a heat exchanger, which comprises: a) establishment of a correlation between the thermal conductivity of the ethylene polymer in the heat exchanger and the melt mass flow rate of the ethylene polymer, with the individual measurements each being carried out at an essentially constant melt mass flow rate, b) measurement of the thermal conductivity of an ethylene polymer in the heat exchanger c) calculation of the melt mass flow rate from the thermal conductivity measured in b) and the correlation established in a).

Abstract: The invention relates to the field of micro- and nanotechnologies. In these techniques, it is sometimes necessary to glue several structures face to face and it is important to be able to check the alignment of the structures. A new method for measuring alignment, which comprises the following operations, is proposed for this purpose: activation of a heating element placed on the surface of the first structure, generation of electronic signals representative of a distribution of temperatures, on the basis of an array of temperature sensitive elements placed on the surface of the second structure, determination of a relative position of the heating element with respect to the array of sensitive elements, therefore of the first structure with respect to the second, on the basis of the distribution of temperatures, in a calculation circuit receiving the electronic signals engendered in the array of sensitive elements.

Abstract: Systems, program product, and methods to estimate and manage flowing fluid characteristics of a fluid stream flowing through a pipeline in real-time, are provided. A system can include a vertically oriented extent of a pipeline for transporting crude oil, a pair of spaced vertically apart sensors or sensor assemblies connected to a bypass line interfaced with or positioned across the vertically oriented extent of the pipeline to obtain pressure and temperature readings of the crude oil flowing through the pipeline, a controller in communication with the pair of sensors or sensor assemblies, and crude oil analysis and management program product stored in the memory of the controller and adapted to determine or estimate density, specific gravity, and API gravity of the crude oil to thereby manage flowing fluid characteristics of the crude oil.

Abstract: A system and method for automatic analysis of temperature transition data over an area of a sample surface. The system relies on the use of a microfabricated probe, which can be rapidly heated and cooled and has a sharp tip to provide high spatial resolution. The system also has fast x-y-z positioners, data collection, and algorithms that allow automatic analysis of and visualization of temperature transition data.

Abstract: A method for monitoring the efficiency of a heat exchanger is provided. Heat flows from a first medium into a second medium and an actual heat flow is detected and compared with at least one reference heat flow corresponding to a respectively predetermined degree of soiling of the heat exchanger. Furthermore, a device for controlling a plant having at least one heat exchanger is described. The plant has a storage device storing at least one reference heat flow of the heat exchanger.

Abstract: A temperature compensating fluid flow sensing system is provided that comprises a resistance-based sensor element that is included in a constant voltage anemometer circuit configured to establish and maintain a command voltage across the first sensor element and to provide a constant voltage anemometer (CVA) output voltage corresponding to the resistance change in the first sensor element due to heat transfer between the first sensor element and the fluid. A controller is configured to establish the command voltage based on a desired overheat across the sensor and an actual overheat across the first sensor element. A power dissipation (PDR) module is configured to determine at least one fluid flow parameter and an actual overheat value based at least in part on the CVA output voltage and to transmit to the controller the actual overheat for use by the controller in updating the command voltage.

Abstract: A surveyor carries a terminal device 200 and travels to a survey point preliminarily instructed. The surveyor obtains survey position information by using a GPS unit in the terminal device 200 at the survey point. The surveyor also photographs an object of a survey by using a camera in the terminal device 200 at the survey point. After completion of a series of surveys, the surveyor transmits survey results including the survey position information to an analyzing apparatus 100 by using the terminal device 200. The analyzing apparatus 100 determines reliability by using survey position information included in the survey results and carries out a predetermined analysis by using a survey result of high reliability. Consequently, a survey result of low reliability can be eliminated from objects to be analyzed.

Abstract: The present invention provides a method for measuring the PN-junction temperature of a light-emitting diode (LED), which uses a reference voltage to establish the function of current, real power, power factor, or driving-time interval on temperature. The initial and thermal-equilibrium values of current, real power, power factor, or driving-time interval are measured, and hence the variations thereof are calculated. Referring to the pre-established function, the temperature change is given. By the temperature change and the initial temperature, the PN-junction temperature of the LED is thereby deduced.

Abstract: A method and corresponding system is provided for determining fluid properties of a two phase fluid flowing through various portions of a wellbore. Specifically, the method and corresponding system determines fluid properties (e.g. enthalpy flux) of the two phase fluid flowing upstream of the injector portion of the wellbore as well as fluid properties (e.g., mass flow rate and enthalpy flux) of the two phase fluid at various measurement locations along the injector.

Abstract: In order to measure specific heat, the measurement time is very long and the instrument is very expensive. The specific heat may be calculated based on the thermal time constant obtained from the change of the sample temperature when the predetermined amount of sample with known density at the first temperature is introduced in the environment at the second temperature. This measuring method can use the oscillatory densitometer. The predetermined amount corresponds to the volume of the sample to be introduced in the oscillatory densitometer, the density is a measurement result of the oscillatory densitometer, and the thermal time constant corresponds to the time constant of the oscillation period of the oscillatory densitometer.

Abstract: A method of stably controlling the temperature of a sample placed on a sample stage to a desired temperature by estimating a sample temperature accurately, the sample stage including a refrigerant flow path to cool the sample stage, a heater to heat the sample stage, and a temperature sensor to measure the temperature of the sample stage. This method comprises the steps of: measuring in advance the variation-with-time of supply electric power to the heater, temperature of the sample, and temperature of the temperature sensor, without plasma processing; approximating the relation among the measured values using a simultaneous linear differential equation; estimating a sample temperature from the variation-with-time of sensor temperature y1, heater electric power u1, and plasma heat input by means of the Luenberger's states observer based on the simultaneous linear differential equation used for the approximation; and performing a feedback control of sample temperature using the estimated sample temperature.

Abstract: A method for characterizing thermomechanical properties of an organic substrate includes the steps of: receiving an image of the substrate, the image including a geometric description of the circuit layers of the substrate; selecting a given one of the circuit layers for processing; converting the image to a 2-D FEM image of the given circuit layer; repeating the steps of selecting a given one of the circuit layers and converting the image to a 2-D FEM image of the selected layer until all of the layers have been processed; combining all of the 2-D FEM images corresponding to the layers to form a 3-D FEM image representing at least a portion of the substrate; determining a coefficient of thermal expansion (CTE), modulus and/or Poisson's ratio of the 3-D FEM image; and constructing a 3-D representation of the substrate as a function of the CTE, modulus and/or Poisson's ratio of the 3-D FEM image.

Abstract: The invention relates to a method and a system for detecting the risk of icing on aerodynamic surfaces lapped by a fluid flow (F), in particular on load-bearing surfaces of fluid machines, of the type comprising a temperature sensor (20). The system is characterized in that the temperature sensor (20) is located close to the aerodynamic surface (5S) to be monitored for detecting the temperature of the surface (5S), and that the system comprises a rain sensor (30) located close to the surface (5S) for detecting the presence of water on said surface (5S). The system can thus detect the risk of icing on aerodynamic surfaces in a very effective, simple and inexpensive manner.

Abstract: The board warp analysis method includes, in board warp calculation based on model data including at least a configuration and an elastic constant of a board and an electronic component including various kinds of parts which is mounted on the board, the processing of dividing a temperature profile indicative of a relationship between a temperature and a time with respect to the electronic component by a predetermined time, obtaining a relaxation elastic modulus of the electronic component corresponding to the divisional time by shifting on a time base of a master curve related to the electronic component which is composed with respect to a reference temperature based on a temperature-time conversion rule, calculating a curing degree of the electronic component based on a relationship between a time after shift and an actually applied temperature, and analyzing a warp of the electronic component based on a relaxation elastic modulus on the master curve corresponding to the curing degree or a relaxation elastic

Abstract: A thermal inspection method is provided for a component comprising at least one complex internal passage arrangement defining at least one opening. The thermal inspection method includes flowing a fluid through the at least one complex internal passage arrangement. The fluid has an initial temperature that differs from an initial temperature of the component. The thermal inspection method further includes measuring a thermal response of the component to the fluid flow and analyzing the thermal response to determine a number of heat transfer coefficients {hlmn} corresponding to respective locations {l,m,n} within the complex internal passage arrangement. The thermal inspection method further includes using the heat transfer coefficients {hlmn} to determine at least one of (a) a flow rate through respective ones of the at least one opening, and (b) a cross-sectional area for respective ones of the at least one opening.

Abstract: An apparatus comprises a matrix of thermoelectric devices for applying thermal gradients across an electronic component mounted in a PCB substrate within an enclosed housing. A matrix of thermosensitive devices are placed around the perimeter of the electronic component to measure thermal gradients associated with the component. A controller controls the matrix of thermoelectric devices based on the thermal gradients measured by the matrix of thermosensitive devices with a matrix of thermocouple coefficients.

Abstract: Modeling a plurality of fabric layers on a subject to predict thermal strain. The computerized model combines subject data, fabric data, and environmental conditions to simulate the thermal comfort of the subject over time. In an embodiment, a user interface enables a user to modify or define the input data to compare the predicted thermal comfort of different garments under the same working conditions.

Abstract: A method of identifying, from an aerial thermal image (1) of a plurality of buildings within a predetermined area, those buildings having relatively low thermal efficiency, comprises performing ground-based measurements (2, 3) indicative of the thermal efficiency of a sample of the buildings; correlating (4) the ground-based measurements (2, 3) with the aerial thermal image (1) and estimating (6), on the basis of the correlation (5), which ones of the buildings, other than those of the sample, have relatively low thermal efficiency.

Abstract: An MRI apparatus is provided in which a heat quantity penetrating into the helium tank of a superconducting magnet can be grasped to select a cryo-cooler to be incorporated, whereby consumption of liquid helium is suppressed and a static magnetic field is generated stably. The superconducting magnet includes a superconducting coil, containers 209 and 203 for accommodating the superconducting coil and a refrigerant, a cooler 208 for liquefy gas once again, the gas having been obtained by vaporizing the refrigerant in the containers, and a means for measuring the amount of vaporized refrigerant, while keeping the pressure in the containers at a constant level. The heat quantity penetrating into the containers and the coolability of the cooler are measured accurately, thereby enabling a combination in which the coolability of the cooler to be combined has capacity more than the heat penetration amount.

Abstract: Electrical components which substantially dissipate the power provided them in the form of heat will change temperature in response to self heating, heat transfer to their surroundings, and heat transferred from one component to another. A method is disclosed for calculating the temperature of a component(s) using a thermal model. In one embodiment the power dissipation of each component is controlled to limit the temperature of the component. In one embodiment the temperature of a component is modified by changing the power dissipation of another component. In some embodiments the power dissipation of a component is modified by modifying its performance. In another embodiment power dissipation is modified by selecting one or more programs for modified execution.

Abstract: A measuring apparatus for measuring the thermal resistance of a heat dissipating device, the heat dissipating device includes a fan and a heat sink. The measuring apparatus includes a base, and a fixing member. The base receives a heat element and the heat sink therein. The base includes a bottom wall, and two opposite sidewalls perpendicular to the bottom wall. The fixing member is placed on the heat sink, and two ends of the fixing member are slidably connected to the sidewalls of the base. A plurality of groups of fixing holes is defined in the fixing member for fixing different size fans.

Abstract: A temperature sensor for measuring temperature in accordance with a time-of-life of a fluorescent light that is produced by a fluorescent material, and is provided with a light source for imaging an excitation light, a fluorescent material for producing fluorescent light by the excitation light, a photoreceptor element for detecting the fluorescent light and outputting a fluorescent light signal in accordance with the fluorescent light intensity, and a signal processing circuit for calculating a temperature based on the fluorescent light signal from the photoreceptor element, where the signal processing circuit calculates integral values for the fluorescent light signals in the respective intervals A through C that have identical time durations, and then, based on the integral values, for two intervals, calculates a difference value, and then calculates a ratio of two difference values, to be a variable that varies in accordance with the temperature, and then references the relationship between the temperatur

Abstract: A detector device of the present invention detects densities of components, such as gasoline and ethanol, contained in mixture fuel even when some water is included in the mixture fuel. The detector device includes a sensor having a pair or electrodes, an electronic device for calculating the densities and a memory device for storing permittivities of pure components including water measured beforehand. Alternating current having two different frequencies f1, f2 is applied to the pair of electrodes immersed in the mixture fuel to detect the permittivities of the mixture fuel under f1 and f2. The two frequencies, f1 and f2, are so chosen that the premittivities of gasoline and ethanol show no change between f1 and f2, while the permittivitiy of water shows a substantial difference between f1 and f2. The electronic device calculates the densities of the components based on permittivities of the mixture fuel detected by the sensor and those of components stored in the memory device.

Abstract: The specific heat capacity (cp) of a medium is determined using a calorimeter with a reactor (1), a stirrer (3), a first thermostat for providing an inner heat balance, a second thermostat, means for providing an outer heat balance and a central control unit (35). The method uses the steps of: applying a modulated energy profile to the medium, inside the reactor (1), under near isothermal conditions; monitoring the resulting energy changes of: the medium, the reactor (1), the first thermostat, the second thermostat and/or the outer heat balance means as a function of time; determining the respective inner and outer heat balances independently from each other at predefined time intervals; and calculating the overall heat transfer coefficient (UA) and the specific heat capacity of the medium (cp) simultaneously and independently from each other as a function of time from the inner and outer heat balances.

Abstract: Correction of delay-based metric measurements using delay circuits having differing metric sensitivities provides improved accuracy for environmental and other circuit metric measurements that used delay lines. A delay line measurement, which may be a one-shot measurement or a ring oscillator frequency measurement is performed either simultaneously or sequentially using at least two delay lines that have differing sensitivities to a particular metric under measurement. A correction circuit or algorithm uses the measured delays or ring oscillator frequencies and corrects at least one of the metric measurements determined from one of the delays or ring oscillator frequencies in conformity with the other delay or ring oscillator frequency. The delays may be inverter chains, with one chain having a higher sensitivity to supply voltage than the other delay chain, with the other delay chain having a higher sensitivity to temperature.

Abstract: A system includes an input and a thermal data processing module. The input receives a first oil temperature of an engine oil when an engine is turned on. The thermal data processing module estimates a first heat transfer from a piston of the engine to the engine oil. The thermal data processing module estimates a second heat transfer from the engine oil to an engine block of the engine. The thermal data processing module determines a second oil temperature of the engine oil based on the first oil temperature and the first and second heat transfers.

Abstract: A device and method for investigating phase transformation properties and structural changes of materials. In one form, the device simulates actual thermal processing conditions, while the method can be used in both simulations as well as in actual processing conditions. An analysis using at least one of the device and method is referred to as a single sensor differential thermal analysis, as it compares the temperature recorded in a measured specimen against a reference thermal history without requiring the derivation of the reference thermal history from measured reference temperatures.

Abstract: Systems and methods for evaluating the properties of fluids are described. One embodiment of the invention includes a printed wiring board substrate on which a first conductivity sensor and a second conductivity sensor are located, a temperature sensor mounted on the printed wiring board substrate and a casing partially encapsulating the printed wiring board substrate so as to leave at least the first and second conductivity sensors exposed.

Abstract: A method of operating a data processing system includes predicting values for a set of thermal sensors based on an assumed inlet air temperature and a selected configuration state. Additional values are predicted for a plurality of assumed inlet air temperatures and a plurality of configuration states. Actual thermal sensor values are then determined. A measure of the difference between each set of predicted values and the set of actual values is determined and, based thereon, a most likely configuration state is identified. The plurality of thermal sensors preferably includes an inlet air thermal sensor suitable for determining air temperature at an inlet to the system. The configuration states includes a state in which one of the thermal sensors is malfunctioning. The measure of difference is determined by squaring a difference between each actual thermal sensor values and a corresponding predicted thermal sensor value and summing the squares.

Abstract: The present invention includes a method for performing a thermal analysis, including the steps of determining size and placement of each of a plurality of drivers on an integrated circuit device. The determined size and placement of each driver is stored as layout data and the layout data is converted into input for a finite element analysis program. The input is applied to the finite element analysis program, and the finite element analysis program is used to construct a finite element mesh of the integrated circuit device from the input. Additionally, material properties are assigned to the finite element mesh, and a thermal analysis is performed of the finite element mesh to generate data in a thermal analysis report.

Abstract: An electronic thermometer is configured for ease and accuracy in construction. A probe of the thermometer includes a flex circuit containing electronic components used to measure temperature and transmit signals to a calculating unit of the thermometer. A locating member supported by the probe can function to pre-position the flex circuit prior to final fixation so that the electronic components are reliably positioned in manufacture.

Abstract: A transistor circuit with estimating parameter error and temperature sensing apparatus using the same are provided. The temperature sensing apparatus measures and calculates a parameter error of transistor which is driven by different currents in advance. And the temperature sensing apparatus compensates an error occurred during temperature measurement using the acquired the parameter error so as to obtain an accurate environment temperature.

Abstract: Described is a technique to exhaustively enumerate the thermodynamic properties of the water molecules solvating the active site of a protein in its apostate and calculate the relative binding affinities of congeneric compounds that bind to this protein. The subject matter includes sampling the configurations of the solvating water in the active site; extracting the thermodynamic information about the solvating water from these configurations by clustering the observed water configurations into regions of high water occupancy (e.g.

Abstract: In a system for performing a dual mode single temperature trim upon an electronic device to remove combined mismatch and process variation errors, a dynamic element matching control is configured for enabling dynamic element matching of components of the electronic device. A process trim module is configured for performing a process trim to remove a temperature dependant error from the electronic device while the dynamic element matching is enabled within the electronic device. A mismatch trim module is configured for performing a mismatch trim to remove a mismatch error from the electronic device after the process trim has been performed. The mismatch trim is performed on a portion of the electronic device for which the dynamic element matching has been disabled. Additionally, the mismatch trim is performed at substantially an equivalent temperature to a temperature at which the process trim was performed.

Abstract: One of the thermal transmission rates that represent thermal transmission from gas to steam in a heat exchanger constituting a boiler is calculated based on thermal conductivity rate of pipes and thermal transfer of steam and gas, and the other is compared with the thermal conductivity rate calculated based on the thermal conductivity rate of the pipes and thermal transfer rate of steam and gas.

Abstract: A work piece 1 mounted on a movable table 22 is rotated while adjusting cutting depths of a grinding wheel 23 by means of feed motor so as to perform cylindrical grinding. During the cylindrical grinding, a thermocouple 42 is pushed to and caused to contact the rotating cylindrical grinding surface 1a of the work piece 1 at a constant pressure and thermoelectromotive force generated by the thermocouple 42 is measured. Surface roughness data corresponding to the measured thermoelectromotive force are obtained on the basis of the thermoelectromotive data obtained by the measurement and correlation between thermoelectromotive force and surface roughness concerning a known standard surface previously obtained and memorized. The surface roughness data are output and displayed on a display section. Therefore, an in-process measurement of surface state of the work piece 1 can be performed, while the machining such as cylindrical grinding is being carried out.

Abstract: An apparatus and method of measuring a parameter associated with a sample is provided. The method includes providing a probe adapted to heat the sample and applying a measuring current having a frequency ?1 to the probe. In operation, the method measures the amplitude of the voltage across the probe at a frequency ?1. This amplitude is indicative of a temperature of the probe. The preferred embodiment also provides a method of separating contamination of the thermal data caused by the probe from thermal data associated with the sample under test.

Abstract: A method and related system for determining energy savings that result from improvements made to a structure includes auditing the structure before the improvements are made to create a mockup of a section of the unimproved structure. The structure is then fully improved, and the mockup is disposed near a region of the improved structure that is to be monitored. The mockup may be thermally isolated from the improved region. An energy-related value, such as temperature, is then measured from the mockup and from the improved region of the structure. The mockup provides a baseline value, while the improved region provides a post-improvement value. Utilizing these measured values, the energy savings resulting from the improvement made to the structure can be determined.

Abstract: A method and related system for determining energy savings that result from improvements made to a structure includes auditing the structure before the improvements are made to create a mockup of a section of the unimproved structure. The structure is then fully improved, and the mockup is disposed near a region of the improved structure that is to be monitored. The mockup may be thermally isolated from the improved region. An energy-related value, such as temperature, is then measured from the mockup and from the improved region of the structure. The mockup provides a baseline value, while the improved region provides a post-improvement value. Utilizing these measured values, the energy savings resulting from the improvement made to the structure can be determined.

Abstract: A calorimetric measuring device as subject of the present invention, for qualitative or quantitative analysis of the enthalpy of a buffer and one or more reagents, comprises a first open calorimeter for to receiving a buffer solution and one or more reagents, and a second open calorimeter for receiving a reference buffer solution. The calorimetric measuring device further comprises a means for registration of a signal being function of the temperature difference between the first open calorimeter and the second open calorimeter.

Abstract: Methods and systems of the invention are directed to a temperature sensor that includes a substrate, a first conductive plate, and a second conductive plate. The substrate is formed of a material having a low coefficient of thermal expansion (CTE). The first conductive plate is formed of a material having a CTE that is higher than the CTE of the substrate, and is attached to a first surface of the substrate. The second conductive plate is rotatably connected to the substrate through a hinge, and includes a portion that is adjacent to the first conductive plate.

Abstract: An apparatus is provided for determining thickness and thermal conductivity for an insulative coating disposed on a substrate in an object. The apparatus includes a source for rapidly applying a multiple optical pulses on a surface of the object, where the surface comprises the insulative coating. The system further includes a recording system configured to collect data representative of the propagation of the optical pulses in the object. The apparatus further includes a processor coupled to the recording system and configured to receive the data from the recording system and configured to determine a thickness value and a thermal conductivity value for the insulative coating.

Abstract: A technique for quickly determining the type of liquid in a container externally regardless of the material of the container, preferably contactlessly. A halogen heater 102 and an infrared thermopile 103 are disposed outside an electrically conductive container 101 made of aluminum, for example. The surface temperature of the container 101 is measured when the halogen heater 102 is off, followed by the turning-on of the halogen heater 102 for two seconds, for example. The surface temperature of the container 101 is then measured, and a difference from the previous result of measurement is calculated. If the difference is smaller than a threshold value, the liquid in the container is determined to be a safe liquid consisting primarily of water, and a blue lamp is activated. If the difference is greater than the threshold value, the liquid in the container cannot be determined to be a safe liquid consisting primarily of water, and a red lamp is activated, indicating abnormality.

Abstract: The present invention relates to an apparatus and a process for locating and for measuring variations in temperature and/or in degree of fouling over the internal suface of equipment.

Abstract: The present invention has an object for setting thermal resistance corresponding to a contact condition of a contact face between two elements automatically and generating analysis data including a thermal conductivity of the contact face accurately in a short time when analysis data is generated based on three-dimensional design data of an object formed by a plurality of elements. An apparatus according to the present invention includes a retaining unit for retaining thermal resistance information for obtaining thermal resistance of the contact face in accordance with contact condition of the contact face; a thermal conductivity calculating unit for calculating a thermal conductivity of the contact face based on the thermal resistance information which is retained in the retaining unit and corresponds to the contact condition of the contact face set by a contact condition setting unit; and a generating unit for generating the analysis data including the thermal conductivity.

Abstract: The present invention relates to a temperature sensing device with a first temperature sensor mounted to a housing at a first location proximate a first surface of the housing. The first temperature sensor senses a first temperature while a second temperature sensor senses a second temperature. A processor circuit is coupled to the first and second temperature sensors and a mounting device is coupled to either the housing or the processor circuit. The mounting device mounts the second temperature sensor at a second location proximate a second surface of the housing which is spaced apart from the first surface. The processor circuit is configured to estimate a third temperature based on the first and second temperatures and a distance between the first and second locations which is an estimate of a temperature at a third location.

Abstract: A computer implemented method, data processing system, and computer usable code are provided for generation of hardware thermal profiles for a set of processors. Sampling is performed of the thermal states of the set of processors during the execution of a set of workloads to create sampled information. The sampled information and thermal characteristics of the set of processors are combined and a thermal index is generated based on the sampled information and characteristics of the set of processors.

Abstract: A system, method and program product for determining the integrity of a faraday system are disclosed. The invention uses a computer infrastructure to control an automatic determination of a faraday system integrity, when the faraday system is not in operation. The determination is based on the variations on an impedance of the faraday system. An impedance of a faraday system is determined based on the discharge characteristics of a capacitor that discharges through the faraday system.

Abstract: An information processing apparatus provides control of power consumption of multiple central processors. The apparatus includes, sections for: measuring temperature of each central processor; calculating halt percentage for each of the central processors from measured temperatures halt percentages and a particular thread executed in each of the central processors; transitioning to a wait state in which a central processor executes another thread during a predetermined wait period or a running state in which an internal halt instruction is executed causing the central processor to halt processing in accordance with the halt percentage; and interrupting each of the central processors and causing a central processor that is halting processing to resume processing.