Abstract: A sheet cutting table 13, after sticking an adhesive sheet S to a semiconductor wafer W, for cutting the area outside the semiconductor wafer W as an unnecessary adhesive sheet S1 with a cutting device 15. The table 13 includes an inner table 52 which supports the semiconductor wafer W, and an outer table 51 corresponding to the unnecessary adhesive sheet S1 outside the semiconductor wafer W. The upper surface of the outer table 51 is provided with a non-adherable treatment surface 51A, and an adherable member formed with a ring member 53 or a plate member 63 for sticking the adhesive sheet S thereto.

Abstract: A paper film trimming machine, useful for trimming news copy, consists of a supporting table over which the paper is fed under the weight of a plexiglass plate by means of feed rollers driven by an electric motor. A pair of spring-biased straight-edge knives cut the paper as it travels across a cutting block located between the table and the drive rollers. Each of the knives is mounted on a single threaded shaft and their positions are each independently laterally adjustable to align them accurately with the columns that are being cut.