Abstract: Systems and method for cooling computer systems are provided. A rack system for housing a plurality of computers is provided, the rack system including: a rack assembly configured to support a first stack of computers and a second stack of computers; and at least one fan assembly configured to create an airflow through the first stack of computers and into the second stack of computers. A method of cooling a plurality of computers in a rack system is provided, including: supporting a first stack of computers and a second stack of computers in a rack assembly; and effectuating an airflow through the first stack of computers and into the second stack of computers.

Abstract: The disclosed embodiments related to a component for use in a portable electronic device. The component includes a wall of the portable electronic device, containing an intake zone that includes a set of intake vents directed at a first angle toward one or more heat-generating components of the portable electronic device. The wall also includes an exhaust zone containing a set of exhaust vents directed at a second angle out of the portable electronic device.

Abstract: A low profile highly accessible computer enclosure with a processor plenum for cooling high power processors is disclosed. The enclosure includes one or more air movement devices that discharge air into a plenum. The plenum channels the air to a location proximate to one or more high power processors where it is discharged over the processors. The velocity of the air is sufficient to achieve a convection coefficient that will cool the high power processors. The enclosure can also be slidably mounted in a computer rack and include a multi-section top cover. While the computer is operating, an operator can access, inspect, service, repair, or replace components within server by sliding the server out of the front and/or rear of the computer rack and then removing one or more of the cover sections.