Strain Gauge Patents (Class 73/726)
  • Patent number: 8001844
    Abstract: A high-temperature pressure sensor element for power units includes a substrate, in which an interior space is developed, a deformable membrane, which separates the interior space from the exterior space in order to deform when the exterior pressure changes, and a strain measuring element, which is arranged on the membrane, for measuring the deformation of the membrane. The substrate, the membrane, and the strain measuring element are manufactured from the same high-temperature-stable material, such as an alloy. By way of example a nickel base alloy may be used. A component for a power unit, such as a turbine blade for an airplane or rocket engine, includes an integrated high-temperature pressure sensor element of this type.
    Type: Grant
    Filed: March 1, 2007
    Date of Patent: August 23, 2011
    Assignee: Astrium GmbH
    Inventors: Soeren Fricke, Gerhard Mueller, Alois Friedberger, Eberhard Rose, Thomas Ziemann, Ulrich Schmid, Dimitri Telitschkin, Stefan Ziegenhagen
  • Patent number: 7954994
    Abstract: A combined pressure and temperature sensor for recording the pressure and the temperature of a medium. The combined pressure and temperature sensor includes a sensor element in which at least one channel is developed for accommodating a temperature sensor and at least one channel is developed for recording a pressure. The at least one channel, for recording a pressure, opens out under a pressure sensor. The at least one channel for the temperature sensor runs centrically in the sensor element.
    Type: Grant
    Filed: November 9, 2006
    Date of Patent: June 7, 2011
    Assignee: Robert Bosch GmbH
    Inventors: Stefan Warth, Oliver Stoll, Christian Roesser, Markus Ledermann, Joerg Engelhardt
  • Patent number: 7926353
    Abstract: A semiconductor device includes a first sensor element in a first branch of a Wheatstone bridge and a second sensor element in a second branch of the Wheatstone bridge. The semiconductor device includes a first reference element in the first branch and a second reference element in the second branch. The semiconductor device includes a circuit configured to switch the first sensor element to the second branch and the second sensor element to the first branch.
    Type: Grant
    Filed: January 16, 2009
    Date of Patent: April 19, 2011
    Assignee: Infineon Technologies AG
    Inventor: Dirk Hammerschmidt
  • Patent number: 7918137
    Abstract: There is described a temperature compensation scheme for a pressure sensitive metal diaphragm transducer. The transducer employs a Wheatstone bridge fabricated from p-type piezoresistors. The Wheatstone bridge is glassed directly onto the metal diaphragm. As the temperature of operation increases, the diaphragm exhibits a temperature variation of the Modulus of Elasticity. The Modulus of the metal diaphragm decreases with increasing temperature. Because of this, the same pressure applied to the metal diaphragm causes it to deflect further, which in turns causes increased strain applied to the bridge. Because of this effect, the sensitivity of the transducer increases with increasing temperature. A resistor is now placed in series with the Wheatstone bridge. The resistor is in series with the biasing voltage and because the TCS of the diaphragm is of an opposite sign, the series resistor has an even higher TCR in series with the bridge.
    Type: Grant
    Filed: February 6, 2009
    Date of Patent: April 5, 2011
    Assignee: Kulite Semiconductor Products, Inc.
    Inventors: Anthony D. Kurtz, Joseph Van DeWeert, Boaz Kochman
  • Patent number: 7861596
    Abstract: An airflow detecting system includes a tubular structure having an inner surface defining an interior of the tubular structure, one open end and an opposite open end. The tubular structure is configured to receive and expel air through both the one end and the opposite end. The system further includes a flap connected to the inner surface of the tubular structure by a hinge. The flap is configured to impede airflow within the interior of the tubular structure upon the application of differential pressure across the two ends of the tubular structure. The system further includes a device attached to the flap in a position in which the device spans the hinge. The device is configured to measure a parameter associated with the movement of the flap in response to airflow within the interior of the tubular structure. Other embodiments and methods are further disclosed.
    Type: Grant
    Filed: January 28, 2009
    Date of Patent: January 4, 2011
    Assignee: American Power Conversion Corporation
    Inventor: John H. Bean, Jr.
  • Patent number: 7856886
    Abstract: A pressure sensor includes: a diaphragm having a pressure-receiving portion receiving a pressure and a thick portion adjacent to the pressure-receiving portion; and a pressure sensitive element having a first and a second ends facing each other. The pressure sensitive element extends in a direction intersecting the thick portion and the first end of the pressure sensitive element is bonded to a pressure-receiving surface of the pressure-receiving portion, and a central portion of a portion at which the pressure-receiving portion and the first end are bonded is positioned at a side closer to the second end of the pressure sensitive element than a center of the pressure-receiving portion.
    Type: Grant
    Filed: April 21, 2008
    Date of Patent: December 28, 2010
    Assignee: Epson Toyocom Corporation
    Inventor: Toshinobu Sakurai
  • Publication number: 20100319461
    Abstract: A multipurpose transducer for an appliance using water, like a washing machine, a dishwasher or a hot-water tank converts physical parameters like water temperature, cleanness and pressure in said appliance into electric signals. It is provided with a temperature transducer (TT), a turbidity transducer (TurbT) and a pressure transducer (PT), all of them being fixed on an electrically insulating mounting support (MS). The pressure transducer (PT) is made as an uncompensated strain gauge in a thick film technology. The temperature transducer (TT) made as a termistor is also manufactured in the thick film technology. The multipurpose transducer (MPT) of the invention requires less work steps to be manufactured, mounted and connected in the appliance of said type than earlier transducers.
    Type: Application
    Filed: December 29, 2008
    Publication date: December 23, 2010
    Applicant: ILLINOIS TOOL WORKS INC.
    Inventor: Klemen Dobravec
  • Patent number: 7823456
    Abstract: A pressure sensor is provided with a carrier (2), which in an inner region includes a membrane (4) on which at least one first measurement element (R1?) for detecting a pressure impingement of the membrane (4) is arranged. Additionally, at least one second measurement element (R3?) for detecting a pressure impingement of the membrane (4) is arranged on the membrane. The first measurement element (R1?) and the second measurement element (R3?) are arranged distanced differently far from the edge of the membrane. The output signals of the first and the second measurement element (R1?, R3?) are evaluated together in a manner such that the two measurement elements (R1?, R3?) detect a differential pressure acting on the membrane (4), and thereby compensate the influence of the system pressure acting on both sides of the membrane (4).
    Type: Grant
    Filed: March 17, 2009
    Date of Patent: November 2, 2010
    Assignee: Grundfos a/s
    Inventors: Jens Peter Krog, Casper Pedersen, Carsten Christensen
  • Publication number: 20100217541
    Abstract: An apparatus for measuring a static pressure inside a component is provided. The apparatus includes a housing coupled to the component, the housing includes a moveable component disposed therein, the moveable component operably extendable into the component and retractable from the component in response to the static pressure inside the component: and a sensor disposed in the housing and thermally protected from fluids inside the component, the sensor is configured to enable the determination of the static pressure inside the component.
    Type: Application
    Filed: February 23, 2009
    Publication date: August 26, 2010
    Applicant: GENERAL ELECTRIC COMPANY
    Inventor: James Anthony West
  • Patent number: 7775117
    Abstract: A combined wet-wet differential transducer and a gage pressure transducer located in the same housing, comprising a semiconductor chip which comprises a gage sensor chip on one section and a differential sensor chip on a second section. Lach sensor chip has a Wheatstone bridge comprising piezoresistors and is responsive to an applied pressure. The gage chip and the differential chip are placed in a header having a front section and a back section adapted to receive a first and second pressure, respectively. A central section adjoins the front and back sections to form an H shaped header. The sensors are in communication with first and second pressure ports such that the absolute sensor provides an output indicative of a pressure applied to a first port and the differential sensor provides an output indicative of the pressure difference between the first and second pressure ports.
    Type: Grant
    Filed: December 11, 2008
    Date of Patent: August 17, 2010
    Assignee: Kulite Semiconductor Products, Inc.
    Inventor: Anthony D. Kurtz
  • Publication number: 20100186517
    Abstract: An airflow detecting system includes a tubular structure having an inner surface defining an interior of the tubular structure, one open end and an opposite open end. The tubular structure is configured to receive and expel air through both the one end and the opposite end. The system further includes a flap connected to the inner surface of the tubular structure by a hinge. The flap is configured to impede airflow within the interior of the tubular structure upon the application of differential pressure across the two ends of the tubular structure. The system further includes a device attached to the flap in a position in which the device spans the hinge. The device is configured to measure a parameter associated with the movement of the flap in response to airflow within the interior of the tubular structure. Other embodiments and methods are further disclosed.
    Type: Application
    Filed: January 28, 2009
    Publication date: July 29, 2010
    Applicant: AMERICAN POWER CONVERSION CORPORATION
    Inventor: John H. Bean, JR.
  • Patent number: 7748276
    Abstract: A manufacturing method of a pressure sensor that includes a pressure detector having a bottomed cylindrical member with a bottom including a thin-wall portion and a strain detecting mechanism provided on one side of the bottom for detecting a strain of the bottom and a pressure-introducing joint for introducing the fluid to be measured into the bottomed cylindrical member is provided. The method includes: first welding for butt-welding an end of the cylindrical portion of the bottomed cylindrical member and an end of the pressure-introducing joint; and second welding for welding the pressure-introducing joint in parallel to a first weld bead formed by the first welding.
    Type: Grant
    Filed: September 5, 2008
    Date of Patent: July 6, 2010
    Assignee: Nagano Keiki Co., Ltd.
    Inventors: Yoshikazu Kaneko, Hiroshi Kodama, Hiroshi Wakabayashi
  • Publication number: 20100099008
    Abstract: A pressure sensor adapted to provide a high resolution at a low pressure and a high pressure of an operating range is provided. The pressure sensor includes a body having an interface sur ace, a membrane sealingly disposed in the cavity adjacent the interface surface, and a sensing element in communication with the membrane. A fuel cell system including the pressure sensor is also provided.
    Type: Application
    Filed: October 21, 2008
    Publication date: April 22, 2010
    Applicant: GM GLOBAL TECHNOLOGY OPERATIONS, INC.
    Inventor: Harald Schlag
  • Publication number: 20100031752
    Abstract: The invention relates to pressure sensors that are micromachined using microelectronics technologies. The sensor provided by the invention comprises a cavity (V) hermetically sealed on one side by a silicon substrate (40) and on the other side by a diaphragm (58) that can be formed under the effect of the pressure outside the cavity, the sensor having at least one resistance strain gage (54, 56) fastened to the diaphragm and having resistance that varies as a function of the deformation of the diaphragm. The diaphragm, preferably made of silicon nitride, is fastened to the resistance strain gages. The gages are located beneath the diaphragm inside the sealed cavity (V). It is not necessary to recess the substrate to produce the cavity: the diaphragm is formed by depositing an insulting layer on a sacrificial layer, for example made of a polyamide; it may cover integrated measurement circuits in the silicon substrate.
    Type: Application
    Filed: January 26, 2007
    Publication date: February 11, 2010
    Inventors: Gilles Delapierre, Hubert Grange, Patrice Rey
  • Publication number: 20100005851
    Abstract: The present invention is system and method for providing a self-calibrating pressure sensor. A pressure sensor apparatus comprises a diaphragm, at least one driving element operably coupled to the diaphragm configured to induce deflection in the diaphragm, and at least one strain gauge coupled to the diaphragm. The at least one strain gauge measures the deflection of the diaphragm. Typically, the driving elements will be piezoelectric drivers and will be operably coupled to the diaphragm. A method for evaluating a pressure sensor comprises inducing deflection in a diaphragm, measuring the deflection, determining the frequency-dependent response, calculating mechanical characteristics of the diaphragm from the frequency-dependent response, and calculating a response coefficient for the diaphragm based in part on said mechanical characteristics. The response coefficient is used to evaluate the sensor. The sensor can then be re-calibrated or self-calibrated based on the response coefficient.
    Type: Application
    Filed: June 8, 2009
    Publication date: January 14, 2010
    Inventors: Vernon Michael Cottles, Gregory Lawrence Wagner
  • Patent number: 7644623
    Abstract: A semiconductor pressure sensing apparatus includes a metallic stem having a diaphragm and a semiconductor sensor bonded to the diaphragm. The semiconductor sensor includes a gauge section and first and second bonding pads. The gauge section is configured to be deformed according to a deformation of the diaphragm. The first and second bonding pads are respectively connected to different positions of the gauge section so that an electrical resistance between the first and second bonding pads can change with a change in the deformation of the diaphragm. The gauge section is formed to a semiconductor layer of an silicon-on-insulator substrate. The semiconductor sensor is directly bonded to the diaphragm by activating contact surfaces between the semiconductor sensor and the diaphragm.
    Type: Grant
    Filed: January 29, 2008
    Date of Patent: January 12, 2010
    Assignee: DENSO CORPORATION
    Inventors: Hisanori Yokura, Yoshihiko Isobe, Eishi Kawasaki
  • Publication number: 20100000337
    Abstract: The invention refers to a sensor, consisting of a substrate carrying a resistive coat, the resistive coat consisting of titanium-wolfram-nitrite (TizW1-zN).
    Type: Application
    Filed: October 26, 2006
    Publication date: January 7, 2010
    Inventor: Wolfgang J. Wiedemann
  • Publication number: 20090308171
    Abstract: An external pressure measuring device having a base and a tubing system bent with various radii. Pressure inside the bent tubing causes the tubing to move in such a way that can be measured and can provide an indication of internal pressure.
    Type: Application
    Filed: June 16, 2009
    Publication date: December 17, 2009
    Inventor: Robert C. Anderson
  • Publication number: 20090272188
    Abstract: A fluid analysis system for use with a storage tank containing a plurality of fluids. The storage tank includes a drain outlet near the bottom of the tank and an opening at the top of the tank. The fluid analysis system includes a tube supported by the tank, at least one pressure sensor at the bottom of the tank, a fluid level sensor, and a processor. The tube extends from the opening of the tank to a position the bottom of the tank and supports the pressure sensor and the fluid level sensor. The fluid level sensor includes a reed switch assembly supported inside the tube and a magnetic float buoyantly supported on the exterior of the tube. The processor receives the pressure of the fluid detected by the pressure sensor and the fluid level detected by the fluid level sensor. The processor can determine a height of each of the fluids in the storage tank using the detected fluid pressure and the detected fluid level.
    Type: Application
    Filed: May 1, 2009
    Publication date: November 5, 2009
    Applicant: Well Tech Instruments, LLC
    Inventors: Paul Byrne, Phillip P. Harris
  • Patent number: 7559247
    Abstract: A pressure sensor for detecting pressure includes: a metallic diaphragm for receiving the pressure; four strain gauges providing a Wheatstone bridge, wherein each strain gauge outputs an electric signal corresponding to deformation of the diaphragm when the diaphragm is deformed by the pressure; and four semiconductor chips corresponding to four strain gauges, wherein each strain gauge is disposed in the semiconductor chip. Each semiconductor chip is mounted on the diaphragm.
    Type: Grant
    Filed: July 12, 2007
    Date of Patent: July 14, 2009
    Assignee: DENSO CORPORATION
    Inventors: Kiyoshi Otsuka, Osamu Itoh, Hiroshi Uchigashima, Kazuhiro Yoshino, Keiji Horiba, Tetsuya Ogawa
  • Publication number: 20090145235
    Abstract: A high temperature thin film strain gage sensor capable of functioning at temperatures above 1400° C. The sensor contains a substrate, a nanocomposite film comprised of an indium tin oxide alloy, zinc oxide doped with alumina or other oxide semiconductor and a refractory metal selected from the group consisting of Pt, Pd, Rh, Ni, W, Ir, NiCrAlY and NiCoCrAlY deposited onto the substrate to form an active strain element. The strain element being responsive to an applied force.
    Type: Application
    Filed: June 5, 2008
    Publication date: June 11, 2009
    Inventors: Otto J. Gregory, Ximing Chen
  • Publication number: 20090114030
    Abstract: A chip with resistive, metallic strain gauges distributed on surfaces on and buried within the chip. Also, vertically arranged vias and vertical thin film resistive strain gauges are described. The resistive strain gauges can be multiplexed wherein strain can be measured across the topology of the chip in each of the top, bottom and buried layers and any vertical strain. The resistive strain gauges may be in serpentine patterns and may be arranged on via or on vertical edges of grooves that extend from an upper or lower surface of the chip to buried layers. In this fashion, the distributed strain gauges may be used to map the strain throughout the body of a chip. A Kelvin bridge may be used to measure the strain, but other such measuring techniques and devices may be used.
    Type: Application
    Filed: November 1, 2007
    Publication date: May 7, 2009
    Inventors: Scott Irving, Yong Liu, Timwah Luk
  • Patent number: 7509866
    Abstract: The invention relates to a pressure sensor with a carrier (2), which in an inner region comprises a membrane (4) on which at least one first measurement element (R1?) for detecting a pressure impingement of the membrane (4) is arranged, wherein additionally at least one second measurement element (R3?) for detecting a pressure impingement of the membrane (4) is arranged on the membrane, wherein the first measurement element (R1?) and the second measurement element (R3?) are arranged distanced differently far from the edge of the membrane, and the output signals of the first and the second measurement element (R1?, R3?) are evaluated together in a manner such that the two measurement elements (R1?, R3?) detect a differential pressure acting on the membrane (4), and thereby compensate the influence of the system pressure acting on both sides of the membrane (4).
    Type: Grant
    Filed: August 6, 2005
    Date of Patent: March 31, 2009
    Assignee: Grundfos a/s
    Inventors: Jens Peter Krog, Casper Pedersen, Carsten Christensen
  • Publication number: 20090041081
    Abstract: The present invention relates to a combined pressure and temperature sensor (10) for recording the pressure and the temperature of a medium. The combined pressure and temperature sensor (10) includes a sensor element (12; 54, 56) in which at least one channel (16, 58) is developed for accommodating a temperature sensor (18) and at least one channel (26, 28, 70) is developed for recording a pressure. The at least one channel (26, 28), for recording a pressure, opens out under a pressure sensor (30, 60). The at least one channel (16, 58) for the temperature sensor (18) runs centrically in the sensor element (12).
    Type: Application
    Filed: November 9, 2006
    Publication date: February 12, 2009
    Inventors: Stefan Warth, Oliver Stoll, Christian Roesser, Markus Ledermann, Joerg Engelhardt
  • Publication number: 20090007680
    Abstract: A high pressure transducer has an H shaped cross-section with a center arm of the H having a top and bottom surface with the top surface of the H accommodating four strain gauges. Two strain gauges are located at the center of the top portion of the center arm of the H and are positive strain gauges, while two strain gauges are located near the periphery of the center arm of the gauge. The bottom surface of the center arm of the gauge has an active area of a smaller diameter than the circular diameter of the center arm portion of the transducer. The smaller active area is surrounded by a thicker stepped area which surrounds an active area on the pressure side of the H shaped member.
    Type: Application
    Filed: July 3, 2007
    Publication date: January 8, 2009
    Inventors: Anthony D. Kurtz, Adam Kane
  • Publication number: 20080280380
    Abstract: A monitoring system (100) for monitoring fluid in a fluid supply vessel (22, 24, 26, 28, 108) during operation including dispensing of fluid from the fluid supply vessel. The monitoring system includes (i) one or more sensors (114, 126) for monitoring a characteristic of the fluid supply vessel or the fluid dispensed therefrom, (ii) a data acquisition module (40, 132, 146) operatively coupled to the one or more sensors to receive monitoring data therefrom and responsively generate an output correlative to the characteristic monitored by the one or more sensors, and (iii) a processor (50, 150) and display (52, 150) operatively coupled with the data acquisition module and arranged to process the output from the data acquisition module and responsively output a graphical representation of fluid in the fluid supply vessel, billing documents, usage reports, and/or resupply requests.
    Type: Application
    Filed: October 24, 2005
    Publication date: November 13, 2008
    Applicant: Advanced Technology Materials, Inc.
    Inventors: James Dietz, Steven E. Bishop, James V. McManus, Steven M. Lurcott, Michael J. Wodjenski, Robert Kaim, Frank Dimeo, JR.
  • Patent number: 7444879
    Abstract: A displacement transducer includes a load cell structure having a thick outer peripheral area, a thick inner central area and two symmetrical thin beams. The two beams are disposed along a common diameter of the structure and joins the outer peripheral area and the inner central area. At least one strain gauge is placed on a surface of one beam and at least one strain gauge is placed on a surface of the second beam. A top diaphragm cover member is secured to a top surface of the outer peripheral area and covers the two beams.
    Type: Grant
    Filed: August 31, 2007
    Date of Patent: November 4, 2008
    Assignee: Kulite Semiconductor Products, Inc.
    Inventors: Anthony D. Kurtz, Adam Kane, Louis DeRosa
  • Publication number: 20080264172
    Abstract: A pressure sensor includes: a diaphragm having a pressure-receiving portion receiving a pressure and a thick portion adjacent to the pressure-receiving portion; and a pressure sensitive element having a first and a second ends facing each other. The pressure sensitive element extends in a direction intersecting the thick portion and the first end of the pressure sensitive element is bonded to a pressure-receiving surface of the pressure-receiving portion, and a central portion of a portion at which the pressure-receiving portion and the first end are bonded is positioned at a side closer to the second end of the pressure sensitive element than a center of the pressure-receiving portion.
    Type: Application
    Filed: April 21, 2008
    Publication date: October 30, 2008
    Applicant: Epson Toyocom Corporation
    Inventor: Toshinobu SAKURAI
  • Publication number: 20080260558
    Abstract: Embodiments of the present invention are directed to method and devices for measuring the pressure of a pump chamber in which no internal opening or connections are needed. One embodiment of the present invention is directed to an apparatus for pumping fluid. The apparatus comprises at least one housing having a transducer surface. The transducer surface has a thickness exhibiting measurable deformation upon the chamber holding a fluid under pressure such that the transducer surface has a first position at which the chamber is at one pressure and a second position at which the chamber is at a second pressure. A strain sensor is affixed to the transducer surface producing; at least one signal upon the transducer surface assuming the first position and at least one signal upon the transducer surface assuming the second position to function as an integrated pressure transducer.
    Type: Application
    Filed: March 4, 2005
    Publication date: October 23, 2008
    Applicant: Waters Investments Limited
    Inventors: Joseph A. Luongo, John Angelosanto, Frank Rubino, Stanley P. Pensak Jr., David J. First, Jean-Pierre Pugnaire, Richard R. Venable
  • Patent number: 7434471
    Abstract: A pressure measurement device with protection from long-term loads and pressure shocks. The novel device includes a diaphragm adapted to deform in response to a pressure applied thereto, and a retractable support adapted to support the diaphragm during periods of non-operation. A strain gauge is attached to the diaphragm for measuring the deformation and the retractable support is designed to minimize stress on the strain gauge during periods of non-operation. The support is retracted during periods of operation to allow the diaphragm and strain gauge to function normally in response to the applied pressure. The diaphragm is disposed within a housing to form a first cavity, which is coupled to media to be measured, and a second cavity, which is set at a reference pressure. In an illustrative embodiment, the retractable support is a threaded plug inserted into the second cavity.
    Type: Grant
    Filed: January 16, 2007
    Date of Patent: October 14, 2008
    Assignee: Raytheon Company
    Inventor: Peter C. Lukens
  • Publication number: 20080223142
    Abstract: The following abstract will replace all prior versions of the abstract in the application: A pressure sensor is provided with a cap on a measuring portion of a diaphragm to which a first end of a flexible board is connected while a second end of the flexible board is connected to a circuit board spaced apart from the diaphragm. The flexible board is provided with the first end, a belt portion that is bent at an angle of ninety degrees or more relative to the first end in a direction to be away from the circuit board and is curved along the outer circumference of the diaphragm, and the second end that is bent at an angle of ninety degrees or more relative to the belt portion to be connected to the circuit board.
    Type: Application
    Filed: March 13, 2008
    Publication date: September 18, 2008
    Applicant: NAGANO KEIKI CO., LTD.
    Inventors: Yukinobu Iimori, Nobuaki Yamada, Shuji Tohyama, Takayuki Yokoyama
  • Publication number: 20080202249
    Abstract: A semiconductor pressure sensing apparatus includes a metallic stem having a diaphragm and a semiconductor sensor bonded to the diaphragm. The semiconductor sensor includes a gauge section and first and second bonding pads. The gauge section is configured to be deformed according to a deformation of the diaphragm. The first and second bonding pads are respectively connected to different positions of the gauge section so that an electrical resistance between the first and second bonding pads can change with a change in the deformation of the diaphragm. The gauge section is formed to a semiconductor layer of an silicon-on-insulator substrate. The semiconductor sensor is directly bonded to the diaphragm by activating contact surfaces between the semiconductor sensor and the diaphragm.
    Type: Application
    Filed: January 29, 2008
    Publication date: August 28, 2008
    Applicant: DENSO CORPORATION
    Inventors: Hisanori Yokura, Yoshihiko Isobe, Eishi Kawasaki
  • Patent number: 7412892
    Abstract: A method for making a pressure transducer comprising: forming a recess in a diaphragm, the diaphragm having a thinned region that deflects responsively to pressure being applied thereto; depositing a glass frit in the recess; embedding a plurality of strain gages in the glass frit; and, wire bonding the strain gages into a Wheatstone bridge configuration.
    Type: Grant
    Filed: June 6, 2007
    Date of Patent: August 19, 2008
    Assignee: Measurement Specialties, Inc.
    Inventor: Chris Gross
  • Publication number: 20080148860
    Abstract: A pressure sensor has a polygonal cylindrical stem having a bottom wall and a plurality of side walls including a remarked side wall, a diaphragm constituted by a portion of the remarked side wall, and a sensing element attached to the remarked side wall. Each of the side walls extends along a longitudinal direction of the stem so as to face a hollow of the stem. A center axis of the hollow along the longitudinal direction is shifted from a center axis of the stem toward the remarked side wall so as to differentiate a thickness of the remarked side wall from those of the other side walls. The diaphragm is deformable in response to a pressure of a medium introduced in the hollow. The sensing element senses a deformation of the diaphragm and outputs a sensing signal indicating the deformation of the diaphragm.
    Type: Application
    Filed: November 29, 2007
    Publication date: June 26, 2008
    Applicant: DENSO CORPORATION
    Inventors: Yoshifumi Murakami, Kiyoshi Otsuka
  • Patent number: 7350418
    Abstract: A fluid supply assembly having a measuring guide comprising a fluid container, a lid, and a measuring guide. A method of measuring fluid components in a fluid supply assembly is also described.
    Type: Grant
    Filed: August 7, 2007
    Date of Patent: April 1, 2008
    Assignee: Illinois Tool Works, Inc.
    Inventors: Michael Kosmyna, Ralph Wisniewski
  • Publication number: 20080077020
    Abstract: A method and apparatus for monitoring vital signs, such as cardiopulmonary activity, using a ballistograph are provided. The method and apparatus may be used to monitor an infant sleeping in a crib, a patient in a hospital, a person with a chronic disease at home or in professional care, or a person in an elder-care setting.
    Type: Application
    Filed: August 31, 2007
    Publication date: March 27, 2008
    Applicant: BAM Labs, Inc.
    Inventors: Steven Jay Young, William McKinnon Gillon, Richard Vincent Rifredi, William Todd Krein
  • Patent number: 7343810
    Abstract: A pressure sensor is composed of a pressure housing having a pressure chamber inside and a pressure sensitive element arranged in the pressure chamber, and a joint housing having a fluid passage for leading fluid into the pressure housing, wherein the pressure housing and the joint housing are jointed by brazing with an insulating member interposed at a joint section therebetween. A stress relieving member is interposed at least either between the metal housing and the insulating member or between the joint housing and the insulating member, so that the insulating member can be relieved of a stress which is caused by the braze jointing to act on the insulating member.
    Type: Grant
    Filed: January 31, 2006
    Date of Patent: March 18, 2008
    Assignee: JTEKT Corporation
    Inventors: Kazushi Suzuki, Kazuya Sakai, Isamu Kandori
  • Patent number: 7316164
    Abstract: A pressure detection device includes a sensing part that is provided at one end portion of the housing to output an electrical signal responsive to an applied pressure, a circuit part that is provided at an other end portion of the housing to process the signal from the sensing part, and a flexible printed board provided in the housing between the sensing part and the circuit part. Furthermore, the flexible printed board has a first end portion electrically connected to the sensing part at a first connecting part, and a second end portion electrically connected to the circuit part at a second connecting part. In the pressure detection device, the flexible printed board is shaped between the first and second end portions to relieve a stress applied to the connecting parts.
    Type: Grant
    Filed: January 17, 2006
    Date of Patent: January 8, 2008
    Assignee: DENSO CORPORATION
    Inventors: Inao Toyoda, Hiroshige Matsui
  • Patent number: 7290453
    Abstract: A pressure sensor assembly comprised of a single and dual layer diaphragm with integrated force sensing flexure, such as a cantilever beam. Strain gages are positioned on the force sensing beam. The pressure forces the diaphragm to deflect. The deflection is constrained by the beam, which is compelled to bend. The bending induces strains in strain gages located on the beam. The strain gages are connected in a Wheatstone bridge configuration. When a voltage is applied to the bridge, the strain gages provide an electrical output signal proportional to the pressure. Composite diaphragm—beam pressure sensors convert pressure more efficiently and improve sensor performance.
    Type: Grant
    Filed: December 12, 2005
    Date of Patent: November 6, 2007
    Inventor: Amnon Brosh
  • Patent number: 7284444
    Abstract: A hermetically sealed displacement sensor has strain gauges placed on thin flexible triangular shaped beams of a load beam cell. The strain gauges are enclosed in a hermetically sealed cavity which cavity is sealed by means of a cover plate placed over the load beam cell. The thin beams are connected together by a center hub and basically form two constant moment beams. There is a top isolation diaphragm member which is convoluted and to which a force is applied which applied force is transmitted to the thin flexible beams. The beams deflect and the sensors produce an output proportional to strain. The sensors on each beam are two in number wherein one sensor is placed in a longitudinal direction with respect to the beam while the other sensor is in a transverse position. The sensors may be wired to form a full Wheatstone bridge or half bridges may be employed. The electrical output from the strain gauge bridge is proportional to the deflection of the center of the sensor.
    Type: Grant
    Filed: December 30, 2005
    Date of Patent: October 23, 2007
    Assignee: Kulite Semiconductor Products, Inc.
    Inventors: Anthony D. Kurtz, Adam Kane, Louis DeRosa
  • Patent number: 7263893
    Abstract: A fluid supply assembly having a measuring guide comprising a fluid container, a lid, and a measuring guide. A method of measuring fluid components in a fluid supply assembly is also described.
    Type: Grant
    Filed: January 26, 2006
    Date of Patent: September 4, 2007
    Assignee: Illinois Tool Works Inc.
    Inventors: Michael Kosmyna, Ralph Wisniewski
  • Patent number: 7263895
    Abstract: A fluid pressure sensor (1) for measuring the pressure of a fluid comprises a diaphragm portion (12) which is a strain generating body, a silicon oxide film (21) as an insulating film, and a strain gauge (20) made of crystalline silicon, and austenitic precipitation hardening type Fe—Ni heat-resisting steel excellent in mechanical strength and corrosion resistance is used for the diaphragm portion (12). The silicon oxide film (21) is formed with the internal stress thereof adjusted to the range from ?150 to 130 MPa. With this feature, the fluid pressure sensor (1) ensures high precision and reliability, and may be used even for measurement of a highly corrosive fluid.
    Type: Grant
    Filed: July 15, 2005
    Date of Patent: September 4, 2007
    Assignee: Nagano Keiki Co., Ltd.
    Inventors: Hiroshi Nagasaka, Takeshi Abe, Yoshikazu Kaneko
  • Patent number: 6997058
    Abstract: A pressure sensor includes a metal stem having a diaphragm, and a semiconductor substrate in which an insulation layer is inserted between first and second semiconductor layers. A plurality of strain gauges are formed on a predetermined area of the first semiconductor layer of the semiconductor substrate, for converting a bending of the diaphragm to an electrical signal. In the pressure sensor, the strain gauges have pattern shapes insulated and separated from each other by trenches extending from a surface of the first semiconductor layer to the insulation layer. Furthermore, the second semiconductor layer has a recess portion, which is recessed from a surface of the second semiconductor layer to the insulation layer and is provided at a position corresponding to the predetermined area. The diaphragm is inserted into the recess portion, and the insulation layer is attached to a surface of the diaphragm in the recess portion.
    Type: Grant
    Filed: May 26, 2005
    Date of Patent: February 14, 2006
    Assignee: Denso Corporation
    Inventor: Inao Toyoda
  • Patent number: 6986285
    Abstract: The pressure sensor (2) comprises a pressure detector element (21) arranged to receive a pressure that is to be measured and to detect it, and a printed circuit (22) connected to the pressure detector element (21) via an electrical connection, and it is characterized in that the electrical connection comprises at least one flexible conductive tongue (29) having a first end (290) connected directly or indirectly to the printed circuit (22) and a second end (291) merely bearing against a corresponding electrical contact (213a) of the pressure detector element (21). In order to ensure good electrical contact, the bearing face (294) of the second end of the or each flexible conductive tongue (29) bearing against the corresponding electrical contact (213a) is polished.
    Type: Grant
    Filed: January 29, 2002
    Date of Patent: January 17, 2006
    Assignee: Snecma Propulsion Solide
    Inventor: Jean-Bernard Avisse
  • Patent number: 6957588
    Abstract: A pressure transducer and method for measuring pressure of a fluid flow in a tube include use of a sensing tube through which the pressurized flow passes. The sensing tube deforms outward in response to the pressurized flow within. Deformation measuring devices, such as strain gages, measure the outward deformation and allow computation of the pressure of the flowing fluid. A housing surrounds the sensing tube to relieve stresses on the sensing tube, to prevent damage to the sensing tube, and to contain any rupture of the sensing tube. The sensing tube may have a round, rectangular, or other shape cross-section. The pressure transducer allows continuous and non-invasive measurement of pressure inside a tube. In addition, a flow restriction such as an orifice may be provided in the sensing tube to enable a flow rate to be determined from the pressure drop across the flow restriction.
    Type: Grant
    Filed: June 27, 2000
    Date of Patent: October 25, 2005
    Assignee: Thomas P. Kicher & Co.
    Inventors: Thomas P. Kicher, Paul T. Kicher
  • Patent number: 6941815
    Abstract: A sensor with built-in circuits can be improved in the stability of the operation or characteristics. A circuit region and a sensor region are covered by a passivation film. The sensor region is partially covered by the passivation film. The sensor region and circuit region are protected by the passivation film, and an effect of the passivation film on the mechanical displacement of a diaphragm portion can be alleviated so that the sensor with built-in circuits may be improved in the stability of the operation or characteristics.
    Type: Grant
    Filed: June 19, 2002
    Date of Patent: September 13, 2005
    Assignees: Hitachi, Ltd., Hitachi Car Engineering Co., Ltd.
    Inventors: Yasuo Onose, Junichi Horie, Seiji Kuryu, Akihiko Saito, Norio Ichikawa, Atsuo Watanabe, Satoshi Shimada
  • Patent number: 6925885
    Abstract: A pressure sensor includes a sensor element, and a resin package member that holds the sensor element. The sensor element is constructed by a semiconductor, and is capable of externally outputting an electric signal in accordance with strain generated when force is applied thereto. The sensor element is directly adhered to the package member via an adhesive layer that has Young's modulus in a range between 2.45×103 Pa and 2.06×104 Pa. Further the adhesive layer has a thickness equal to or more than 110 ?m. Accordingly, the pressure sensor effectively restricts a variation in a sensor characteristic due to a thermal change.
    Type: Grant
    Filed: December 5, 2002
    Date of Patent: August 9, 2005
    Assignee: Denso Corporation
    Inventors: Seiichiro Ishio, Yasutoshi Suzuki
  • Patent number: 6889554
    Abstract: It is an object to provide a method of adjusting a pressure sensor, in which adjustment of a diaphragm portion and adjustment of an amplification circuit connected to the diaphragm portion are simplified. A flexible circuit board having the amplification circuit mounted thereon is connected to a diaphragm member having the diaphragm portion formed with gauge resistances, and offset, span and temperature-compensating adjustment resistances, and adjustment of the adjustment resistances formed on the diaphragm member is performed in this state. The adjustment on the side of the diaphragm member including the amplification circuit accommodates adjustment deviation on the amplification circuit, and hence adjustment of the whole pressure sensor can be achieved by a single adjustment process. The adjustment process thus simplified can reduce manufacturing costs.
    Type: Grant
    Filed: September 19, 2002
    Date of Patent: May 10, 2005
    Assignee: TGK Co., Ltd.
    Inventors: Hisatoshi Hirota, Naoya Wanajo
  • Publication number: 20040129085
    Abstract: The pressure cell device according to the invention serves for measuring hydraulic pressures in hydraulic mining devices in an inherently secure service region. It is provided with a connection element which can be connected to a pressure reception connection and with a sensor housing, on the inside of which is arranged a hydroelectric pressure transducer which is pressurised by the hydraulic pressure present at the pressure reception connection and converts this into an electrical signal. So as to ensure high measurement accuracy over a long operating period, without it being necessary to have exchanges of the pressure transducer or its new calibration, it is provided according to the invention that the pressure transducer comprises a ceramic pressure measuring cell.
    Type: Application
    Filed: December 17, 2003
    Publication date: July 8, 2004
    Inventors: Sebastian M. Mundry, Jens Titschert, Reiner Frank, Jurgen Tschope
  • Patent number: 6742395
    Abstract: A port fitting (102) is formed with a closed, pedestal end forming a diaphragm (102a) on which a strain gauge sensor is mounted. A support member (106) is received on the pedestal end and is formed with a flat end wall (106a) having an aperture (106d) aligned with the sensor. A circuit assembly (108) is bonded to the flat end wall and the sensor wire bonded to the electronic circuit. A cover member (114) placed on the support member, is provided with a cavity for a metal shield member (118) fitted inside the cover member before assembly. The shield member is formed with spring members (118b) extending outside the perimeter of the cover member. The cover member is formed with circular cavities (114d) extending in an axial direction to provide seating for contact spring members (117), making electronic contact to the sensor electronics and protruding beyond the body of the cover member. The cover member is also fitted with a circular elastomer gasket member (116), providing an environmental seal.
    Type: Grant
    Filed: December 20, 2002
    Date of Patent: June 1, 2004
    Assignee: Texas Instruments Incorporated
    Inventors: Marc Gerard Johan Borgers, Thomas R. Maher, Timothy M. McBride, Paulus Thomas Johannes Gennissen