Intel Patents
Intel Corporation designs and manufactures microprocessors and chipsets for computing and communications equipment manufacturers. Its products may be found in desktops, servers, tablets, smartphones and other devices.
Intel Patents by Type- Intel Patents Granted: Intel patents that have been granted by the United States Patent and Trademark Office (USPTO).
- Intel Patent Applications: Intel patent applications that are pending before the United States Patent and Trademark Office (USPTO).
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Patent number: 11978155Abstract: An apparatus to facilitate inferred object shading is disclosed. The apparatus comprises one or more processors to receive rasterized pixel data and hierarchical data associated with one or more objects and perform an inferred shading operation on the rasterized pixel data, including using one or more trained neural networks to perform texture and lighting on the rasterized pixel data to generate a pixel output, wherein the one or more trained neural networks uses the hierarchical data to learn a three-dimensional (3D) geometry, latent space and representation of the one or more objects.Type: GrantFiled: September 25, 2020Date of Patent: May 7, 2024Assignee: Intel CorporationInventors: Selvakumar Panneer, Mrutunjayya Mrutunjayya, Carl S. Marshall, Ravishankar Iyer, Zack Waters
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Patent number: 11978948Abstract: Generally discussed herein are systems, devices, and methods that include a communication cavity. According to an example a device can include substrate with a first cavity formed therein, first and second antennas exposed in and enclosed by the cavity, and an interconnect structure formed in the substrate, the interconnect structure including alternating conductive material layers and inter-layer dielectric layers.Type: GrantFiled: August 27, 2021Date of Patent: May 7, 2024Assignee: Intel CorporationInventors: Vijay K. Nair, Digvijay Ashokkumar Raorane
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Patent number: 11978784Abstract: Gate-all-around integrated circuit structures having germanium nanowire channel structures, and methods of fabricating gate-all-around integrated circuit structures having germanium nanowire channel structures, are described. For example, an integrated circuit structure includes a vertical arrangement of horizontal nanowires above a fin, each of the nanowires including germanium, and the fin including a defect modification layer on a first semiconductor layer, a second semiconductor layer on the defect modification layer, and a third semiconductor layer on the second semiconductor layer. A gate stack is around the vertical arrangement of horizontal nanowires. A first epitaxial source or drain structure is at a first end of the vertical arrangement of horizontal nanowires, and a second epitaxial source or drain structure is at a second end of the vertical arrangement of horizontal nanowires.Type: GrantFiled: November 10, 2022Date of Patent: May 7, 2024Assignee: Intel CorporationInventors: Cory Bomberger, Anand Murthy, Susmita Ghose, Zachary Geiger
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Patent number: 11978727Abstract: Systems and methods for providing a low profile stacked die semiconductor package in which a first semiconductor package is stacked with a second semiconductor package and both semiconductor packages are conductively coupled to an active silicon substrate that communicably couples the first semiconductor package to the second semiconductor package. The first semiconductor package may conductively couple to the active silicon substrate using a plurality of interconnects disposed in a first interconnect pattern having a first interconnect pitch. The second semiconductor package may conductively couple to the active silicon substrate using a plurality of interconnects disposed in a second interconnect pattern having a second pitch that is greater than the first pitch. The second semiconductor package may be stacked on the first semiconductor package and conductively coupled to the active silicon substrate using a plurality of conductive members or a plurality of wirebonds.Type: GrantFiled: September 28, 2017Date of Patent: May 7, 2024Assignee: Intel CorporationInventors: Wilfred Gomes, Sanka Ganesan, Doug Ingerly, Robert Sankman, Mark Bohr, Debendra Mallik
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Publication number: 20240145383Abstract: An integrated circuit structure includes a device layer including a first set of devices and a second set of devices. An interconnect layer is above the device layer, where the interconnect layer includes one or more conductive interconnect features within dielectric material. In an example, a first ring structure including conductive material extends within the interconnect layer, and a second ring structure including conductive material extends within the interconnect layer. In an example, the second ring structure is non-overlapping with the first ring structure. In an example, the first ring structure is above the first set of devices of the device layer, and the second ring structure is above the second set of devices of the device layer.Type: ApplicationFiled: October 27, 2022Publication date: May 2, 2024Applicant: Intel CorporationInventors: June Choi, Keith E. Zawadzki, Kimberly L. Pierce, Mohammad Enamul Kabir
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Publication number: 20240144447Abstract: Deep learning models, such as diffusion models, can synthesize images from noise. Diffusion models implement a complex denoising process involving many denoising operations. It can be a challenge to understand the mechanics of diffusion models. To better understand how and when structure is formed, saliency maps and concept formation intensity can be extracted from the sampling network of a diffusion model. Using the input map and the output map of a given denoising operation in a sampling network, a noise gradient map representative of the predicted noise of a given denoising operation can be determined. The noise gradient maps from the denoising operations at different indices can be combined to generate a saliency map. A concept formation intensity value can be determined from a noise gradient map. Concept formation intensity values from the denoising operations at different indices can be plotted.Type: ApplicationFiled: December 7, 2023Publication date: May 2, 2024Applicant: Intel CorporationInventors: Anthony Daniel Rhodes, Ilke Demir
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Publication number: 20240144577Abstract: Apparatus and method for non-local means filtering using a media processing block of a graphics processor. For example, one embodiment of a processor comprises: ray tracing circuitry to execute a first set of one or more commands to traverse rays through a bounding volume hierarchy (BVH) to identify BVH nodes and/or primitives intersected by the ray; shader execution circuitry to execute one or more shaders responsive to a second set of one or more commands to render a sequence of image frames based on the BVH nodes and/or primitives intersected by the ray; and a media processor comprising motion estimation circuitry to execute a third set of one or more commands to perform non-local means filtering to remove noise from the sequence of image frames based on a mean pixel value collected across the sequence of image frames.Type: ApplicationFiled: April 25, 2023Publication date: May 2, 2024Applicant: Intel CorporationInventors: Attila Tamas AFRA, Johannes GUENTHER
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Publication number: 20240145410Abstract: Moisture hermetic guard ring structures for semiconductor devices, related systems, and methods of fabrication are disclosed. Such devices systems, and methods include a guard ring structure laterally surrounding semiconductor devices of a device layer and metal interconnects of an interconnect layer, the guard ring structure extending through the interconnect layer, the device layer, and a bonding layer adjacent one of the interconnect layer or the device layer the bonding layer, and contacting a support substrate coupled to the bonding layer. Such devices systems, and methods may further include via structures having the same material system as the guard ring structure and also extending through the interconnect, the device, and bonding layers and contacting a support substrate.Type: ApplicationFiled: January 4, 2024Publication date: May 2, 2024Applicant: Intel CorporationInventors: Mohammad Kabir, Conor P. Puls, Babita Dhayal, Han Li, Keith E. Zawadzki, Hannes Greve, Avyaya Jayanthinarasimham, Mukund Bapna, Doug B. Ingerly
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Publication number: 20240147867Abstract: Magnetoelectric magnetic tunnel junction (MEMTJ) logic devices comprise a magnetoelectric switching capacitor coupled to a pair of magnetic tunnel junctions (MTJs) by a conductive layer. The logic state of the MEMTJ is represented by the magnetization orientation of the ferromagnetic layer of the magnetoelectric capacitor, which can be switched through the application of an appropriate input voltage to the MEMTJ. The magnetization orientation of the magnetoelectric capacitor ferromagnetic layer is read out by the MTJs. The conductive layer is positioned between the capacitor and the MTJs. The MTJ ferromagnetic free layers are exchange coupled to the ferromagnetic layer of the magnetoelectric capacitor. The potential of an MTJ free layer is based on a supply voltage applied to the reference layer of the MTJ. The MTJ reference layers have a magnetization orientation that is parallel or antiparallel to the magnetization orientations of the ferromagnetic layer of the magnetoelectric capacitor.Type: ApplicationFiled: October 31, 2022Publication date: May 2, 2024Applicant: Intel CorporationInventors: Punyashloka Debashis, Dominique A. Adams, Hai Li, Chia-Ching Lin, Dmitri Evgenievich Nikonov, Kaan Oguz, John J. Plombon, Ian Alexander Young
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Publication number: 20240143279Abstract: Described herein is a technique to implement an efficient floating-point n-input sum of squares operation using faithful rounding to 1 unit in the place (ULP) instead of IEEE rounding. The resulting circuitry is useful to accelerate graphics algorithms that don't require fully IEEE compliant hardware. Multipliers that are 1ulp can be significantly smaller, faster and more power efficient than IEEE rounded multipliers.Type: ApplicationFiled: December 26, 2023Publication date: May 2, 2024Applicant: Intel CorporationInventors: Theo Drane, Christopher Louis Poole
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Publication number: 20240143020Abstract: An apparatus for clock manager redundancy comprises a clock circuitry to manage a clock for a device; a first processing circuitry coupled to the clock circuitry to execute instructions to perform operations for a clock manager, the clock manager to receive messages with time information for a network and generate clock manager control information to adjust the clock to a network time for the network; a hardened execution environment coupled to the clock circuitry and the first processing circuitry, the hardened execution environment to comprise: a detector to monitor the clock manager and generate an alert when the detector identifies abnormal behavior of the clock manager; and a second processing circuitry to execute instructions to perform operations for a redundant clock manager, the redundant clock manager to take over operations for the clock manager in response to the alert from the detector. Other embodiments are described and claimed.Type: ApplicationFiled: October 26, 2022Publication date: May 2, 2024Applicant: Intel CorporationInventors: Vuk Lesi, Christopher Gutierrez, Shabbir Ahmed, Marcio Juliato, Manoj Sastry
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Publication number: 20240143363Abstract: An apparatus comprising a memory device, a system on chip (SoC), including a central processing unit (CPU) to execute a virtual machine to retrieve data from the memory device and transmit the data to a remote input/output (I/O) device coupled to a remote computing platform as memory transaction data; and a port to transmit the memory transaction data as transaction layer packets (TLPs) and a network interface card (NIC) to receive the TLPs, including an interface to receive the TLPs and packet conversion hardware to convert the TLPs to network protocol packets and transmit the network protocol packets to the remote I/O memory device.Type: ApplicationFiled: October 26, 2022Publication date: May 2, 2024Applicant: Intel CorporationInventor: Reshma Lal
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Publication number: 20240143410Abstract: Technologies for dividing work across one or more accelerator devices include a compute device. The compute device is to determine a configuration of each of multiple accelerator devices of the compute device, receive a job to be accelerated from a requester device remote from the compute device, and divide the job into multiple tasks for a parallelization of the multiple tasks among the one or more accelerator devices, as a function of a job analysis of the job and the configuration of each accelerator device. The compute engine is further to schedule the tasks to the one or more accelerator devices based on the job analysis and execute the tasks on the one or more accelerator devices for the parallelization of the multiple tasks to obtain an output of the job.Type: ApplicationFiled: January 5, 2024Publication date: May 2, 2024Applicant: Intel CorporationInventors: Susanne M. Balle, Francesc Guim Bernat, Slawomir Putyrski, Joe Grecco, Henry Mitchel, Evan Custodio, Rahul Khanna, Sujoy Sen
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Publication number: 20240147230Abstract: This disclosure describes systems, methods, and devices related to coexistence network integration. A device may transmit a beacon frame or a probe response frame containing a security element that is not a robust security network element (RSNE) element to indicate opportunistic wireless encryption (OWE) support. The device may identify a first association request frame received from a first station device (STA) comprising an RSNE element with OWE Authentication Key Management (AKM) indicating a compatibility of the first STA with OWE. The device may identify a second association request frame from a second station device (STA) indicating no compatibility with OWE. The device may generate one or more encryption keys for securing data transmission with OWE-compatible STAs. The device may transmit encrypted and unencrypted versions of groupcast data frames to the first STA and the second STA.Type: ApplicationFiled: December 26, 2023Publication date: May 2, 2024Applicant: Intel CorporationInventors: Ido OUZIELI, Po-Kai HUANG, Ehud RESHEF
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Publication number: 20240143802Abstract: Embodiments are directed to protection of communications between a trusted execution environment and a hardware accelerator utilizing enhanced end-to-end encryption and inter-context security. An embodiment of an apparatus includes one or more processors having one or more trusted execution environments (TEEs) including a first TEE to include a first trusted application; an interface with a hardware accelerator, the hardware accelerator including trusted embedded software or firmware; and a computer memory to store an untrusted kernel mode driver for the hardware accelerator, the one or more processors to establish an encrypted tunnel between the first trusted application in the first TEE and the trusted software or firmware, generate a call for a first command from the first trusted application, generate an integrity tag for the first command, and transfer command parameters for the first command and the integrity tag to the kernel mode driver to generate the first command.Type: ApplicationFiled: October 27, 2023Publication date: May 2, 2024Applicant: Intel CorporationInventors: Salessawi Ferede Yitbarek, Lawrence A. Booth, Jr., Brent D. Thomas, Reshma Lal, Pradeep M. Pappachan, Akshay Kadam
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Patent number: 11973041Abstract: Embodiments disclosed herein include electronic packages and methods of forming such electronic packages. In an embodiment, the electronic package comprises a mold layer having a first surface and a second surface opposite the first surface, and a plurality of first dies embedded in the mold layer. In an embodiment, each of the plurality of first dies has a surface that is substantially coplanar with the first surface of the mold layer. In an embodiment, the electronic package further comprises a second die embedded in the mold layer. In an embodiment, the second die is positioned between the plurality of first dies and the second surface of the mold layer.Type: GrantFiled: December 20, 2021Date of Patent: April 30, 2024Assignee: Intel CorporationInventors: Srinivas Pietambaram, Gang Duan, Deepak Kulkarni, Rahul Manepalli, Xiaoying Guo
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Patent number: 11973689Abstract: A processor may control a transmitter to send a first signal representing a request for one or more priority rules for data packet prioritization; to receive a second signal in response to the first signal, the second signal representing the one or more priority rules for data packet prioritization, and to receive a third signal representing a data packet including a header and a data payload. The header may comprise a first priority tag representing a first priority level. The processor may be configured to determine from the data payload and the one or more rules for data packet prioritization a second priority tag representing a second priority level and to replace the first priority tag with the second priority tag.Type: GrantFiled: June 15, 2021Date of Patent: April 30, 2024Assignee: INTEL CORPORATIONInventors: Ehud Reshef, Carlos Cordeiro
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Patent number: 11973618Abstract: This disclosure relates to apparatuses, systems, and methods for channel estimation, and in particular channel estimation for 5G New Radio systems. The channel estimation interpolates, prior to performing a de-spreading operation, a first combined channel estimation and a second combined channel estimation to provide from the first combined channel estimation one or more channel estimation values at indices associated with the second combined channel estimation and/or to provide from the second combined channel estimation one or more channel estimation values at indices associated with the first combined channel estimation.Type: GrantFiled: June 22, 2021Date of Patent: April 30, 2024Assignee: INTEL CORPORATIONInventors: Thushara Hewavithana, Yuzhou Zhang, Xuebin Yang
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Patent number: 11973641Abstract: Techniques discussed herein can facilitate edge computing in connection with a variety of deployment scenarios. Various embodiments can facilitate one or more of: deploying UPF(s) (User Plane Function(s)) to support edge computing; removing UPF(s) not needed for edge computing; deploying local DN(s) (Data Network(s)); E2E (Edge-to-Edge) OSS (Operations Support System) deployment scenarios; and providing RAN (Radio Access Network) condition data to support various applications (e.g., autonomous driving).Type: GrantFiled: December 30, 2022Date of Patent: April 30, 2024Assignee: Intel CorporationInventors: Joey Chou, Yizhi Yao
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Patent number: 11973539Abstract: Disclosed herein are optical transceivers with multi-laser modules, as well as related optoelectronic assemblies and methods. In some embodiments, an optical transceiver may include: a first laser and a second laser; an optical output path, wherein an output of the first laser is coupled to the optical output path; and switching circuitry to decouple the output of the first laser from the optical output path and to couple an output of the second laser to the optical output path.Type: GrantFiled: March 16, 2022Date of Patent: April 30, 2024Assignee: Intel CorporationInventors: Saeed Fathololoumi, Ling Liao, Quan Tran
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Patent number: 11973143Abstract: Integrated circuit structures having source or drain structures and germanium N-channels are described. In an example, an integrated circuit structure includes a fin having a lower fin portion and an upper fin portion, the upper fin portion including germanium. A gate stack is over the upper fin portion of the fin. A first source or drain structure includes an epitaxial structure embedded in the fin at a first side of the gate stack. A second source or drain structure includes an epitaxial structure embedded in the fin at a second side of the gate stack. Each epitaxial structure includes a first semiconductor layer in contact with the upper fin portion, and a second semiconductor layer on the first semiconductor layer. The first semiconductor layer comprises silicon, germanium and phosphorous, and the second semiconductor layer comprises silicon and phosphorous.Type: GrantFiled: March 28, 2019Date of Patent: April 30, 2024Assignee: Intel CorporationInventors: Ryan Keech, Benjamin Chu-Kung, Subrina Rafique, Devin Merrill, Ashish Agrawal, Harold Kennel, Yang Cao, Dipanjan Basu, Jessica Torres, Anand Murthy
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Patent number: 11973504Abstract: An asynchronous multi-cycle reset synchronization circuit that can correlate any number of resets and synchronous clocks with simultaneous reset de-assertion and removal of reset assertion crossing hazards. The asynchronous multi-cycle reset synchronization circuit can also be paired with a synchronous multi-cycle reset synchronization circuit to correlate same domain asynchronous and synchronous resets. Also described is a synchronous reset multi-cycle synchronization circuit that correlates with any number of asynchronous resets and guarantees simultaneous reset de-assertion.Type: GrantFiled: August 17, 2020Date of Patent: April 30, 2024Assignee: INTEL CORPORATIONInventors: Leon Zlotnik, Lev Zlotnik, Jeremy Anderson
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Patent number: 11972780Abstract: A mechanism is described for facilitating cinematic space-time view synthesis in computing environments according to one embodiment. A method of embodiments, as described herein, includes capturing, by one or more cameras, multiple images at multiple positions or multiple points in times, where the multiple images represent multiple views of an object or a scene, where the one or more cameras are coupled to one or more processors of a computing device. The method further includes synthesizing, by a neural network, the multiple images into a single image including a middle image of the multiple images and representing an intermediary view of the multiple views.Type: GrantFiled: September 27, 2021Date of Patent: April 30, 2024Assignee: INTEL CORPORATIONInventors: Gowri Somanath, Oscar Nestares
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Patent number: 11974227Abstract: This disclosure describes systems, methods, and devices related to wake up receiver (WUR) frequency division multiple access (FDMA) transmission. A device may cause to send a wake up receiver (WUR) beacon frame on a WUR beacon operating channel to one or more station devices. The device may determine a first wake-up frame to be sent on a first WUR operating channel, wherein the first WUR operating channel is associated with one or more frequency division multiple access (FDMA) channels used for transmitting one or more wake-up frames to the one or more station devices. The device may determine to apply padding to the first wake-up frame based on a field included in a header of the first wake-up frame. The device may cause to send the first wake-up frame to a first station device of the one or more station devices.Type: GrantFiled: November 9, 2021Date of Patent: April 30, 2024Assignee: Intel CorporationInventors: Po-Kai Huang, Shahrnaz Azizi, Daniel F. Bravo, Thomas J. Kenney, Vinod Kristem, Noam Ginsburg
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Patent number: 11972635Abstract: In one example, a display includes an array of display pixels. Each display pixel includes at least one light-emitting diode. At least one of the display pixels includes an image sensor.Type: GrantFiled: March 23, 2021Date of Patent: April 30, 2024Assignee: Intel CorporationInventors: Akihiro Takagi, Kunjal Parikh
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Technologies for securely providing remote accelerators hosted on the edge to client compute devices
Patent number: 11972001Abstract: Technologies for securely providing one or more remote accelerators hosted on edge resources to a client compute device includes a device that further includes an accelerator and one or more processors. The one or more processors are to determine whether to enable acceleration of an encrypted workload, receive, via an edge network, encrypted data from a client compute device, and transfer the encrypted data to the accelerator without exposing content of the encrypted data to the one or more processors. The accelerator is to receive, in response to a determination to enable the acceleration of the encrypted workload, an accelerator key from a secure server via a secured channel, and process, in response to a transfer of the encrypted data from the one or more processors, the encrypted data using the accelerator key.Type: GrantFiled: May 13, 2022Date of Patent: April 30, 2024Assignee: Intel CorporationInventors: Ned M. Smith, Brinda Ganesh, Francesc Guim Bernat, Eoin Walsh, Evan Custodio -
Patent number: 11973032Abstract: Memory bit cells having internal node jumpers are described. In an example, an integrated circuit structure includes a memory bit cell on a substrate. The memory bit cell includes first and second gate lines parallel along a second direction of the substrate. The first and second gate lines have a first pitch along a first direction of the substrate, the first direction perpendicular to the second direction. First, second and third interconnect lines are over the first and second gate lines. The first, second and third interconnect lines are parallel along the second direction of the substrate. The first, second and third interconnect lines have a second pitch along the first direction, where the second pitch is less than the first pitch. One of the first, second and third interconnect lines is an internal node jumper for the memory bit cell.Type: GrantFiled: March 8, 2023Date of Patent: April 30, 2024Assignee: Intel CorporationInventors: Smita Shridharan, Zheng Guo, Eric A. Karl, George Shchupak, Tali Kosinovsky
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Patent number: 11972165Abstract: Methods, apparatus, systems, and articles of manufacture are disclosed for configuring display screen coordinates. An example apparatus includes at least one storage device or storage disk, instructions, and at least one processor to execute the instructions. When executed, the example instructions cause the at least one processor to determine whether a first position of a first display screen is within a threshold of a second position of a second display screen, and in response to determining that the first position is within the threshold of the second position, adjust a first coordinate of the first display screen relative to a second coordinate of the second display screen, the first coordinate and the second coordinate to be adjusted within a graphics properties page related to configuration of content rendering between the first display screen and the second display screen.Type: GrantFiled: January 24, 2022Date of Patent: April 30, 2024Assignee: Intel CorporationInventor: Sean J. Lawrence
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Patent number: 11972230Abstract: Embodiments for a matrix transpose and multiply operation are disclosed. In an embodiment, a processor includes a decoder and execution circuitry. The decoder is to decode an instruction having a format including an opcode field to specify an opcode, a first destination operand field to specify a destination matrix location, a first source operand field to specify a first source matrix location, and a second source operand field to specify a second source matrix location. The execution circuitry is to, in response to the decoded instruction, transpose the first source matrix to generate a transposed first source matrix, perform a matrix multiplication using the transposed first source matrix and the second source matrix to generate a result, and store the result in a destination matrix location.Type: GrantFiled: June 27, 2020Date of Patent: April 30, 2024Assignee: Intel CorporationInventors: Menachem Adelman, Robert Valentine, Barukh Ziv, Amit Gradstein, Simon Rubanovich, Zeev Sperber, Mark J. Charney, Christopher J. Hughes, Alexander F. Heinecke, Evangelos Georganas, Binh Pham
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Patent number: 11971754Abstract: Embodiments are generally directed to a flexible overlapping display. An embodiment of a mobile device includes a processor to process data for the mobile device, a bendable and foldable display screen, one or more device sensors to sense an orientation of the mobile device, and one or more display sensors to sense a current arrangement of the display screen. The processor is to identify one or more portions of the display screen that are visible to a user based at least in part on data from the one or more device sensors and the one or more display sensors.Type: GrantFiled: January 27, 2023Date of Patent: April 30, 2024Assignee: Intel CorporationInventors: Guy M. Therien, David W. Browning, Joshua L. Zuniga
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Patent number: 11972126Abstract: Technologies disclosed herein provide one example of a system that includes processor circuitry to be communicatively coupled to a memory circuitry. The processor circuitry is to receive a memory access request corresponding to an application for access to an address range in a memory allocation of the memory circuitry and to locate a metadata region within the memory allocation. The processor circuitry is also to, in response to a determination that the address range includes at least a portion of the metadata region, obtain first metadata stored in the metadata region, use the first metadata to determine an alternate memory address in a relocation region, and read, at the alternate memory address, displaced data from the portion of the metadata region included in the address range of the memory allocation. The address range includes one or more bytes of an expected allocation region of the memory allocation.Type: GrantFiled: September 10, 2021Date of Patent: April 30, 2024Assignee: Intel CorporationInventors: David M. Durham, Michael D. LeMay, Sergej Deutsch, Joydeep Rakshit, Anant Vithal Nori, Jayesh Gaur, Sreenivas Subramoney
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Patent number: 11972298Abstract: Technologies for migrating data between edge accelerators hosted on different edge locations include a device hosted on a present edge location. The device includes one or more processors to: receive a workload from a requesting device, determine one or more accelerator devices hosted on the present edge location to perform the workload, and transmit the workload to the one or more accelerator devices to process the workload. The one or more processor is further to determine whether to perform data migration from the one or more accelerator devices to one or more different edge accelerator devices hosted on a different edge location, and send, in response to a determination to perform the data migration, a request to the one or more accelerator devices on the present edge location for transformed workload data to be processed by the one or more different edge accelerator devices.Type: GrantFiled: February 7, 2022Date of Patent: April 30, 2024Assignee: Intel CorporationInventors: Evan Custodio, Francesc Guim Bernat, Suraj Prabhakaran, Trevor Cooper, Ned M. Smith, Kshitij Doshi, Petar Torre
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Patent number: 11972519Abstract: Described herein are techniques for learning neural reflectance shaders from images. A set of one or more machine learning models can be trained to optimize an illumination latent code and a set of reflectance latent codes for an object within a set of input images. A shader can then be generated based on a machine learning model of the one or more machine learning models. The shader is configured to sample the illumination latent code and the set of reflectance latent codes for the object. A 3D representation of the object can be rendered using the generated shader.Type: GrantFiled: June 24, 2022Date of Patent: April 30, 2024Assignee: Intel CorporationInventors: Benjamin Ummenhofer, Shenlong Wang, Sanskar Agrawal, Yixing Lao, Kai Zhang, Stephan Richter, Vladlen Koltun
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Patent number: 11972303Abstract: Methods, apparatus, and systems to dynamically schedule a workload to among compute blocks based on temperature are disclosed. An apparatus to schedule a workload to at least one of a plurality of compute blocks based on temperature includes a prediction engine to determine (i) a first predicted temperature of a first compute block of the plurality of compute blocks and (ii) a second predicted temperature of a second compute block of the plurality of compute blocks. The apparatus also includes a selector to select between the first compute block and the second compute block for assignment of the workload. The selection is based on which of the first and second predicted temperatures is lower. The apparatus further includes a workload scheduler to assign the workload to the selected one of the first or second compute blocks.Type: GrantFiled: June 26, 2020Date of Patent: April 30, 2024Assignee: Intel CorporationInventors: Carin Ruiz, Bo Qiu, Columbia Mishra, Arijit Chattopadhyay, Chee Lim Nge, Srikanth Potluri, Jianfang Zhu, Deepak Samuel Kirubakaran, Akhilesh Rallabandi, Mark Gallina, Renji Thomas, James Hermerding, II
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Patent number: 11972545Abstract: The present disclosure provides an apparatus and method of guided neural network model for image processing. An apparatus may comprise a guidance map generator, a synthesis network and an accelerator. The guidance map generator may receive a first image as a content image and a second image as a style image, and generate a first plurality of guidance maps and a second plurality of guidance maps, respectively from the first image and the second image. The synthesis network may synthesize the first plurality of guidance maps and the second plurality of guidance maps to determine guidance information. The accelerator may generate an output image by applying the style of the second image to the first image based on the guidance information.Type: GrantFiled: September 23, 2021Date of Patent: April 30, 2024Assignee: INTEL CORPORATIONInventors: Anbang Yao, Ming Lu, Yikai Wang, Shandong Wang, Yurong Chen, Sungye Kim, Attila Tamas Afra
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Patent number: 11972269Abstract: Methods, apparatus, systems and articles of manufacture (e.g., physical storage media) to provide device enhancements for software defined silicon implementations are disclosed. Example non-transitory computer readable medium includes instructions to cause one or more processors to at least generate a first stock keeping unit, associate the first stock keeping unit with a semiconductor device, the first stock keeping unit associated with a first set of features to be provided by the semiconductor device, command the semiconductor device to activate a feature not included in the first set of features to cause the semiconductor device to provide a second set of features, generate a second stock keeping unit for the semiconductor device, and associate the second stock keeping unit with the semiconductor device and the second set of features to be provided by the semiconductor device.Type: GrantFiled: December 30, 2022Date of Patent: April 30, 2024Assignee: INTEL CORPORATIONInventors: Katalin Klara Bartfai-Walcott, Arkadiusz Berent, Vasuki Chilukuri, Mark Baldwin, Vasudevan Srinivasan, Bartosz Gotowalski
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Patent number: 11972291Abstract: An apparatus and method for conditional quality of service in a processor. For example, one embodiment of a processor comprises: a plurality of processor resources to be allocated to a plurality of executed processes in accordance with a set of quality of service (QoS) rules; and conditional quality of service (QoS) circuitry/logic to monitor usage of the plurality of processor resources by the plurality of processes and to responsively modify an allocation of a first processor resource for a first process in response to detecting a first threshold value being reached in a second resource allocated to the first process.Type: GrantFiled: December 27, 2019Date of Patent: April 30, 2024Assignee: Intel CorporationInventors: Francesc Guim, Karthik Kumar, Mustafa Hajeer, Tushar Gohad
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Patent number: 11971827Abstract: Methods, apparatus, systems and articles of manufacture to control address space isolation in a virtual machine are disclosed. An example apparatus includes an address width adjustor to identify a memory width value corresponding to a guest memory associated with a virtual machine (VM), and generate an expanded emulated memory width value. The example apparatus also includes a memory mirror manager to generate a first guest physical address (GPA) range based on the memory width value, and generate a second GPA range based on the expanded emulated memory width value. The example apparatus also includes an EPT generator to generate root paging structures of a first type of EPT with respective addresses within the first GPA range, and generate root paging structures of a second type of EPT with respective addresses within (a) the first GPA range and (b) the second GPA range.Type: GrantFiled: June 21, 2019Date of Patent: April 30, 2024Assignee: Intel CorporationInventors: Jun Tian, Kun Tian, Yu Zhang
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Patent number: 11972781Abstract: An apparatus may include a memory to store a recorded video. The apparatus may further include an interface to receive at least one set of sensor information based on sensor data that is recorded concurrently with the recorded video and a video clip creation module to identify a sensor event from the at least one set of sensor information and to generate a video clip based upon the sensor event, the video clip comprising video content from the recorded video that is synchronized to the sensor event.Type: GrantFiled: October 19, 2020Date of Patent: April 30, 2024Assignee: INTEL CORPORATIONInventors: Glen J. Anderson, Giuseppe Raffa
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Patent number: 11973923Abstract: An example apparatus includes: a camera to record an image; memory to store instructions; and a processor in circuit with the memory, the processor to execute the instructions to: determine a depth based on: (a) the image and (b) a calibration parameter of the camera; and adjust the calibration parameter based on a temperature of the camera and the depth.Type: GrantFiled: September 2, 2022Date of Patent: April 30, 2024Assignee: Intel CorporationInventors: Aviad Zabatani, Sagy Bareket, Ohad Menashe, Erez Sperling, Alex Bronstein, Michael Bronstein, Ron Kimmel, Vitaly Surazhsky
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Patent number: 11971841Abstract: An adapter is provided that includes a first interface to couple to a particular device, where link layer data is to be communicated over the first interface, and a second interface to couple to a physical layer (PHY) device. The PHY device includes wires to implement a physical layer of a link, and the link couples the adapter to another adapter via the PHY device. The second interface includes a data channel to communicate the link layer data over the physical layer, and a sideband channel to communicate sideband messages between the adapter and the other adapter over the physical layer. The adapter is to implement a logical PHY for the link.Type: GrantFiled: August 31, 2020Date of Patent: April 30, 2024Assignee: Intel CorporationInventors: Narasimha Lanka, Swadesh Choudhary, Mahesh Wagh, Lakshmipriya Seshan
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Patent number: 11972979Abstract: Embodiments disclosed herein include semiconductor devices and methods of forming such devices. In an embodiment a semiconductor device comprises a first interlayer dielectric (ILD), a plurality of source/drain (S/D) contacts in the first ILD, a plurality of gate contacts in the first ILD, wherein the gate contacts and the S/D contacts are arranged in an alternating pattern, and wherein top surfaces of the gate contacts are below top surfaces of the S/D contacts so that a channel defined by sidewall surfaces of the first ILD is positioned over each of the gate contacts, mask layer partially filling a first channel over a first gate contact, and a fill metal filling a second channel over a second gate contact that is adjacent to the first gate contact.Type: GrantFiled: June 7, 2023Date of Patent: April 30, 2024Assignee: Intel CorporationInventors: Leonard P. Guler, Michael Harper, Suzanne S. Rich, Charles H. Wallace, Curtis Ward, Richard E. Schenker, Paul Nyhus, Mohit K. Haran, Reken Patel, Swaminathan Sivakumar
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Patent number: 11973121Abstract: Discussed herein are device contacts in integrated circuit (IC) structures. In some embodiments, an IC structure may include: a first source/drain (S/D) contact; a gate contact, wherein the gate contact is in contact with a gate and with the first S/D contact; and a second S/D contact, wherein a height of the second S/D contact is less than a height of the first S/D contact.Type: GrantFiled: March 27, 2020Date of Patent: April 30, 2024Assignee: Intel CorporationInventors: Guillaume Bouche, Andy Chih-Hung Wei, Mwilwa Tambwe, Sean T. Ma, Piyush Mohan Sinha
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Patent number: 11973105Abstract: An integrated circuit structure comprises at least one metal gate formed in a first dielectric layer, the at least one metal gate comprising a workfunction layer and the gate oxide layer along sidewalls of the first dielectric layer. A field effect (FE) dielectric layer dielectric layer is above the first dielectric layer of the at least one metal gate. A precision resistor comprising a thin-film metallic material is formed on the FE dielectric layer above the at least one metal gate and extending laterally over the at least one metal gate.Type: GrantFiled: September 27, 2018Date of Patent: April 30, 2024Assignee: Intel CorporationInventors: Chieh-Jen Ku, Bernhard Sell, Leif Paulson, Kinyip Phoa, Shi Liu
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Patent number: 11973519Abstract: Examples described herein relate to an apparatus comprising a central processing unit (CPU) and an encoding accelerator coupled to the CPU, the encoding accelerator comprising an entropy encoder to determine normalized probability of occurrence of a symbol in a set of characters using a normalized probability approximation circuitry, wherein the normalized probability approximation circuitry is to output the normalized probability of occurrence of a symbol in a set of characters for lossless compression. In some examples, the normalized probability approximation circuitry includes a shifter, adder, subtractor, or a comparator. In some examples, the normalized probability approximation circuitry is to determine normalized probability by performance of non-power of 2 division without computation by a Floating Point Unit (FPU). In some examples, the normalized probability approximation circuitry is to round the normalized probability to a decimal.Type: GrantFiled: June 23, 2020Date of Patent: April 30, 2024Assignee: Intel CorporationInventors: Bhushan G. Parikh, Stephen T. Palermo
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Patent number: 11973679Abstract: This disclosure describes systems, methods, and devices related to enhanced frame exchange. A device may generate a first subset of a plurality of fields, wherein the first subset is mandatory in a probe request frame. The device may generate a second subset of the plurality of fields, wherein the second subset is optional in the probe request frame regardless of capability information of the device. The device may generate the probe request frame comprising the first subset and the second subset. The device may cause to send the probe request frame to an access point (AP) device.Type: GrantFiled: August 3, 2021Date of Patent: April 30, 2024Assignee: Intel CorporationInventors: Po-Kai Huang, Robert Stacey, Daniel Bravo, Ido Ouzieli, Danny Alexander, Ofer Hareuveni
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Patent number: 11973624Abstract: Examples described herein relate to link training between network connected devices. In some examples, an amount to extend link training is determined. The amount to extend link training can be determined by: receiving, by a receiver in a first device, signals over a lane from a transmitter in a second device, the signals indicating capability to extend link training time and amount to extend link training time; determining, at the first device, a link training time based on a default link training time and an amount to extend link training time; and performing link training based on the determined link training time. In some examples, the determined amount is highest common denominator of the received identified capability and transmitted indicated capability. In some examples, if the received communication indicates no ability to extend link training time, the link training time is a default link training time.Type: GrantFiled: September 16, 2020Date of Patent: April 30, 2024Assignee: Intel CorporationInventor: Bruce McLoughlin
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Publication number: 20240138133Abstract: The disclosure is directed to apparatus and methods for manufacturing including a collaborative robot, a camera operatively coupled to the collaborative robot, a memory coupled to the collaborative robot, and processing circuitry coupled to the memory, the processing circuitry configured to receive image data of at least one component intended for a printed circuit board (PCB), the image data collected by the camera operatively coupled to the collaborative robot, determine, based on the image data, a coordinate location for the component, and secure the component to the PCB using an end effector of the collaborative robot based on the received image data. In one embodiment, the collaborative robot is configured to operate alongside a human, the collaborative robot in combination with the camera configured to manufacture a computer system with the PCB.Type: ApplicationFiled: October 23, 2022Publication date: April 25, 2024Applicant: Intel CorporationInventor: Shoghi Effendi RAJAGOPAL
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Publication number: 20240136279Abstract: Described herein are integrated circuit devices that include semiconductor devices near the center of the device, rather than towards the top or bottom of the device, and integrated inductors formed over the semiconductor devices. Power delivery to the device is on the opposite side of the semiconductor devices. The integrated inductors may be used for power step-down to reduce device thickness and/or a number of power rails.Type: ApplicationFiled: October 24, 2022Publication date: April 25, 2024Applicant: Intel CorporationInventors: Min Suet Lim, Telesphor Kamgaing, Chee Kheong Yoon, Chu Aun Lim, Eng Huat Goh, Jooi Wah Wong, Kavitha Nagarajan
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Patent number: D1024974Type: GrantFiled: July 12, 2021Date of Patent: April 30, 2024Assignee: Intel CorporationInventors: Samantha Rao, Harish Jagadish, Arvind S