Abstract: A system for cutting blocks of cheese or other food product into chunks includes conveyors for moving the blocks along an automated, continuous, in-line processing path. A block cutter cuts the blocks longitudinally and or vertically to provide one or more stacks of slabs which are destacked by a vacuum transfer apparatus. A transverse cutter cuts the individual slabs to create chunks of cheese or other food product. The conveyors include a stack conveyor located in the processing path for conveying successive stacks of slabs from the block cutter to the product destacking apparatus in succession, and a slab conveyor located in the processing path for conveying successive slabs from the product destacking apparatus to the transverse cutter. A trim cutting module includes a rotating mechanism that rotates a block during the trim operation, allowing trim to drop to a trim disposal conveyance.

Abstract: A cheese vat for at least preparing curd for soft fresh cheese, comprising at least one cutting frame provided with a cutting wire system, which has a frame which has at least two opposite frame parts between which cutting wire sections extend, which frame parts are provided with openings form receiving a cutting wire, wherein the ends of a cutting wire are each fastened via pull relief means.

Abstract: A cheese shredding apparatus has a table top with a rolling platform that uses 2 pairs of beveled wheels. A partitioned hopper for containing blocks of cheese. A pair of cutting grids located at opposite ends of a cutting block. A pair of push cube modules. A motor powers the rolling platform by way of a cam which converts a rotational motion from the motor into a linear motion which actuates the back and fro motion of the rolling platform. The beveled wheels roll on a pair of tracks which are held within the table top frame. The beveled wheels maintain a very precise and accurate tracking motion of the rolling platform as they move back and forth as guided by the tracks.

Abstract: The present invention discloses a vibration cutting device and a method for vibration cutting. The vibration cutting device comprises at least one first oscillating heat, a controller, by means of which the first oscillating head can be selectively electrically excited in order to carry out oscillations within a frequency range below the kilohertz range, and a cutting tool disposed between a first and a second fixture, while the first fixture is connected to the first oscillating head such that mechanical oscillations of the first oscillating head can be transferred to the cutting tool.

Abstract: A wire saw with sawteeth strip updating structure is provided. A buckling structure is designed in the wire saw. The buckling structure is hidden the handle portion of the saw and includes a connecting unit and a combining unit. The connecting unit can be buckled or unbuckled from the combining unit. The sawteeth strip is connected to the combining unit in a tense state. In updating, the user only needs to push a guide sheet to release the connecting unit from the combining unit. Then the sawteeth strip is taken out easily from the saw for updating a new one. The operation is unnecessary to clamp the saw by a great force for the updating operation.

Abstract: A pair of vertically disposed handlebars spaced laterally apart mounting a plurality of vertically spaced flexible cords.

Abstract: A machine for cutting blocks of natural or similar types of stone includes a plurality of diamond-wire loops, wound about an assembly for the support and transmission of the cutting motion to said diamond-wire loops and at least one assembly for supporting, tensioning and guiding the diamond-wire loops; said assemblies move vertically in unison on the structure of the machine; and presents said supporting, tensioning and guiding assembly comprising a set of pulleys for the support and return of each diamond-wire loop, which are mounted and registered, for wire tensioning, on a movable tensioning means whose registration movement is actuated by a tensioning control means, independently of the movable tensioning means of contiguous diamond wires.

Abstract: A wire saw apparatus having: a wire wound around grooved rollers and axially travels in a reciprocating direction; a nozzle for supplying a slurry; and a work-feeding mechanism feeding a work toward the wire, and slicing into wafers by pressing and feeding the work against the wire traveling in a reciprocating direction while a slurry is supplied to the wire through the nozzle. A work-holding portion holds the work through a pad plate adhered to the work and a work plate, plate-shaped or block-shaped slurry-splash-blocking members are arranged in the direction of a right angle to a row of the wire wound around the grooved rollers below the work-holding portion and on both the wire cut-in side and a wire cut-out side.

Abstract: A device for cutting a length of pipe includes a clamp portion for clamping around a length of pipe and a bow moveable with respect to the clamp portion that retains a loop of diamond embedded wire. The device further includes a feed for driving the bow with respect to the clamp portion and a detector for detecting bending of the wire and a control responsive to the detector for controlling feed rates. The device is made of modular parts and has synchronizing arms for clamping around a length of pipe. In one embodiment, the wheels are retained in enclosures with slots through which the cutting wire passes.

Abstract: Fiber optic distribution cables and methods for manufacturing the same are disclosed. The methods present one or more optical fibers outward of the protective covering for distribution of the same toward the subscriber. Specifically, the methods include presenting a length of distribution optical fiber outward of the protective covering that is longer than the opening at access location. After the opening is made in the protective covering at the access location, the optical fibers for distribution are selected. Then a tool according to the present invention is positioned about the optical fibers selected for distribution and slid within the protective covering of the fiber optic distribution cable until it reaches a cutting location within the fiber optic distribution cable. Consequently, the tool is positioned for cutting the distribution optical fiber at a cutting location within the fiber optic distribution cable at a downstream location.

Abstract: The invention discloses a device for cutting through an adhesive bead of a vehicle pane, in particular a windshield, having a motor-driven winding-up device that comprises a coil for winding up a cutting wire in a working direction for cutting through the adhesive bead, the winding-up device being provided with a strain relief for the cutting wire which allows the cutting wire to be withdrawn from the winding-up device in a sense opposite to the working direction.

Abstract: Device (1) for separating a strand (3) of plastic material, which can be moved along a conveying passage (2), into longitudinal portions (3a), having at least one notching device (5) which on all sides of the passage (2) comprises in each case a notching tool (8a to 8d) which can be moved by means of a tool drive (18) in a tool guide (17) between an initial notching position and a notching position, wherein the cutting device (4) comprises two cutting wire holders (24) which are disposed in mutually opposite-lying boundary regions of the passage (2) and which can be moved transversely with respect to the passage (2) by means of a cutting drive (26) in a cutting guide (25), and wherein the notching device (5) with its notching tools (8a to 8d) are disposed its passage (2) the support module (9) which is moveable forwards and backwards [sic].

Abstract: A sawing device for sawing silicon blocks comprises at least one cutting element for sawing silicon blocks, the cutting element being drivable by means of a drive device, at least one guide device, with the at least one cutting element being alignable along a predetermined path by means of the at least one guide device, and at least one monitoring device for monitoring the position of the at least one cutting element.

Abstract: A wire saw (S) for separating a plurality of ceramic components (11-16) from a ceramic component block (1) has a roller system (2), the roller system has a plurality of deflecting rollers (3-5) guiding a wire (6) to form a wire harp (7), wherein at least one of the deflecting rollers (3) is divided into separate discs (31-36) guiding a single wire winding (61-66) of the wire (6) and being inclined at an adjustable angle (a) of less than 90 DEG to an axle (A) connecting the centers (M1-M6) of the discs (31-36).

Abstract: A method for the continuous production of cookies having a high content of large inclusions, such as chocolate chips, nuts, and fruit pieces includes extruding a cookie dough containing the inclusions through a die orifice to obtain an extrudate dough rope, and cutting the extrudate dough rope with an ultrasonic cutting blade. The ultrasonic cutting severs the extrudate dough rope into dough pieces which fall onto a moving conveyer into a substantially uniform or regular array for uniform baking. The ultrasonic cutter is controlled to provide a roughened top surface on a dough piece to provide a home baked appearance upon baking, while cutting through the inclusions without substantial displacement of the inclusions which would cause pock marks on the surface of the dough piece, and without substantial dough piece weight variation.

Abstract: A wire slicing system and method for using it include one or more of the following features: arrangements and/or operations that relate to handling the wire; apparatus and methods that relate to wire tensioning; equipment and techniques for manipulating the workpiece; arrangements and/or operations designed for cooling and swarf (debris) removal; controls and/or automation that can be used in conjunction with these features.

Abstract: A wire saw for cutting hard materials includes a carbon nanotube fiber wire spun from carbon nanotubes. The carbon nanotube fiber wire may be made from a plurality of fibers, each fiber being spun from carbon nanotubes, the fibers being twisted together to form the wire. Furthermore, the wire may also include diamond particles, silicon carbide particles and/or extra carbon nanotubes to enhance the abrasive properties of the wire. A method is provided for slicing a silicon boule including: linearly translating a carbon nanotube fiber wire between rotating drums while maintaining the wire under tension; using a fixture, moving the silicon boule onto the moving tensioned wire, whereby the wire cuts into the silicon; delivering lubricating fluid to the surface of the silicon where contact is made with the wire; and collecting the lubricating fluid after it leaves the surface of the silicon.

Abstract: An apparatus and method are disclosed for cutting a cylindrical plastic bottle into two sections, providing the open end of one section with an externally threaded collar and the open end of the other section with an internally threaded collar, and threadedly engaging the two sections into a storage container.

Abstract: An apparatus is described for machining on the face side a negative mold for a profile element (1) which is made of thermoplastic foamed material, forms the branch of a channel of a shaft floor and can be applied in an interlocking manner to a profile strand for the main channel, comprising a table (3) for receiving the profile element (1) to be machined and with a support (5) which is movable along a predetermined planar path for a curved heating wire (4) extending in one plane along the profile.

Abstract: A diamond wire saw and method provides a frame that includes a clamp that attaches to a target (e.g. piling, beam, tubular), an elongated toothed rack extending away from the mount and target, and a moving portion that carries the diamond wire and motor drives that advance the moving portion toward the target and along the toothed rack while driving the wire around roller guides.

Abstract: An inline tape cutter system that manufactures taped packages that can be later-opened without the needed for cutting tools to manual cut packing tape. The inline tape cutter system provides a package engagement assembly having a drive assembly, a cutting arm and an engagement arm, wherein physical contact between the engagement arm and a closed package on a conveyor assembly imparts rotational motion to the drive assembly and directs the cutting arm into contact with the closed package. The cutting arm can include a cutting wire form from a resistive heating element that is capable of burning/cutting packaging tape on the closed package. The inline tape cutter system can include a horizontal positioning assembly and a vertical positioning assembly such that the package engagement assembly can engage a wide variety of package sizes and configuration.

Abstract: A device for processing the contact surface of a mold profile has a table for receiving the mold profile and a heating wire running in accordance with the cross-sectional profile of the contact surface to be produced, which is movable in relation to the table along the contact surface. The mold profile is rotatable around the receptacle axis coaxially to the table receiving the contact surface in relation to the heating wire, which, originating from the receptacle axis, runs diagonally in relation to the receptacle axis at an angle corresponding to the conical contact surface to be processed, and the table has a passage for the heating wire to be inserted into the processing allowance of the mold profile in relation to the table in the direction of the receptacle axis.

Abstract: A cutting device includes a substrate, a supporting arm mounted on the substrate, a driving component supported by the supporting arm, and a cutting member. The cutting member includes a connection member and a cutting wire. The connection member includes an attachment portion connected to the driving component and a securing portion. The cutting wire is positioned on the securing portion.

Abstract: An apparatus and method for producing tissue slides is disclosed. The apparatus includes a holding assembly for manipulating the sample block, a blade assembly for preparing a thin section from the sample block, and a transfer roller mechanism for transferring the thin section to a receiving medium. The apparatus further includes a controller that may track the sample block and thin section. The method includes the steps of first locating a sample embedded within a support medium, which may be paraffin or a similar medium. Next, the embedded sample is oriented in such a way that its working surface is presented. This orientation may entail determining the orientation of the embedded sample with respect to the blade that will produce the largest cross-sectional area. Next, a slice of the sample from said embedded sample is removed and subsequently transferred to a suitable receiving medium, which may include a microscope slide.

Abstract: An apparatus for separating a laminated substrate assembly comprises at least a substantially planar assembly, a cutting member housing assembly positioned on a first side of the substantially planar assembly, a cutting member receiving assembly positioned on a second side of the substantially planar assembly, substantially opposite from the first side of the planar assembly suitable for receiving an amount of the elongated cutting member. At least one of the cutting member housing assembly or the cutting member receiving assembly is configured to provide an amount of tension to the elongated cutting member as the elongated cutting member is released by the cutting member housing assembly or received by the cutting member receiving assembly, and the elongated cutting member is configured to remove an amount of adhesive from an adhesive layer of the laminated substrate assembly.

Abstract: A system for cutting blocks of cheese or other food product into chunks includes conveyors for moving the blocks along an automated, continuous, in-line processing path. A block cutter cuts the blocks longitudinally and or vertically to provide one or more stacks of slabs which are destacked by a vacuum transfer apparatus. A transverse cutter cuts the individual slabs to create chunks of cheese or other food product. The conveyors include a stack conveyor located in the processing path for conveying successive stacks of slabs from the block cutter to the product destacking apparatus in succession, and a slab conveyor located in the processing path for conveying successive slabs from the product destacking apparatus to the transverse cutter. A trim cutting module includes a rotating mechanism that rotates a block during the trim operation, allowing trim to drop to a trim disposal conveyance.

Abstract: The rolled media cutter includes an elongated tray and a cutting mechanism. The elongated tray includes first and second substantially parallel channels. The first channel is formed in the tray and is configured to receive the rolled media therein. The cutting mechanism is configured to be slidingly coupled to the second channel. The cutting mechanism includes a cutting surface and a slider coupled to the cutting surface. The slider is configured to be retained within the channel so as to prevent said cutting mechanism from being removed from at least a portion along the second channel.

Abstract: A machine and method for making bags is described and includes a web traveling from an input section to a rotary drum, to an output section. The rotary drum includes at least one seal bar, having a first sealing zone, and an adjacent weakening zone. The weakening zone may be a heated perforator, includes a heating wire, or be disposed to create an auxiliary sealed area. The heating wire can have, connected thereto, a source of power that is at an adjustable voltage or magnitude, and/or pulsed, and/or a feedback loop. The heating wire may be an NiCr wire and make intermittent contact with the web and be disposed in an insert. The weakening zone may create a line of weakness that is uniform or varies in intensity, is a separating zone, or includes a heat film, a toothed blade, a row of pins, a source of air, or a source of vacuum. The sealing zones may include temperature zones, cartridge heaters, cooling air, or heated air, or a source of ultrasonic, microwave or radiative energy.

Abstract: A method for slicing an ingot may improve nanotopography at a surface of a wafer. In the method, an ingot is sliced into a plurality of wafers via a slurry while slurry is supplied to a moving wire. A first wire to form a first slicing portion at the wafer firstly slices one side of the ingot. A second wire secondly slices the remaining portion of the ingot to form a second slicing portion continued from the first slicing portion, wherein the first wire has a smaller diameter than that of the second wire.

Abstract: A cheese slicer having a bottom plate on which a block of cheese can be placed, a vertical guide rod mounted on the bottom plate having an external thread on which a slicing arm with a slicing string, and a roundel with an internal thread, which is received on the external thread. The slicer also has a holding arm, which holds the upper part of the block of cheese in position during the slicing operation. The holding arm includes a second roundel, which is coupled to the slicing arm roundel, and which has an internal flush bore such that the holding arm is slidably mounted on the guide rod below the slicing arm roundel and moves vertically. The holding arm prevents tilting of the cheese and the cutting of slices not of uniform thickness.

Abstract: This invention is directed toward a system for driving a wire loop cutting element. More particularly, the disclosed invention employs a frame and pulleys to drive a wire loop cutting element.

Abstract: A method for slicing an ingot may improve nanotopography at a surface of a wafer. In the method, an ingot is sliced into a plurality of wafers via a slurry while slurry is supplied to a moving wire. A first wire to form a first slicing portion at the wafer firstly slices one side of the ingot. A second wire secondly slices the remaining portion of the ingot to form a second slicing portion continued from the first slicing portion, wherein the first wire has a smaller diameter than that of the second wire.

Abstract: A method for slicing an ingot may improve nanotopography at a surface of a wafer. In the method, an ingot is sliced into a plurality of wafers via a slurry while slurry is supplied to a moving wire. A first wire to form a first slicing portion at the wafer firstly slices one side of the ingot. A second wire secondly slices the remaining portion of the ingot to form a second slicing portion continued from the first slicing portion, wherein the first wire has a smaller diameter than that of the second wire.

Abstract: This invention is directed toward a system for driving a wire loop cutting element. More particularly, the disclosed invention employs a frame and pulleys to drive a wire loop cutting element.

Abstract: A sawing strip for fixing a substantially cylindrical workpiece when cutting off slices from this workpiece with a wire saw has a first face, which is concavely curved perpendicular to its longitudinal direction for connecting to the workpiece, a second face opposite the first face for connecting to a mounting plate, and two side faces which connect the first face and the second face, two edges of the sawing strip at which the side faces meet the first face at a distance a from each other, an imaginary line on the first face marking its minimum distance d from the second face, the side faces being at a distance b, measured at the height of the line and perpendicular to the distance d, wherein the distance b is less than the distance a. The sawing strip is useful for decreasing waviness of wafers cut from a cylindrical workpiece using the sawing strip.

Abstract: A cheese vat for at least preparing curd for soft fresh cheese, comprising at least one cutting frame provided with a cutting wire system, which has a frame which has at least two opposite frame parts between which cutting wire sections extend, which frame parts are provided with openings form receiving a cutting wire, wherein the ends of a cutting wire are each fastened via pull relief means.

Abstract: A method for slicing an ingot may improve nanotopography at a surface of a wafer. In the method, an ingot is sliced into a plurality of wafers via a slurry while slurry is supplied to a moving wire. A first wire to form a first slicing portion at the wafer firstly slices one side of the ingot. A second wire secondly slices the remaining portion of the ingot to form a second slicing portion continued from the first slicing portion, wherein the first wire has a smaller diameter than that of the second wire.

Abstract: A culinary tool includes a base member that has a planar bottom surface and an arcuate top surface for fitting an entire roll of cookie dough thereon. The top surface is contoured symmetrically to an outer surface of the roll of cookie dough. The base member has oppositely seated longitudinal sides equidistantly spaced from the longitudinal axis thereof. The base member is provided with grooves equidistantly spaced along a length thereof. The grooves traverse a length of the roll of cookie dough, extend downwardly from the top surface, and terminate above the bottom surface. A slicing section is pivotally conjoined to opposed base member ends, is rearwardly offset from a base member center, and is repeatedly pivotal along a fulcrum axis such that the slicing section penetrates through the grooves so that the roll of cookie dough becomes completely severed into disc-shaped segments defined by the grooves.

Abstract: A machine is disclosed for cutting a piece of styrofoam or like material. This styrofoam cutting machine comprises a working platform, a support arm fixed on the working platform, a heating wire attached to the end of the support arm, and a protective mantle that is positioned around the heating wire. The protective mantle around the heating wire prevents the machine operator from coming into direct contact with the heating wire and thus prevents accidents, making the operation safer and more reliable.

Abstract: An ingot 3 of a hexagonal III-nitride crystal is cut using a wire array 21 composed of a wire 22. On this occasion, the ingot 3 is cut in such a manner that the ingot 3 is sliced with supply of an abrasive fluid while feeding at least one of the ingot 3 and wire 22 in a direction perpendicular to an extending direction B of the wire 22. During cutting the ingot 3, the extending direction B of the wire 22 is inclined at 3° or more to the {1-100} plane of the ingot 3.

Abstract: A wire saw (1; 100) for cutting a workpiece includes a device (21, 22, 24, 27) for setting, controlling and/or maintaining a predetermined or desired water content in at least part of the gaseous medium that contacts the slurry. With the wire saw according to the invention and the process carried out using this wire saw, it is possible to achieve consistently good surface properties of the resulting wafers over a prolonged period of use of a slurry.

Abstract: A wire-cutting apparatus 10 used in the manufacture of bricks. The apparatus includes a pair of spaced generally parallel coextensive beams 13 and 14 between which cutting wires 15 pass. Associated with each wire 15 are groove-forming blades 27 and 28.

Abstract: A sawing device includes a holding device (22) arranged so as to hold in the course of wire sawing the different sawed slices (23) substantially parallel and such that the width of the sawing gaps (24) is held constant. The device includes, for this purpose, holding members (25), for example in the form of a bar (30) whose resilient coating (31) is applied by springs (35) against a lower portion (26) of the slices (23) . There are thus obtained slices without undulations, striations, breakages and irregularities; moreover, the invention permits easy repair of the layer of wires after breakage of the wire.

Abstract: An apparatus for transferring material winding between spools. The apparatus includes spindels for positioning first and second spools in a co-planar arrangement with parallel axes of rotation. With the material initially secured to the base of a first spool with tape, a winding mechanism is energized to turn the spools. When the first spool is filled, a first sheave directs the incoming material to the second spool which is rotated at the rate of material supply. A tape applicator is then directed to apply a section of tape over the material, pressing it against the base of the second spool. A small wire is included on the base of the tape being applied. The applicator force on the wire against the material is designed to be sufficient to sever the material, separating the material on the first spool from the material being wound on the second.

Abstract: A method for manufacturing a sintered magnet includes the steps of producing a green compact of powder for the sintered magnet, machining the green compact with a wire-saw, and sintering the green compact.

Abstract: A method of cutting a rare-earth alloy with a wire saw, obtained by fixing abrasive grains on a core wire with a resin layer, includes the step of moving the wire saw while a portion of the rare-earth alloy being machined with the wire saw is immersed in a coolant, which is mainly composed of water and has a surface tension of about 25 mN/m to about 60 mN/m at about 25° C., thereby cutting the rare-earth alloy. In the wire saw, an average distance between two of the abrasive grains, which are adjacent to each other in a length direction, is about 150% to less than about 400% of the average grain size of the abrasive grains, an average height of portions of the abrasive grains, protruding from the surface of the resin layer, is about 70% or less of the average grain size of the abrasive grains, and a thickness deviation percentage of the resin layer with respect to the core wire is about 40%.

Abstract: A method of cutting a rare-earth alloy with a wire 20, on which abrasive grains are fixed with a resin layer provided on the outer surface of a core wire, includes the steps of: providing a wire, of which the surface is coated with a lubricant including a glycol, by reeling the wire up in a pair of reel bobbins 40a and 40b; reeling the wire off one of the reel bobbins and letting the wire travel on a plurality of rollers 10a, 10b and 10c; and cutting the rare-earth alloy with the traveling wire while a portion of the rare-earth alloy being cut with the wire is supplied with a first coolant which is mainly composed of water. As a result, the life of a wire can be extended when a rare-earth alloy is cut with a wire saw machine using a coolant which is mainly composed of water.

Abstract: An apparatus for forming shaped surfaces of an elongate substrate is disclosed. The apparatus includes a first and second collar spaced along the substrate, wherein a cutting filament extends between the collars. The collars are selectively rotated to pass the cutting filament through the substrate and form a shaped surface. The shaped surface can include conical or frustoconical shapes.

Abstract: A sawing device includes a wire assembly (15) supported on wire-guiding rolls (11, 12) and pressed against a workpiece to be sawn (20) fixed on a support table (21). An oscillating device (23) produces a relative reciprocating movement between the workpiece and the wire assembly (15) around an oscillation axis (A) whereof the spatial position can be adjusted and programmed so that the oscillation axis (A) is at a programmable and adjustable distance from an effective axis of rotation (28) of the oscillating device (23).

Abstract: A method and apparatus for diamond wire cutting of metal structures, such as nuclear reactor vessels, is provided. A diamond wire saw having a plurality of diamond beads with beveled or chamfered edges is provided for sawing into the walls of the metal structure. The diamond wire is guided by a plurality of support structures allowing for a multitude of different cuts. The diamond wire is cleaned and cooled by CO2 during the cutting process to prevent breakage of the wire and provide efficient cutting. Concrete can be provided within the metal structure to enhance cutting efficiency and reduce airborne contaminants. The invention can be remotely controlled to reduce exposure of workers to radioactivity and other hazards.