Abstract: A cutter blade is relatively moved along an outer periphery of a semiconductor wafer, and dust generated at a tape cutting site by the cutter blade and attached to an upper surface of the protective tape is collected with a dust collecting member which relatively moves with the cutter blade with respect to the semiconductor wafer, and the dust collected at a predetermined portion is suctioned and removed with a suction nozzle after the completion of tape cutting.

Abstract: A cutting mold for removing two opposite superfluous rigid circuit boards from a rigid-flexible circuit board. A first cutter is connected to a first moldboard. A first barricade is connected to the first moldboard. The maximum vertical distance from the first barricade to the first moldboard exceeds that from the first cutter to the first moldboard. A second moldboard is opposite the first moldboard. The first and second moldboards move with respect to each other. A second cutter is connected to the second moldboard and corresponds to the first cutter. A second barricade is connected to the second moldboard and detachably abuts the first barricade. The maximum vertical distance from the second barricade to the second moldboard exceeds that from the second cutter to the second moldboard. The first and second cutters cut the superfluous rigid circuit boards when the first and second moldboards move toward each other.

Abstract: An exemplary method for cutting a first printed circuit board (PCB) into a plurality of second PCBs, the method includes: providing a plurality of first dimension parameters of the first PCB; providing a plurality of second dimension parameters and an interval parameter of the second PCB; performing a process for selecting a best calculating mode and a corresponding cutting parameter according to the first dimension parameters, the second dimension parameters, and the interval parameter; calculating coordinate parameters of each second PCB; and cutting the first PCB into the plurality of second PCBs.

Abstract: Integrated circuit package separator for separating integrated circuit packages from a board. A base having a plurality of pins extending upwardly therefrom is provided. A support is provided over the base. The support has an upper surface and a plurality of holes extending therethrough. The pins extend through the holes and upwardly beyond the upper surface of the support. An actuator is provided beneath the support. A board having a plurality of integrated circuits bonded thereto is provided. The integrated circuits form a repeating pattern of integrated circuit packages across the board, and the board has a plurality of holes extending through it. The board is placed over the support upper surface with the pins extending into the holes in the board and cut to separate the integrated circuit packages from one another. After the cutting, the support is vertically displaced by the actuator to lift the support off the pins.

Abstract: An integrated circuit package separator. A base having a plurality of pins extending upwardly therefrom is provided. A support is provided over the base. The support has an upper surface and a plurality of holes. The pins extend through the holes and upwardly beyond the upper surface of the support. An actuator is provided beneath the support. A board having a plurality of integrated circuits bonded thereto is provided. The integrated circuits form a repeating pattern of integrated circuit packages across the board, and the board has a plurality of holes. The board is placed over the support upper surface with the pins extending into the holes in the board. While the board is over the support upper surface, it is cut to separate the integrated circuit packages. After the cutting, the support is vertically displaced by the actuator to lift the support off the pins.

Abstract: A hermetic sealing method, which is capable of preventing oxidation of a micro-electromechanical system (MEMS) and sealing the MEMS at a low temperature. A low temperature hermetic sealing method having a passivation layer includes depositing a junction layer, a wetting layer, and a solder layer on a prepared lid frame, depositing a first protection layer for preventing oxidation on the solder layer and forming a lid, preparing a package base on which a device is disposed, and in which a metal layer and a second protection layer are formed around the device, and assembling the lid and the package base, heating, and sealing them. The protection layer is laminated on the solder layer that is formed by the lid, thereby preventing oxidation without using a flux. The low temperature hermetic sealing method having a passivation layer is suitable for sealing a device, such as the MEMS, which is sensitive to heat, water and other by-products.

Abstract: An improved unloading apparatus for a plate-like workpiece cutting machine includes a platform, a faceplate, a lift device, and an intermediate member. The platform is provided with a channel recessed downwards from a top side thereof. The faceplate is mounted on the top side of the platform to seal the channel for putting to-be-machined plate-like workpieces thereon and is provided with a plurality of through holes. The lift device is mounted below the faceplate and includes a power unit and a supporting member, which can be driven to be lifted and lowered by the power unit. The intermediate member is disposed with a plurality of locating columns corresponding in locations to the through holes of the faceplate and is mounted on a top side of the supporting member.

Abstract: A base having a plurality of pins extending upwardly therefrom is provided. A support is provided over the base. The support has an upper surface and a plurality of holes extending therethrough. The pins extend through the holes and upwardly beyond the upper surface of the support. An actuator is provided beneath the support. A board having a plurality of integrated circuits bonded thereto is provided. The integrated circuits form a repeating pattern of integrated circuit packages across the board, and the board has a plurality of holes extending through it. The board is placed over the support upper surface with the pins extending into the holes in the board. While the board is over the support upper surface, it is cut to separate the integrated circuit packages from one another.

Abstract: An integrated circuit package separator for separating integrated circuit packages from a board includes a base, a support over the base, and a pair of pneumatic actuators including first and second lift members laterally spaced from the base and beneath respective ends of a pair of opposing ends of the support. The first and second lift members are configured to vertically displace the support and lift the support off the base by contacting the support. Individual actuators of the pair include release valves configured to equilibrate a back-pressure of the individual actuators to ambient during lifting of the support. The separator includes a cutting mechanism configured to cut the board while the board is over the upper surface of the support to separate the integrated circuit packages from one another.

Abstract: Vertical holes are created in streets separating individual integrated circuit (IC) dies formed on a semiconductor wafer, the holes spanning saw-lines along which the wafer is to be later cut to separate the IC die from one another to form individual IC chips. The holes are then filled with conductive material. After the wafer is cut along the saw-lines, portions of the conductive material on opposing sides of the saw-lines remain on peripheral edges of the IC chip to form signal paths between the upper and lower surfaces of the IC chips.

Abstract: A precision punch and die device for punching holes in a ceramic substrate and method of assembling the device. The device comprises a punch which moves relative to a substrate for punching a hole in the substrate and a die assembly including one or more precision die plates and support plates for guiding a punch and punching a substrate.

Abstract: A micromechanical structure is described which is disposed on a base body and requires protection from environmental influences by a covering body. Furthermore, electrical contacts are necessary for establishing contacts for the micromechanical structure. By skillfully carrying out a sawing-into operation and a sawing-through operation, it is possible to expose the electrical contact.

Abstract: A fiducial includes complementary patterns that are situated symmetrically about a common axis. The complementary patterns permit location of the common axis as an axis that is equidistant from the complementary patterns. The complementary patterns are displaced from the common axes by different distances so that the common axis is located using the complementary patterns nearest the common axis to accurately locate the common axis. The complementary patterns include etch-compensation features that permit the common axis to be accurately located even if an etch process defines the fiducial and the etch process exhibits a process error or variation such as underetching or overetching. The fiducial may be produced by transferring a fiducial pattern from a mask such as a photomask. The fiducial pattern may also be defined on the mask using a computer-aided design program.

Abstract: An improved punching tool (1) has a lower tool (3), which is subdivided into a lower tool base plate (7) and a lower-tool operative part (8). The lower tool base plate (7) has a receiving face, with which uniform base areas of a plurality of lower-tool operative parts (8) are associated. The dividing place between the lower-tool operative part (8) and the lower tool base plate (9) is disposed such that all the workpiece-specific designs are present exclusively on the lower-tool operative part (8), while the lower tool base plate (7) is the same, without change, for all workpieces to be machined.

Abstract: The object of the present invention is to form individual packaged ICs by using a single apparatus to cut wiring boards on which a plurality of IC chips are mounted. The first cutting device 23 cuts the wiring boards 3 into separate parts along one direction, so that the cut wiring boards 3 constitute strip-form cut wiring boards 3a. The cut wiring boards 3a are conveyed to the second cutting device 33, and are fed by the second conveying device 43 along the direction of length and are then cut by the second cutting device 33 with the orientation altered by 90 degrees relative to the first cutting direction. The wiring boards 3b resulting from the cutting performed by the second cutting device 33 constitute the original forms of the IC packages. The wiring boards 3b that have been cut and conveyed from the second cutting device 33 enter a cleaning step.

Abstract: A cutting machine equipped with a chuck table for holding a workpiece, a cutting means having a cutting blade for cutting the workpiece held on the chuck table, and a cutting blade detector having a light emitting portion and a light receiving portion for detecting the state of the cutting blade, wherein the cutting blade detector comprises a protective cover means for selectively covering the light emitting portion and the light receiving portion.

Abstract: In one aspect, the invention includes a method of forming integrated circuit packages. A base having a plurality of pins extending upwardly therefrom is provided. A support is provided over the base. The support has an upper surface and a plurality of holes extending therethrough. The pins extend through the holes and upwardly beyond the upper surface of the support. An actuator is provided beneath the support. A board having a plurality of integrated circuits bonded thereto is provided. The integrated circuits form a repeating pattern of integrated circuit packages across the board, and the board has a plurality of holes extending through it. The board is placed over the support upper surface with the pins extending into the holes in the board. While the board is over the support upper surface, it is cut to separate the integrated circuit packages from one another. After the cutting, the support is vertically displaced by the actuator to lift the support off the pins.

Abstract: A die and method of gang punching selective holes in thin sheet materials such as greensheets are provided in which slugs of greensheet material formed during the punching operation easily fall through the die and are removed. The die uses a number of plates one of which is a window plate having openings corresponding to openings in a die plate disposed thereon. The window plate openings have a larger diameter than the die plate openings and also a plurality have an oval shape which oval shape openings provide less resistance to the falling slugs and facilitate removal of the slugs from the die. The window plate also preferably has a central grid open area with the remainder of the plate having vertical through-holes corresponding to the through-holes of the die plate. The die also preferably employs a die plate made from at least two sheets of material, i.e.

Abstract: The object of the present invention is to form individual packaged ICs by using a single apparatus to cut wiring boards on which a plurality of IC chips are mounted. The first cutting device 23 cuts the wiring boards 3 into separate parts along one direction, so that the cut wiring boards 3 constitute strip-form cut wiring boards 3a. The cut wiring boards 3a are conveyed to the second cutting device 33, and are fed [into the second cutting device 33] by the second conveying device 43 along the direction of length. [The cut wiring boards 3a] are then cut by the second cutting device 33 with the orientation altered by 90 degrees relative to the first cutting direction. The wiring boards 3b resulting from the cutting performed by the second cutting device 33 constitute the original forms of the IC packages. The wiring boards 3b that have been cut and conveyed from the second cutting device 33 enter a cleaning step.

Abstract: This invention relates to a method and apparatus for pick and place handling of electronic components that have been formed on a common substrate and then separated on a cutting chuck. A transferring means is provided formed with openings for receiving separated components. The opening is defined by walls of which at least one is movable so as to engage the components and hold them in a fixed configuration and orientation while they are moved by a sliding motion through a processing unit and onto a transfer platform for delivery to an output track.

Abstract: A method for singulating a substrate containing semiconductor components is performed using a nest for holding the substrate, a prestage alignment base for aligning the substrate during a prestage alignment step, and a vacuum cutting base for holding the nest and the substrate during a cutting step. The prestage alignment base includes locator pins configured to engage locator openings on the substrate to align the substrate on the nest. As the cutting base does not include the locator pins, the cutting step can be performed without saw scrap collecting on the locator pins. A system for performing the method includes the nest and the prestage alignment base having the locator pins configured to engage the locator openings on the substrate. The system also includes the sawing base which includes pedestals with vacuum conduits for holding the substrate stationary on the nest for sawing.

Abstract: A method and apparatus for punching holes in a substrate which is disposed between a punch head with a fixed partial pattern of holes and a die having a full array pattern of holes. The punch head punches holes in the substrate by aligning with the die and contacting the substrate. Punches contained in the punch head articulate in at least one of x, y, and theta positions in order to precisely align with holes in the die thereby producing holes in the substrate which precisely match holes in the die.

Abstract: A die cutting press (10) having a base platen (12), a bolster (16) shiftably and rotatably mounted on the base platen, and a die unit (22) mounted on the bolster for movement therewith is provided for precision cutting of individual part-defining areas (30, 230) from longitudinal and laterally-arranged rows of part areas of a relatively thin substrate (32, 232) that is susceptible to deformation and warpage during its manufacture and wherein registration indicia (236, 238) is provided in association with each of the part-defining areas.

Abstract: A cutting system which reduces the risk of damage to a printed wiring board during bevel formation by using a modified cutter having reduced length cutting edges joined to guide surfaces wherein the cutting edges have an actual angle of intersection which is less than the apparent angle of intersection of the guide surfaces.

Abstract: A base having a plurality of pins extending upwardly therefrom is provided. A support is provided over the base. The support has an upper surface and a plurality of holes extending therethrough. The pins extend through the holes and upwardly beyond the upper surface of the support. An actuator is provided beneath the support. A board having a plurality of integrated circuits bonded thereto is provided. The integrated circuits form a repeating pattern of integrated circuit packages across the board, and the board has a plurality of holes extending through it. The board is placed over the support upper surface with the pins extending into the holes in the board. While the board is over the support upper surface, it is cut to separate the integrated circuit packages from one another.

Abstract: Alignment method and apparatus for aligning a cutting blade with a selected street on a semiconductor wafer. It has square chip areas defined by crossing streets and alignment spots formed on its surface. Two street lines with at least one street intervening therebetween are selected, and linear functions ƒ(x) and g(x) are determined on the basis of the coordinates of their alignment spots according to the least squares method. The linear functions ƒ(x) and g(x) run among the alignment spots at the closest distances thereto to represent the two selected streets. Another linear functions ƒ′(x) and g′(x) are determined by putting the linear functions f(x) and g(x) into parallelism with the X-axis.

Abstract: A method of punching a via or through hole in a polymer-metal laminate workpiece in a punch press. The punch press has a punch tool, a driver coil for driving the punch tool through the polymer-metal laminate workpiece, and a stopper for stopping the punch travel of the punch tool and mechanically returning the punch tool to its starting position. The method includes the steps of applying an electrical current pulse through the driver coil to electromagnetically drive the punch downward to and through the workpiece, and then elastically colliding the punch tool with the stopper to stop and return the punch tool on an upward return stroke. Subsequently a second, braking pulse is applied through the driver coil to electromagnetically brake the punch. The second electrical current is applied after the start of the punching pulse, for a time and magnitude sufficient to brake the punch press.

Abstract: The invention relates to a punch machine for punching a panel in which the position of each hole to be made is identified by a mark. The machine comprises a structure for receiving said panel, said structure presenting X and Y directions; means for holding said panel relative to the structure; at least four punch blocks secured to a support, each punch block having at least one punch carrier tool and at least one matrix carrier assembly; means for displacing each punch block separately in the X and Y directions and in rotation; optical means for comparing the position of each punch block with said mark; and means for separately controlling the displacement means in response to position error information.

Abstract: A precision punch and die device for punching holes in a ceramic substrate and method of assembling the device. The device comprises a punch which moves relative to a substrate for punching a hole in the substrate and a die assembly including one or more precision die plates and support plates for guiding a punch and punching a substrate.

Abstract: A depaneling system having multiple router stations. A feeder station in the dual routing station receives a panel from a feeder station. The feeder station then selectively delivers the panel to one of the router stations. The router station then severs all of the connections between the panel and the PC boards. The multiple router stations can also share a common router that is used by each station to sever the connections. In order to use a common router the router station have a movable receiving base which moves along a first axis. The router then moves along the second axis. The router and receiving base are then moved along the first and second axises independently to sever the connections.

Abstract: A method for dicing small devices including MEMS, ink jet printheads, lasers etc. The method comprises making a first pass cut into a substrate with a blade of narrow kerf and having long wear characteristics. This first pass cut is then followed with a polishing blade of wider kerf having desirable smooth cutting qualities.

Abstract: A cutting blade includes a shank portion and a cutting portion having a predetermined length and opposed sides, and affixed to the shank portion. The cutting portion has a cutting edge portion having a predetermined length and opposed sides and a continuous portion which continuously extends from the cutting edge portion to the shank portion, so that blade thickness gradually increases in a direction towards the shank portion. The cutting portion further has at least one pair of opposed concave curved surfaces substantially symmetrical to each other with respect to a center line, each opposed concave surface axially extending in a direction substantially parallel to the length of the cutting edge portion and provided on at least one of the cutting edge portion and the continuous portion.

Abstract: A through hole 5 formed in a substrate and having an electrode film on an inner surface thereof is cut and divided into two through holes or blind holes each of substantially semicircular arc shape through dicing processing using a rotating blade, and one of the-divided through holes 5 of substantially semicircular arc shape is used as an external connection terminal 3 of substantially semicircular concave arc shape thereby to form a surface mounted electronic parts having a plurality of the external connection terminals 3. The height H of the substantially semicircular arc formed at an inner surface of each of the external connection terminals is set to be equal to or smaller than a value obtained by subtracting twice a thickness t of the electrode film from a radius R of a curvature of the arc.

Abstract: A circuit substrate utilizes buried edge connectors. The buried edge connectors are mechanically disposed within the edge of the substrate and have substantial thickness. The configuration and method for making the same provides relatively large edge connectors mechanically constrained in the edge of a circuit substrate.

Abstract: The method of manufacturing electronic parts comprises the steps of: preparing a mother board; mounting element parts on the mother board; providing a thermosetting resin on a surface of the mother board surface on which the element parts are mounted; semi-curing the thermosetting resin so as to be in a range of a stage B condition of the thermosetting resin; splitting the mother board with the thermosetting resin into individual electronic parts each having a divided mother board, at least one element part and the thermosetting resin thereon; and heating the individual electronic parts so that the thermosetting resin in the stage B condition melts first and is then cured permanently.

Abstract: A gang-punch pin apparatus for punching selected hole patterns in thin sheet materials such as greensheets is provided. The gang-punch pin apparatus uses program plates in the punch apparatus which plates are positioned intermediate the non-punching end of the punch pins and a clearance plate wherein punch pins not used for punching a particular layer of the MLC are retracted into during punching. At the other punch pin locations, the punch pins, upon activation of the punch apparatus by compressing an expandable chamber, usually by application of a force on the punch apparatus, are extended through the lower portion of the punch apparatus to form vias in a greensheet. A die apparatus is also provided for use with the punch assembly to form the vias and to remove the punched material (slugs) from the die apparatus. The gang punch-pin may be shorter than conventional pins and be made at a low cost because of the thin sheet metal plates preferably used to make the component parts of the punch and die apparatus.

Abstract: An apparatus cuts a substrate having first and second portions, each portion having a respectively different level. A first support surface is located at a first level. The first portion of the substrate is supported by the first support surface. A second support surface is located at a second level different from the first level. The second portion of the substrate is supported by the second support surface. The first and second support surfaces are first and second die surfaces, respectively. A punch cuts the substrate between the first support surface and the second support surface. The punch has a V-shaped cross section. A stripper plate has first and second portions. The punch is positioned between the first and second portions of the stripper plate. The first portion of the substrate is clamped between the first portion of the stripper plate and the first die surface. The second portion of the substrate is clamped between the second portion of the stripper plate and the second die surface.