Tool Element Selectively Operative Patents (Class 83/508.1)
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Patent number: 8850938Abstract: A slicing apparatus and a weighing and classifying conveyor combination with cleanup position wherein, the elevated food article feed mechanism can be collapsed to a maintenance position, the weighing and classifying conveyor is oriented at a distance from the slicing apparatus and the slicing head cover is automatically lifted to an open cleanup position. The machine has laser intrusion detectors that are used to shut down systems when an unwanted intrusion by a person or object is detected.Type: GrantFiled: October 21, 2008Date of Patent: October 7, 2014Assignee: Formax, Inc.Inventors: Scott A. Lindee, Glenn Sandberg, David Hansen, James E. Pasek, David Hancock
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Patent number: 8616103Abstract: A food article slicing machine includes a slicing station, a food article feed apparatus, and an automated blade retraction mechanism. The food article feed apparatus supports one or more food articles for movement along food article paths intersecting the cutting path. The automated blade retraction mechanism periodically retracts the blade from the cutting plane to make empty cuts during a continuous cutting operation. The retracting mechanism includes a sliding member arranged outside the blade shaft, the sliding member guided for sliding movement and non-rotation and arranged to exert a sliding force on the blade shaft. A linear actuator causes the sliding member to slide and exert a sliding force on the blade shaft to retract the knife blade away from the cutting plane in a direction along the axis of the blade shaft.Type: GrantFiled: October 21, 2008Date of Patent: December 31, 2013Assignee: Formax, IncInventors: Scott A. Lindee, James E. Pasek
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Patent number: 8353236Abstract: A perforating equipment (111) for continuous forms in movement comprises tree transversal perforating device (54, 56, 57) for executing transversal perforations on continuous forms (58) to be divided in three longitudinal sections and continuous forms to be divided in two longitudinal sections. Each perforating device includes a contrast member (61, 62, 79), a blade support mounting a blade (116a, 117a, 118a) for the three section form and a blade (116b, 117b, 118b) for the two section form, a blade servomechanism (73, 74, 85) and an activation group (104, 106, 107). The blade servomechanism rotates the blade support for a condition of interference of a blade in the position of perforation; and the activation group causes the contrast member to contrast a corresponding blade for the perforations of the forms to be divided into three sections, or the forms to be divided into two longitudinal sections.Type: GrantFiled: February 9, 2010Date of Patent: January 15, 2013Assignee: TECNAU, S.r.l.Inventors: Giuliano De Marco, Armando Aprato, Francesco Terrusi, Francesco Modica
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Patent number: 8266995Abstract: A paper processing device including: a first cutting unit that cuts a transported continuous paper along a transporting direction of the continuous paper to change a width of the continuous paper; a second cutting unit that cuts continuous papers, which are formed by cutting with the first cutting unit, along a width direction of the cut continuous papers to cut the continuous papers into papers of a desired size, the second cutting unit including plural second cutting members disposed along the width direction of the cut continuous papers, and plural driving units that respectively drive the second cutting members are provided.Type: GrantFiled: October 29, 2008Date of Patent: September 18, 2012Assignee: Fuji Xerox Co., Ltd.Inventor: Yoshihiro Takashimizu
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Patent number: 8250957Abstract: A table saw in one embodiment includes a swing arm assembly movable along a swing path between a first swing arm position whereat a portion of a shaping device supported by the swing arm assembly extends above a work-piece support surface and a second swing arm position, a first link arm with a first tracking component and a first slot, the first tracking component slidingly engaged with the swing arm assembly, a second link arm with a second tracking component engaged with the first slot, an actuator configured to pivot the second link arm from a first position whereat force from the first link arm acting on the tracking component is directed at a second link arm pivot toward a second position whereat the force is not directed at the second link arm pivot, and a control system configured to actuate the actuator in response to a sensed condition.Type: GrantFiled: August 26, 2009Date of Patent: August 28, 2012Assignee: Robert Bosch GmbHInventors: Bradley Holmes, Jaime Moreno
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Patent number: 8210079Abstract: An apparatus for feeding and slitting soft goods has multiple slitting systems with respective slitting blades mounted on a cross rail. A slitting blade positioning system is movable parallel with the cross rail and operable to move slitting systems along the cross rail. A material feed motor is connected to a feed roller and operable to move the soft goods past the slitting system. A control is first operable to cause the slitting blade positioning system to move identified slitting systems to desired positions on the cross rail. Thereafter, the control operates a drive shaft motor to rotate slitting blades mounted on the drive shaft and the material feed motor, thereby moving the soft goods past the slitting blades.Type: GrantFiled: May 12, 2009Date of Patent: July 3, 2012Assignee: L&P Property Management CompanyInventors: Terrance L. Myers, Jeff Kaetterhenry, Ivan Habek, Stjepan Vadlja
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Publication number: 20110048207Abstract: A table saw in one embodiment includes a swing arm assembly movable along a swing path between a first swing arm position whereat a portion of a shaping device supported by the swing arm assembly extends above a work-piece support surface and a second swing arm position, a first link arm with a first tracking component and a first slot, the first tracking component slidingly engaged with the swing arm assembly, a second link arm with a second tracking component engaged with the first slot, an actuator configured to pivot the second link arm from a first position whereat force from the first link arm acting on the tracking component is directed at a second link arm pivot toward a second position whereat the force is not directed at the second link arm pivot, and a control system configured to actuate the actuator in response to a sensed condition.Type: ApplicationFiled: August 26, 2009Publication date: March 3, 2011Applicants: Credo Technology Corporation, Robert Bosch GmbHInventors: Bradley Holmes, Jaime Moreno
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Publication number: 20100257986Abstract: An apparatus for cutting, deburring, deflashing and removing material from a workpiece includes a housing mounted to a robot, a collet coupled to the housing, a shaft disposed in the housing and coupled to the collet such that a rotation of the shaft results in a rotation of the collet, wherein the shaft is selectively toggled between a locked position and an unlocked position, and a blade holder disposed in the collet and including a blade coupled thereto, wherein a freedom of movement of the blade is determined based on a position of the shaft.Type: ApplicationFiled: April 9, 2010Publication date: October 14, 2010Inventors: James Borg, Don Faulkner, Mark Bole, Craig Fester, Charles Spoutz, Donald Keinath, Virgil Wilson
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Patent number: 7703365Abstract: A lumber trimmer is disclosed wherein only one pair of parallel spaced-apart trim saws is mounted at one or both ends of a shaft. Each pair of trim saws is laterally movable along the shaft parallel to the longitudinal axis of lumber in the lumber trimmer. Each saw of the pair of trim saws is operably coupled with an actuator such that each saw is selectively vertically movable to trim the lumber. The pair of trim saws may be mounted to a carriage. A second actuator is operably coupled with the pair of trim saws for selectively laterally translating the pair of trim saws along the shaft.Type: GrantFiled: January 7, 2005Date of Patent: April 27, 2010Assignee: USNR/Kockums Cancar CompanyInventors: Geoff Wight, Ken Kantymir, Deane Henderson
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Publication number: 20100089891Abstract: A method for manufacturing wireless communication devices for use in tracking or identifying other items comprises a number of cutting techniques that allow the size of the antenna for the wireless communication device. Further, the chip for the wireless communication device is nested so as to be flush with the surface of the substrate of the wireless communication device. Rollers cut the tabs that form the antenna elements. In a first embodiment, a plurality of rollers are used, each one effecting a different cut whose position may be phased so as to shorten or lengthen the antenna element. In a second embodiment, the rollers are independently positionable to shorten or lengthen the antenna element.Type: ApplicationFiled: December 11, 2009Publication date: April 15, 2010Inventors: Ian J. Forster, Patrick F. King
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Publication number: 20090000442Abstract: A rotary trimmer for cutting and/or trimming paper and related sheet material is disclosed. The rotary trimmer comprises a trimmer housing having: (i) a first end portion; (ii) a second end portion; and (iii) a cutting platform having: (a) a first platform; (b) a second platform; and (c) a base platform. The first and the second platforms are pivotably connected at least indirectly to (1) the base platform; and/or (2) the first and the second end portions. The rotary trimmer further includes a blade carriage guide disposed between the first and the second end portions and a blade carriage having one or more cutting blades, and slidably mounted to the blade carriage guide wherein the blade carriage can slide along the blade carriage guide to cut and/or trim a sheet or sheet-like material positioned on the cutting platform. A method of using a rotary trimmer is also disclosed.Type: ApplicationFiled: June 26, 2008Publication date: January 1, 2009Inventors: Michael E. Peterson, P.Y. Gu, Javier Verdura
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Patent number: 7387057Abstract: An apparatus for slitting a web moving along a path in a transport direction has a support transversely shiftable relative to the web adjacent the path, a drive shaft extending transversely of the direction adjacent the path and substantially nonmovable transversely of the path, and a drive gear on the support rotationally coupled gear to the drive shaft and shiftable along the shaft. A mount shiftable toward and away from the shaft on the support carries at least one driven gear and a driven blade fixed to and rotatable with the driven gear. Another blade is juxtaposed with the driven blade and flanks the path therewith. An actuator can shift the mount between a cutting position with the blades closely juxtaposed and the driven gear meshing with the drive gear and a retracted position with the blades separated and the driven gear out of mesh with the drive gear.Type: GrantFiled: January 17, 2004Date of Patent: June 17, 2008Assignee: Kampf GmbH & Co. MaschinenfabrikInventors: Ralf Dedeken, Armin Hutzenlaub, Dietmar Kunkel
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Patent number: 7367251Abstract: A method of implementing a change of format in a system for cutting sheets of corrugated board comprises the application of at least three first longitudinal cuts by a first group of longitudinal-cutter tool and at least three second longitudinal cuts by a second group of longitudinal-cutter tools. All the three longitudinal cuts overlap one another in the conveying direction. In this way, the corrugated board can be exploited more efficiently in the area of format change.Type: GrantFiled: October 26, 2005Date of Patent: May 6, 2008Assignee: BHS Corrugated Maschinen-und Anlagenbau GmbHInventor: Felix Titz
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Patent number: 7231859Abstract: A mail opener comprises a cuffily device which is movable between an operating position and a retracted position where it is inoperative. The position of the cutting device is controllable by a drive device controlled by the postage meter. The arrangement is such that a single post station can be provided for both applying postage and opening mail. The post station incorporates a safety measure to prevent newly franked outgoing mail from being inadvertently opened or damaged by the mail opener.Type: GrantFiled: January 29, 2001Date of Patent: June 19, 2007Assignee: Neopost LimitedInventor: Anthony Lawrence
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Patent number: 7040207Abstract: A log merchandising apparatus includes feeding and staging feeders and a plurality of pivoting overhead truss-mounted saws. The saws are travelling saws, reversibly and independently movable along the longitudinal axis of the log by means of a rack and pinion drive and lineal bearings.Type: GrantFiled: October 4, 2002Date of Patent: May 9, 2006Assignee: Linden Fabricating & Engineering (Prince George) Ltd.Inventor: Bruno Lindenblatt
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Publication number: 20040177737Abstract: A rotating cutting cylinder and an opposing member, wherein the cutting cylinder is fitted with a plurality of blade segments distributed along the length of the cutting cylinder and connected to one or more actuators for producing a movement of selective extension and retraction of said blade segments with respect to said cutting cylinder.Type: ApplicationFiled: March 26, 2004Publication date: September 16, 2004Applicant: Fosber S.P.A.Inventor: Mauro Adami
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Publication number: 20040118260Abstract: A sheet cutter for making business cards is composed of an upper cover, a seat mounted beneath the upper cover, a transversal blade assembly and a longitudinal blade assembly. By using the transversal blade, a sheet printed with multiple business card details in rows and columns can be conveniently cut into individual business cards along the longitudinal and transversal directions.Type: ApplicationFiled: November 3, 2003Publication date: June 24, 2004Inventors: Shui-Yi Lee, Jack Lee
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Patent number: 6722243Abstract: A rotating cutting cylinder and an opposing member, wherein the cutting cylinder is fitted with a plurality of blade segments distributed along the length of the cutting cylinder and connected to one or more actuators for producing a movement of selective extension and retraction of said blade segments with respect to said cutting cylinder.Type: GrantFiled: November 20, 2002Date of Patent: April 20, 2004Assignee: Fosber S.p.A.Inventor: Mauro Adami
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Patent number: 6687990Abstract: A semiconductor wafer saw and method of using the same for dicing semiconductor wafers comprising a wafer saw including variable lateral indexing capabilities and multiple blades are disclosed. The wafer saw, because of its variable indexing capabilities, can dice wafers having a plurality of differently sized semiconductor devices thereon into their respective discrete components. In addition, the wafer saw with its multiple blades, some of which may be independently laterally or vertically movable relative to other blades, can more efficiently dice silicon wafers into individual semiconductor devices. The wafer saw may also be used to simultaneously sever and electrically isolate conductive traces that extend over adjacent semiconductor devices from connective lines therefor.Type: GrantFiled: August 20, 2002Date of Patent: February 10, 2004Assignee: Micron Technology, Inc.Inventors: Salman Akram, Derek J. Gochnour, Michael E. Hess, David R. Hembree
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Publication number: 20040016334Abstract: A log merchandising apparatus includes feeding and staging feeders and a plurality of pivoting overhead truss-mounted saws. The saws are travelling saws, reversibly and independently movable along the longitudinal axis of the log by means of a rack and pinion drive and lineal bearings.Type: ApplicationFiled: October 4, 2002Publication date: January 29, 2004Inventor: Bruno Lindenblatt
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Patent number: 6631662Abstract: A semiconductor wafer saw and method of using the same for dicing semiconductor wafers are disclosed comprising a wafer saw including variable lateral indexing capabilities and multiple blades. The wafer saw, because of its variable indexing capabilities, can dice wafers having a plurality of differently sized semiconductor devices thereon into their respective discrete components. In addition, the wafer saw with its multiple blades, some of which may be independently laterally or vertically movable relative to other blades, can more efficiently dice silicon wafers into individual semiconductor devices.Type: GrantFiled: May 22, 2001Date of Patent: October 14, 2003Assignee: Micron Technology, Inc.Inventors: Salman Akram, Derek J. Gochnour, Michael E. Hess, David R. Hembree
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Patent number: 6578458Abstract: A semiconductor wafer saw and method of using the same for dicing semiconductor wafers comprising a wafer saw including variable lateral indexing capabilities and multiple blades. The wafer saw, because of its variable indexing capabilities, can dice wafers having a plurality of differently sized semiconductor devices thereon into their respective discrete components. In addition, the wafer saw with its multiple blades, some of which may be independently laterally or vertically movable relative to other blades, can more efficiently dice silicon wafers into individual semiconductor devices.Type: GrantFiled: March 18, 2002Date of Patent: June 17, 2003Assignee: Micron Technology, Inc.Inventors: Salman Akram, Derek J. Gochnour, Michael E. Hess, David R. Hembree
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Patent number: 6553883Abstract: The apparatus for cutting a weblike material (N) fed continuously along a path (P) through said apparatus comprises a rotating cutting cylinder (101) and an opposing member (105), these being arranged on opposite sides of said path (P). On the cutting cylinder are a plurality of blade segments (111) distributed along the length of the cutting cylinder and connected to actuators (119, 121) for producing a movement of selective extension and retraction of the blade segments (111) with respect to the cutting cylinder (101).Type: GrantFiled: November 3, 1999Date of Patent: April 29, 2003Assignee: Fosber, S.p.A.Inventor: Mauro Adami
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Patent number: 6427676Abstract: A semiconductor wafer saw and method of using the same for dicing semiconductor wafers comprising a wafer saw including variable lateral indexing capabilities and multiple blades. The wafer saw, because of its variable indexing capabilities, can dice wafers having a plurality of differently sized semiconductor devices thereon into their respective discrete components. In addition, the wafer saw with its multiple blades, some of which may be independently laterally or vertically movable relative to other blades, can more efficiently dice silicon wafers into individual semiconductor devices.Type: GrantFiled: January 2, 2001Date of Patent: August 6, 2002Assignee: Micron Technology, Inc.Inventors: Salman Akram, Derek J. Gochnour, Michael E. Hess, David R. Hembree
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Patent number: 6408750Abstract: A color thermosensitive recording sheet extends two-dimensionally in main and sub scan directions perpendicular to each other. In a thermal printer for use with the recording sheet, two cutters remove front and rear margins from the recording sheet by cutting the recording sheet along lines extending in the main scan direction. Two slitters remove first and second side margins from the recording sheet by slitting the recording sheet along lines extending in the sub scan direction. A slitter shifter shifts the slitters in the main scan direction between a slitting position and home position. The slitters are set at the side margins when in the slitting position, and away from the recording sheet when in the home position. An externally operable mode selector selectively sets a marginless mode and margin mode. A controller causes the slitter shifter to shift the slitters to the slitting position when the marginless mode is set, and actuates the cutters and slitters.Type: GrantFiled: June 23, 2000Date of Patent: June 25, 2002Assignee: Fuji Photo Film Co., Ltd.Inventors: Satoru Goto, Akimasa Kaya
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Patent number: 6401580Abstract: A semiconductor wafer saw and method of using the same for dicing semiconductor wafers comprising a wafer saw including variable lateral indexing capabilities and multiple blades. The wafer saw, because of its variable indexing capabilities, can dice wafers having a plurality of differently sized semiconductor devices thereon into their respective discrete components. In addition, the wafer saw with its multiple blades, some of which may be independently laterally or vertically movable relative to other blades, can more efficiently dice silicon wafers into individual semiconductor devices.Type: GrantFiled: May 9, 2000Date of Patent: June 11, 2002Assignee: Micron Technology, Inc.Inventors: Salman Akram, Derek J. Gochnour, Michael E. Hess, David R. Hembree
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Publication number: 20010042425Abstract: In a perforating apparatus which has a holder to which a perforating blade can be fastened, the perforation is produced via the movement of a piston by the piston pressing against an air cushion, which in turn transmits this pressure to a perforating piston which presses the perforating blade downward. A positioning device which directly varies the position of the piston unit relative to the housing surface is provided for the zero setting of the piston.Type: ApplicationFiled: May 17, 2001Publication date: November 22, 2001Inventors: Markus Belmann, Hatto Hechler
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Patent number: 6293270Abstract: In a manufacturing method of a liquid jet recording head, an element substrate for the liquid jet recording head having an energy generating element for generating energy utilized to discharge a liquid from a discharge port, and a roof plate having a concave portion as a passage of the liquid communicated with the discharge port are joined to each other such that the energy generating element and the concave portion correspond to each other. The passage is formed by this joining. The element substrate is manufactured by including a process for cutting a substrate for cutting-out a plurality of the element substrates from its one face side by a cutting blade and forming a cutting groove in the substrate and a process for traveling a cutting blade so as to trace the cutting groove from the other face side of the substrate.Type: GrantFiled: June 15, 1999Date of Patent: September 25, 2001Assignee: Canon Kabushiki KaishaInventor: Takeshi Okazaki
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Patent number: 6286404Abstract: Equipment for cutting sheet material includes a plurality of pairs of blade units and counter-blade units slidable and fixable on respective support members, elongate in a direction perpendicular to that of the flow of the material being cut. The support members are common to a plurality of blade units or counter-blade units. The equipment further includes a unit for selectively engaging the blade and counterblade units with respective first and second carriages. The selective engagement units include a support structure on which is mounted a respective actuator including a piston, the distal end of which is shaped so as, in its extended position, to be able to engage a pin which projects from each blade unit and counter-blade unit respectively.Type: GrantFiled: August 25, 1998Date of Patent: September 11, 2001Inventor: Adelio Miglietta
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Patent number: 6279563Abstract: A semiconductor wafer saw and method of using the same for dicing semiconductor wafers are disclosed comprising a wafer saw including variable lateral indexing capabilities and multiple blades. The wafer saw, because of its variable indexing capabilities, can dice wafers having a plurality of differently sized semiconductor devices thereon into their respective discrete components. In addition, the wafer saw with its multiple blades, some of which may be independently laterally or vertically movable relative to other blades, can more efficiently dice silicon wafers into individual semiconductor devices.Type: GrantFiled: June 22, 2000Date of Patent: August 28, 2001Assignee: Micron Technology, Inc.Inventors: Salman Akram, Derek J. Gochnour, Michael E. Hess, David R. Hembree
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Patent number: 6250192Abstract: A semiconductor wafer saw and method of using the same for dicing semiconductor wafers are disclosed comprising a wafer saw including variable lateral indexing capabilities and multiple blades. The wafer saw, because of its variable indexing capabilities, can dice wafers having a plurality of differently sized semiconductor devices thereon into their elective discrete components. In addition, the wafer saw with its multiple blades, some of which may be independently laterally or vertically movable relative to other blades, can more efficiently dice silicon wafers into individual semiconductor devices.Type: GrantFiled: November 12, 1996Date of Patent: June 26, 2001Assignee: Micron Technology, Inc.Inventors: Salman Akram, Derek J. Gochnour, Michael E. Hess, David R. Hembree
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Patent number: 6196096Abstract: A semiconductor wafer saw and method of using the same for dicing semiconductor wafers comprising a wafer saw including variable lateral indexing capabilities and multiple blades. The wafer saw, because of its variable indexing capabilities, can dice wafers having a plurality of differently sized semiconductor devices thereon into their respective discrete components. In addition, the wafer saw with its multiple blades, some of which may be independently laterally or vertically movable relative to other blades, can more efficiently dice silicon wafers into individual semiconductor devices.Type: GrantFiled: November 4, 1999Date of Patent: March 6, 2001Assignee: Micron Technology, Inc.Inventors: Salman Akram, Derek J. Gochnour, Michael E. Hess, David R. Hembree