Abstract: A vertically mountable semiconductor device including a plurality of stub contacts extending perpendicularly from a bottom edge thereof. The stub contacts may be formed by trimming the leads of an existing vertical surface mount package. A complementary alignment device includes a receptacle for receiving the vertically mountable semiconductor device. The alignment device is attachable to a carrier substrate. Upon attachment of the alignment device to a carrier substrate and insertion of a vertically mountable semiconductor device into the receptacle, a contact element applies a downward force to the vertically mountable semiconductor device to establish and maintain an electrical connection between the vertically mountable semiconductor device and the carrier substrate.

Abstract: A sheet cutting device utilizing cutter blades as a position detection mechanism and a method of reporting cutter malfunctions is provided. The sheet cutting device including a cutter having a pair of cutter blades, one of the blades connected to a cutter driving mechanism for moving the blade through a cutting cycle, a power source is connected to one of the blades so that a circuit is closed when the blades contact one another, and a current sensing device in connection with the circuit to identify when the blades are in physical contact.

Abstract: A vertically mountable semiconductor device including a plurality of stub contacts extending perpendicularly from a bottom edge thereof. A complementary alignment device includes a receptacle for receiving the vertically mountable semiconductor device. The alignment device is attachable to a carrier substrate. Upon attachment of the alignment device to a carrier substrate and insertion of a vertically mountable semiconductor device into the receptacle, a contact element applies a downward force to the vertically mountable semiconductor device to establish and maintain an electrical connection between the vertically mountable semiconductor device and the carrier substrate.

Abstract: A punch and die tool for cutting a slug from a sheet of material that is retained in the opening of the die and does not adhere to or follow the punch on its upward stroke, and a method for retaining a slug in a die, are disclosed. The die is formed with one or more irregularities or grooves on the edge of the die face so that the slug cut by the operation of the punch and die will have a burr on its edge. The burr causes the slug to lodge in the inside surface of the die and prevents the slug from following the punch on its upward stroke.

Abstract: A trimming apparatus according to the present invention has a trim punch that provides a route for continuous air flow to prevent trimmed gate scraps from clogging the apparatus. The trim punch can have a groove or a through hole for providing the continuous air flow from outside into an outlet, through which trimmed gate scraps are discharged. This continuous air flow prevents the trimmed gate scraps from remaining inside the outlet and adhering to the trim punch. Therefore, clogging of the trimmed gate scraps in the apparatus is prevented.

Abstract: A lead cutting apparatus of an electronic component, which is capable of cutting of leads of the component to a specific length independent of the shape and size of the component. This apparatus includes a table with a flat surface on which an electronic component is placed. The package of the component is supported by the flat surface of the table. A pair of cutting units are located at each side of the table. Each of the pair of cutting units has a gripper for gripping a corresponding one of the leads of the component, a cutter for cutting the corresponding one of the leads to a specific length, and a retainer for retaining the package of the component on the table. The pair of cutting units are designed to be moved toward the table and away from the table by a pair of moving units, respectively.

Abstract: A method of cutting input/output columns on an electronic component includes the steps of: providing a shear plate which has a thickness that is less than the length of the columns and which has respective holes for receiving all of the columns; inserting the columns into the holes until a portion of the columns extend past the shear plate; placing a blade, with a cutting edge, at an acute angle against the shear plate such that only the cutting edge of the blade touches the shear plate; and, sliding the cutting edge of the blade against shear plate and through the portion of the columns which extend past the shear plate, while keeping the blade at the acute angle. With this method, crater-like voids and burrs on the cut ends of the columns are eliminated.

Abstract: A known good die array is obtained by a general semiconductor assembly technique to enable mass production of known good die by performing AC and burn-in tests upon a plurality of IC chips simultaneously. The IC chip is attached to the die pad of a lead frame by interposing an adhesive and is wire-bonded. The lead frame is electrically separated from the wire-bonded lead, and the resultant lead frame is inserted into a test jig to perform the AC and burn-in tests. Bonding wires are cut by a cutting apparatus with a diamond and/or a diamond-like blade to attach the plurality of known good die as arrays. The low-cost known good die can be produced in large quantities using ordinary IC chips and can be applied to personal computers beyond the current application field of multichip modules used in super computers.

Abstract: A radiating cable comprises a core having a center conductor bonded to, centered in, and supported by discs of dielectric material. A sleeve of dielectric material is extruded over the discs and thereby bonded thereto to form a plurality of sealed, coaxial, dielectric chambers. A tubular outer conductor is bonded in concentric relation to the sleeve. In a continuous process, at least one slot is formed in the outer conductor by a cutting operation and an outer jacket is extruded over the outer conductor. In a preferred embodiment, the outer conductor is made of an aluminum tube and two circumferentially equally spaced slots are formed therein by removing between 10 and 35% of the aluminum material. The width of the resulting slots may be configured so that a joint is formed in the slot between the insulating sleeve and the outer jacket, thus obviating the use of adhesive in bonding the outer jacket to the cable.

Abstract: A mold used in producing printed wiring board is disclosed. The mold comprises upper dies and lower dies for sandwiching a printed wiring board therebetween, thereby performing drilling, punching or the like, one of said upper dies and lower dies having a press surface which is provided with concave or convex portions for absorbing steps caused by forming a printed wiring circuit on the printed wiring board.

Abstract: An apparatus for supplying an electronic component to a mounting head of an electronic component mounting machine in such a manner that a lead guard interconnecting the front ends of leads of the electronic component is separated from a body of the electronic component before the electronic component is picked up by the mounting head. The apparatus includes a lower mold movable between a receiving position in which an electronic component having a lead guard is received on a die on the lower mold, a punching position in which the lead guard is separated from the body of the electronic component by a punch cooperating with the die and a picking-up position in which the electronic component devoid of the lead guard is picked up from the die. The electronic component supplied from a chute to a component rest is delivered by a transfer unit to the die while at rest in the receiving position. The transfer unit may include a vacuum nozzle for releasably holding the electronic component.

Abstract: An inspection station punch block apparatus for removing a portion of an integrated circuit die lead from a lead frame. The missing lead is used to mark a defective die and is lataer monitored by a scanning means which causes rejection of the die from the lead frame. A method of carrying out this operation is also disclosed.