Abstract: A gyroscope having a resonator, a plurality of electrodes located around the resonator, and a thin gap being located between the resonator and the plurality of electrodes. The resonator is axi-symmetric and may be at least partially torroidal in shape or composed of concentric rings. Piezoelectric electrodes or transduction may be used to drive or detect displacements of the resonator. The resonator may be fabricated using a fused silica flowing process.

Abstract: One embodiment is a micro hemispheric resonator gyro having: a plurality of pickoff and forcer electrodes; a hemispheric resonator; a guard ring having first and second opposed sides, the guard ring containing the plurality of pickoff and forcer electrodes, and the hemispheric resonator; a top cover operatively coupled to the first side of the guard ring; and a bottom cover operatively coupled to the second side of the guard ring; wherein the plurality of pickoff and forcer electrodes, the hemispheric resonator, the guard ring, the top cover and the bottom cover form a micro hemispheric resonator gyro.

Abstract: The Inner-Forcer milli-Hemispherical Resonator Gyro (mHRG) is a small, low cost, high performance gyroscope. It may have an extremely simplified design, with in one embodiment of the present method and apparatus only five major parts total, with most parts filling multiple functions. The method and apparatus in one embodiment may have: a resonator; and a body operatively coupled to the resonator, the unitary body integrally having electrodes, an electrode support unit, a weld ring and a plurality of electrically conductive pins, the plurality of electrodes operatively coupled to the electrically conductive pins.

Abstract: Packaging techniques for planar resonator gyroscopes, such as disc resonator gyroscopes (DRGs) are disclosed. A gyroscope die may be attached to its package substrate on a central disc area that is inboard of its embedded electrodes. This configuration eliminates contact of the die with the package substrate beneath the embedded electrodes allowing the internal electrode support structure to expand or contract freely without stress as its temperature changes. The central attachment can also be used diminish the package temperature gradients on the periphery of the die, if the thermal conductivity of the central disc attachment material is higher than the package substrate. Temperature gradients across the resonator also lead to thermoelastic damping asymmetry and rate drift. In addition, the electrical connections to the die may be formed by vertical vias within the central disc attachment area or by thin wirebonds to peripheral I/O pads on the gyro chip.