Abstract: A method includes aligning a first electrical connector of a first package component to a second electrical connector of a second package component. With the first electrical connector aligned to the second electrical connector, a metal layer is plated on the first and the second electrical connectors. The metal layer bonds the first electrical connector to the second electrical connector.

Abstract: A superheater truck comprises a shell, a heat source, a heat exchanger, at least two flame arrestors, a plurality of parallel rows of fins, and a plurality of corrugated fins disposed between the parallel rows of fins. The heat source is within the shell and comprises at least one inlet vent and at least one outlet vent. The heat exchanger is within the shell and is configured to exchange heat received from the heat source and a fluid within the heat exchanger. A first one of the at least two flame arrestors is at the inlet vent, and a second one of the at least two flame arrestors is at the outlet vent.

Abstract: Various examples are provided for vertically aligned ultra-high density nanowires and their transfer onto flexible substrates. In one example, a method includes forming a plurality of vertically aligned nanowires inside channels of an anodized alumina (AAO) template on an aluminum substrate, where individual nanowires of the plurality of vertically aligned nanowires extend to a distal end from a proximal end adjacent to the aluminum substrate; removing the aluminum substrate and a portion of the AAO template to expose a surface of the AAO template and a portion of the proximal end of the individual nanowires; depositing an interlayer on the exposed surface of the AAO template and the exposed portion of the individual nanowires; and removing the AAO template from around the plurality of vertically aligned nanowires embedded in the interlayer.

Abstract: An aircraft thrust reverser inner wall and method of manufacturing the same. The aircraft thrust reverser inner wall may include a face sheet, a perforated back sheet, and a core sandwiched between the face sheet and the perforated back sheet. The face sheet may have an inner face sheet surface and an outer face sheet surface, and the core may have an inner core surface, an outer core surface, and a plurality of cell walls extending therebetween. An electro-depositable material may be applied, via electrodeposition, in a substantially continuous layer over the outer core surface, the cell walls, and the outer face sheet surface, thus bonding the face sheet and core together. The perforated back sheet may be attached to the core at the outer core surface, and a conductive coating may be applied to the inner face sheet surface.

Abstract: A manufacturing method of an electronic component allows an intermediate inspection during a manufacturing process and includes forming element electrodes and feed lines such that pad portions of the element electrodes and the corresponding one of the feed lines faces each other via a gap in a plan view, and such that the feed lines are located below the pad portions 11b. Electrolytic plating is performed while power is supplied to the feed lines to form a plating film that electrically connects the feed lines and the pad portions. The mother substrate is singulated to obtain an electronic component.

Abstract: A hollow shaft coupling for connecting a shaft to a hollow shaft, where the hollow shaft coupling can be arranged completely in the hollow shaft and can effect clamping both radially inwardly as well as radially outwardly. The coupling enables a first clamping unit to clamp the hollow shaft coupling radially inwardly against the shaft and a second clamping unit which is separate from the first clamping unit to clamp the hollow shaft coupling radially outwardly against the inner circumferential surface of the hollow shaft, with the two clamping units spaced apart from one another axially, and the two clamping units connected to one another via a play-free and rotationally stable coupling which is arranged between them.

Abstract: A manufacturing method of an electronic component allows an intermediate inspection during a manufacturing process and includes forming element electrodes and feed lines such that pad portions of the element electrodes and the corresponding one of the feed lines faces each other via a gap in a plan view, and such that the feed lines are located below the pad portions 11b. Electrolytic plating is performed while power is supplied to the feed lines to form a plating film that electrically connects the feed lines and the pad portions. The mother substrate is singulated to obtain an electronic component.

Abstract: A method for fabricating the field emission cathode structure includes following steps. A first carbon nanotube structure is provided. The first carbon nanotube structure is suspended. A voltage is applied to heat the first carbon nanotube structure to form a temperature gradient. A number of second carbon nanotubes are grown on a surface of the first carbon nanotube structure to form a second carbon nanotube structure.

Abstract: A process for fabricating a nanochannel system using a combination of microelectromechanical system (MEMS) microfabrication techniques and atomic force microscopy (AFM) nanolithography. The nanochannel system, fabricated on either a glass or silicon substrate, has channel heights and widths on the order of single to tens of nanometers. The channel length is in the micrometer range. The nanochannel system is equipped with embedded micro or nanoscale electrodes, positioned along the length of the nanochannel for electron tunneling based characterization of nanoscale particles in the channel. Anodic bonding is used to cap off the nanochannel with a cover chip.

Abstract: Technologies are generally described for a membrane that may incorporate a graphene layer perforated by a plurality of nanoscale pores. The membrane may also include a gas sorbent that may be configured to contact a surface of the graphene layer. The gas sorbent may be configured to direct at least one gas adsorbed at the gas sorbent into the nanoscale pores. The nanoscale pores may have a diameter that selectively facilitates passage of a first gas compared to a second gas to separate the first gas from a fluid mixture of the two gases. The gas sorbent may increase the surface concentration of the first gas at the graphene layer. Such membranes may exhibit improved properties compared to conventional graphene and polymeric membranes for gas separations, e.g., greater selectivity, greater gas permeation rates, or the like.

Abstract: A micro-fabricated chromatography column (70) which is particularly well-suited to the surface well-site and/or the downhole analysis of subterranean reservoir fluids in oilfield or gasfield applications (but which may also be used in non-oilfield or non-gasfield situations) is described. This micro-fabricated column integrates a micro-structured substrate (50), such as a silicon substrate, with a stationary phase material (66) deposited by sputtering as a coating in a microchannel (56) in the substrate (50). Benefits of the presently claimed and disclosed inventive concept(s) include enhanced separation of alkanes and isomers, particularly below hexane (i.e., below C6 as well as the separation of carbon dioxide, hydrogen sulfide, and water and other substances present in reservoir fluids, such as natural gas.

Abstract: Probe-based methods are provided for wire bonding and joining of structures. The wire bonds are formed via a meniscus-confined electrodeposition technique. The electrodeposition technique of the invention can also be used for fabricating one or more nano-sized or micro-sized elongated structures. The structures extend at least partially upwards from the surface of a substrate, and may extend fully upward from the substrate surface. Apparatus suitable for use with the electrodeposition technique are also provided.

Abstract: The present invention relates to a material comprising (i) nanotubes or nanowires aligned with each other in a vertical matrix and (ii) a matrix arranged between the nanotubes or the nanowires, at least one organic polymer being covalently grafted to at least two of said nanotubes or to at least two of said nanowires. The present invention also relates to a method for preparing such a material or to its uses.

Abstract: A technique for embedding a nanotube in a nanopore is provided. A membrane separates a reservoir into a first reservoir part and a second reservoir part, and the nanopore is formed through the membrane for connecting the first and second reservoir parts. An ionic fluid fills the nanopore, the first reservoir part, and the second reservoir part. A first electrode is dipped in the first reservoir part, and a second electrode is dipped in the second reservoir part. Driving the nanotube into the nanopore causes an inner surface of the nanopore to form a covalent bond to an outer surface of the nanotube via an organic coating so that the inner surface of the nanotube will be the new nanopore with a super smooth surface for studying bio-molecules while they translocate through the nanotube.

Abstract: The present invention relates to a low temperature process for producing and joining metal substrates using an intermediate layer comprising indium or gallium, wherein the indium or gallium layer is formed by electrodeposition from an ionic liquid comprising an indium or gallium salt.

Abstract: The invention relates to a decorative part (1, 3, 5) including several stones (2) and a device (7, 7?, 47, 47?) for securing the stones (2) in relation to each other. According to the invention, the securing device (7, 7?, 47, 47?) includes a single electrodeposited base (9, 9?, 49, 49?) whose shape matches one part of the stones, allowing all the stones (2) to be attached in relation to each other without any stress, and the girdles (6) of the stones (2) are mounted edge-to-edge in relation to each other so that said single base is concealed. The invention also relates to the method for manufacturing a part (1, 3, 5) of this type. The invention concerns the field of pieces or jewellery or timepieces.

Abstract: Method of joining a ceramic matrix composite article to a metallic component by providing the ceramic matrix composite article with a metallic region which bonds to the metallic component.

Abstract: The invention relates to a method for integrating an optical waveguide (3) of a temperature sensor and/or strain sensor into a temperature and/or strain measuring component (1) made of a base material (2), onto which a coating (5) is applied. The optical waveguide (3) is arranged on a predetermined measurement plane, whereupon a coating (5) is applied. The aim of the invention is to allow an optical waveguide (3) to be accurately integrated into and tightly joined to the body of a temperature and/or strain measuring component (1).

Abstract: Methods are provided for bonding pure rhenium to a substrate comprising a material. Non-lubricated components configured to have friction contact with another component are also provided. In an embodiment, by way of example only, a method includes disposing a eutectic alloy over the substrate to form an inter layer, the eutectic alloy comprised essentially of a base alloy and one or more melting point depressants and having a melting temperature that is lower than a melting temperature of the substrate material and a melting temperature of rhenium, placing pure rhenium over the inter layer, and heating the inter layer to a temperature that is substantially equal to or greater than the melting temperature of the eutectic alloy, but that is below the melting temperature of the substrate material and the melting temperature of the pure rhenium to bond the pure rhenium to the substrate.

Abstract: An improved fuel tank and method of forming a fuel tank utilize reinforced porous metal composite materials. In one embodiment, the composite material includes a fully dense, fluid-impermeable skin (1) combined with a porous metal baffle (2). The skin (1) and baffle (2) may be formed as a single monolithic system via electrodeposition of a nanolaminate material into at least a portion of open, accessible void space within a porous preform (e.g., a metal foam preform) and on the exterior surface of the preform to form the fluid-impermeable skin (1).

Abstract: A method for making thermally conductive high aspect ratio large area contact between devices with different coefficients of thermal expansion. The method of the invention includes the creation or placement of sparse structures on at least one of two surfaces or between the surfaces to maintain enough thickness that an interposed bonding material remains sufficiently compliant that relative thermal motion of the two devices can occur without damage to the devices or the bond during changes in temperature.

Abstract: A method for treating a bond area of a workpiece, and a method for adhesively bonding workpieces are disclosed. The method for treating a bond area of a workpiece includes cleaning the bond area, activating the bond area, coating at least a portion of the bond area with an adhesion promoter, and chemically transforming the adhesion promoter with an aftertreatment. The method for adhesively bonding workpieces includes cleaning a bond area of a first workpiece, activating the bond area, coating at least a portion of the bond area with an adhesion promoter, chemically transforming the adhesion promoter with an aftertreatment, applying an adhesive to the bond area, bringing the other workpiece into contact with the first workpiece, and curing the adhesive.

Abstract: The object of the disclosure is to provide a nano-scale molecular assembly such as a conductive nano-wire. Specifically, there is provided an electrochemical apparatus for forming a molecular assembly, including two electrodes and an electrochemical cell holding an electrolytic solution and the two electrodes, wherein the gap between the two electrodes is from 1 nm to 100 ?m, by allowing the electrochemical cell to hold an electrolytic solution containing molecules that is to constitute the molecular assembly, and applying a voltage across the two electrodes in the state wherein the electrolyte and the two electrodes are in contact.

Abstract: The present invention is directed to a method for coating a substrate with a variety of coating compositions thereby reducing mapping of a coating composition deposited onto the substrate. In certain embodiments, the present invention is directed to the deposition of a zirconium based pretreatment composition onto a substrate with the subsequent deposition of an electrodepositable coating composition, which comprises a soluble alkaline earth metal ion, onto the pretreatment composition. The present invention is also directed to a coating system comprising various layers deposited from the coating compositions disclosed herein.

Abstract: A method of making an embossed card includes: (a) providing a stack which includes a substrate, a first polymeric layer formed on the substrate, a foam layer formed on the first polymeric layer, a non-woven fabric layer formed on the foam layer, and a second polymeric layer formed on the non-woven layer; (b) providing a printed pattern on the second polymeric layer; (c) providing a transparent film on the printed pattern so as to form a multilayer structure; and (d) embossing the multilayer structure so as to obtain the embossed card.

Abstract: A printed circuit board and a method of manufacturing the printed circuit board are disclosed. The method of manufacturing a printed circuit board can include: processing a first hole, which has a tapered shape, in one side of a substrate by using a laser drill; processing a second hole, which has a tapered shape and which connects with the first hole, in the other side of the substrate by using a laser drill in a position corresponding to that of the first hole; and forming a conductive portion, which electrically connects both sides of the substrate through the first hole and the second hole, by performing plating. This method may be used for providing reliable interlayer connections.

Abstract: In one embodiment, SWNTs are synthesized from an embedded catalyst in a modified porous anodic alumina (PAA) template. Pd is electrodeposited into the template to form nanowires that grow from an underlying conductive layer beneath the PAA and extend to the initiation sites of the SWNTs within each pore. Individual vertical channels of SWNTs are created, each with a vertical Pd nanowire back contact. Further Pd deposition results in annular Pd nanoparticles that form on portions of SWNTs extending onto the PAA surface. Two-terminal electrical characteristics produce linear I-V relationships, indicating ohmic contact in the devices.

Abstract: The invention relates to a method for processing at least two workpieces by means of electrochemical treatment. During the method, the workpieces are provided as working electrodes in an electrolytic treatment solution inside of which a counter-electrode arrangement is assigned to each workpiece. One workpiece and the assigned counter-electrode arrangement form an electrolytic processing element. The electrolytic processing elements are connected in series.

Abstract: Method of forming a multilayer structure by electroetching or electroplating on a substrate. A seed layer is arranged on the substrate and a master electrode is applied thereto. The master electrode has a pattern layer forming multiple electrochemical cells with the substrate. A voltage is applied for etching the seed layer or applying a plating material to the seed layer. A dielectric material (9) is arranged between the structures (8) thus formed. The dielectric layer is planarized for uncovering the structure below and another structure layer is formed on top of the first. Alternatively, the dielectric layer is applied with a thickness two layers and the structure below is accessed by selective etching of the dielectric layer for selectively uncovering the top surface of the structure below. Multiple structure layer may also be formed in one step.

Abstract: A multilayer wiring board 1 includes an insulating layer 2, a copper wiring upper layer 3 and a copper wiring lower layer 4 laminated on both surfaces of the insulating layer 2, a through hole 5 pierced through the insulating layer 2 and at least one of the copper wiring layers, and a solder conductor 6 which is filled in the through hole 5 and makes connection and electric continuity between the copper wiring upper layer 3 and the copper wiring lower layer 4, where solder exposed surfaces on which a part of the solder conductor 6 is in contact with the copper wiring upper layer 3 or the copper wiring lower layer 4 and exposed to the outermost surface, and the surfaces of the copper wiring upper layer 3 and the copper wiring lower layer 4 are coated and integrated by plating films 8, and the metal-made plating films 8 are made of a metal having an ionization tendency greater than that of the solder conductor 6.

Abstract: A method of fabricating a sputtering target for sputter depositing material onto a substrate in a sputtering chamber is described. In one embodiment of the method, a preform having a surface is formed and a layer of sputtering material is electroplated onto the surface of the preform to form the target. The method can be applied to form a sputtering target having a non-planar surface.

Abstract: A method of making an active slender tube as implemented as a catheter, guide wire, or any other medical or non-medical micro-mechanical or -system or system's active micro-component is disclosed, comprising preparing an actuator made from a shape memory alloy (SMA) and forming at least a portion of a tubular body; disposing outside of SMA made actuator an elastically deformable outer skeleton coaxially therewith; and fastening together SMA made actuator and outer skeleton wire adjacent to non-insulated portions, step of fastening includes a step of passing an electric current through a lead wire while in an electroplating liquid to deposit a metal on lead wire and non-insulated portions from said liquid and thereby to electrically join SMA made actuator and outer skeleton together at corresponding areas.

Abstract: Medical devices that include oxidizable portions can be plated after a two step activation process that includes successive applications of two aqueous solutions of ammonium bifluoride. Once plated, such materials can be soldered using conventional solders and fluxes. Medical devices can be assembled by soldering together plated materials. Oxidizable materials can be plated with radiopaque materials to yield medical devices that are more visible to fluoroscopy.

Abstract: The invention discloses a microelectroforming mold using a preformed metal as the substrate and its fabrication method. Using a preformed metal as the substrate can avoid deformation of the microelectroforming mold due to residual stress in the electroforming metal. The fabrication method disclosed herein includes the steps of: forming a layer of bonding material on a surface of the preformed metal substrate after machining; forming a high aspect ratio photoresist microstructure on surfaces of the metal substrate and the bonding material; putting an electroforming material into the gaps of the photoresist microstructure to form an electroforming metal microstructure; and using a thermal process to bond the metal substrate and the metal micro structure by the bonding material and simultaneously bum off the photoresist microstructure to form a micro-electroforming mold.

Abstract: A controller is used with an anodic bonding system that has a charge flowpath for supplying charge to bond materials together. The controller includes a switch and a circuit. The switch is configured to control a flow of the charge through the charge flowpath. The circuit is configured to monitor a rate of the flow, use the rate to determine an amount of the charge supplied for bonding, and based on the amount or rate, operate the switch to control the flow.

Abstract: An active part of a sensor is formed, for example, by micro-machined silicon wafers bearing electronic elements, electrical conductors, connection pads, and pins. The pads are electrically connected to the pin ends by conductive elements. Then the wafer and the pin ends are plunged into an electrolytic bath to make an electrolytic deposit of conductive metal on the pin ends, the pads, and the conductive elements that connect them. Finally, this metal is oxidized or nitrized to form an insulating coat on the pin ends, the pads, and the conductive elements that connect them. Such a sensor may find particular application as a sensor designed to work in harsh environments.

Abstract: A thermal interface material may be covalently bonded to a bottom surface of a heat dissipating device and/or a backside surface of a heat generating device. The heat dissipating device may be thermally coupled to the heat generating device, the thermal interface material disposed between the bottom surface of the heat dissipating device and the backside surface of the heat generating device. The thermal interface material may comprise a polymer material with thermally conductive filler components dispersed therein. For one embodiment, the thermally conductive filler components may be covalently bonded together. For one embodiment, the thermally conductive filler components may be covalently bonded with the polymer material.

Abstract: Manufacturing method for bonded electroforming metallic mold, including steps of: 1. preparation of metallic material 2. preparation of electroforming metallic plate and plastic mold core and electroforming substrate; 3. preparation of power supply; 4. forming of electroforming deposited film; and 5. final-shaping. In order to significantly shorten the electroforming time and firmly connect with the steel material of the mold, the steel material of the mold and the electroforming article are simultaneously electrically connected to the cathodes of power supplies. So, the electroforming metal is simultaneously deposited on both sides to quickly achieve the desired thickness of the electroforming metallic plate. By the metal-to-metal bonding force, the electroforming metallic plate and the steel material of the mold are firmly connected with each other. Also, the electroforming metallic plate keeps having the original cast pattern and is tightly combined with the steel material of the mold.

Abstract: The rigidified mesh structure includes filaments of at least one of metal and non-metal assembled in a mesh configuration, wherein the filaments are configured in a rigid structure by plating with metal. Desirably, the filaments include adjacent contact points which are fused together by the plated metal.

Abstract: The present invention provides a pneumatic flotation device for use in a continuous web processing system for continuously processing paper and other flexible materials and a method of making the pneumatic flotation device. The pneumatic floatation device replaces the rolls, idlers and air bars currently used in continuous processing systems. The pneumatic floatation device includes a microporous sheet attached to a suitable pneumatic support structure. The microporous sheet has a smooth exterior layer with regularly spaced pores that enables air to pass therethrough. The interior layer of the sheet is an open structure metal fabric that enables air to move freely along two axes of the sheet parallel to the exterior layer while in contact with the pneumatic support structure. In one preferred embodiment, the pneumatic support structure includes a rigid tube and an airflow device in fluid communication with the microporous sheet.

Abstract: A process of making an electric current rectifying device using spatially coupled bipolar electrochemical deposition includes (a) placing at least two electrically conductive substrates, which may be a source of electrically conductive material, or a separate source of electrically conductive material, together with at least one semiconductor into an environment capable of conducting electricity and containing electrodes; (b) aligning the substrates and the semiconductor with respect to the electrodes such that the electrodes are not in contact with the substrates or the semiconductor and such that the material will form a conductive structure between and in contact with the substrates and the semiconductor when an electric field is applied between the electrodes; (c) to form a first electrically conductive structure between and in contact with a first of the substrates and the semiconductor; (d) reversing the polarity of the voltage to form a second electrically conductive structure.

Abstract: In a method for the manufacture of an electrode-electrolyte unit with a catalytically active layer a metal salt solution is placed layer-like between an electrolyte layer and an electrolyte and the metal in the metal salt solution is precipitated from the metal salt in situ between the two layers.

Abstract: A method for setting stones in the surface of a jewel produced by electroforming, comprising the following steps: producing a base having external shapes and dimensions with a thickness close to the gold film forming the wall of the jewel to be produced and having seats for receiving the stones; depositing on the base, before setting the stones, a protective coating, then a thin gold film; setting the stones in the seats; then depositing a second thicker gold film; and finally extracting or removing the base and the protective coating. The invention is characterized in that when the base is being produced, at least one passage is provided perpendicular to each seat, capable of communicating, once the stone is set, the space between it and the bottom of its seat with outside, so as to enable the depositing of the second gold film to reach the space. The invention is useful for jewels produced by electroforming.

Abstract: A method of manufacturing a polymer transistor having a controllable gap is provided in an embodiment. In the embodiment, a conducting tip is positioned proximate to a conducting surface so as to form a gap, an electrochemical medium is introduced in contact with the conducting tip and the conducting surface, and an electrical potential is applied across the electrochemical medium so as to deposit a conductive polymer that electrically bridges the formed gap. In another embodiment, a counter electrode is provided in the electrochemical solution, facilitating processing in which the electrochemical potential at the conducting tip and at the conducting surface are the same and there is a return path for electrical current through the counter electrode. Repositioning of the tip during and after polymer deposition provides, in a further embodiment, adds additional capability with respect to gap control and polymer properties.

Abstract: The present invention relates to a bipolar electrochemical process for toposelective electrodeposition of a substance on a substrate comprising (a) placing the substrate and at least one of the substance and a source of the substance into an environment capable of conducting electricity and containing electrodes; (b) aligning the substrate on which the substance is to be deposited with respect to the electrodes such that the electrodes are not in contact with the substrate and the substance will be deposited in a predetermined location on the substrate when an electric field is applied; and (c) applying a voltage to the electrodes to create an electric field of a sufficient strength between the electrodes and for a time sufficient to deposit the substance on the substrate at the predetermined location in substantial alignment with the electric field.

Abstract: The invention relates to a method of anodic bonding and a method for producing glass coatings for purposes of anodic bonding and colloidal solutions suitable for this purpose. The method is particularly suitable for anodic bonding with glass coatings with a thickness of greater than 100 nm up to 10 .mu.m, which are used for connecting two semiconductor layers. In order to produce the required glass coating, an SiO.sub.2 -sol is dissolved in at least one or in a mixture of n-alkanols (n=1 to 5). Then tetraethyl orthosilicate (TEOS), methyl triethoxysilane (MTEOS) and water are added to this organosol. Furthermore, a small quantity of acid is added to the desired quantity of alkali salts, and the colloidal solution is at least partly polymerized. The colloidal solution thus obtained is suitable for coating conductive materials by cost-effective methods such as immersion, spin-on deposition or spraying and subsequent tempering. After one coating there results a glass coating with a thickness of up to 2 .mu.m.

Abstract: A laminated composite material having patterned conductors integral to its structure made of several cloth layers and a penetrating resin matrix material in which at least one of the cloth layers has a deposited patterned layer of electrical conductor to form a conducting path in the resultant composite material. The electrical conductor is preferably deposited to such a thickness that individual fibers of the cloth are coated but that the resin permeates between individual fibers in the conducting regions. The conducting regions provide for external connection of embedded electronic devices.

Abstract: Metal, e.g. copper, is electrolytically deposited within the recess formed over a plugged hole of a component of a pyrometallurgical vessel, e.g. a cooling block, to form a seamless seal with the surface of the component. The method comprises the steps of inserting a mechanical plug into a channel opening of the component such that a recess is formed between the external surface of the plug and the outer surface of the component; positioning an anode adjacent the recess; providing an aqueous solution containing metallic ions, e.g. a solution of copper sulfate, between the anode and the mechanical plug; and creating an electric potential across the anode and the mechanical plug such that metal is deposited within the recess, preferably until the recess is filled with the electrodeposited metal. In alternative embodiments, the process can be used to secure fittings and the like to the components or to repair ruptured or weakened areas along the perimeter of such fittings.

Abstract: Anodic bonding of an insulator containing no movable ion and a conductor through the medium of a conductive film and an insulator layer containing a movable ion affords a bonded member of the insulator containing no movable ion and the conductor without use of any adhesive agent. A method for effecting the anodic bonding is also provided.

Abstract: A flexible abrasive member comprising a first porous layer of mesh, non-woven or perforated sheet, conductive or non-conductive material to which on one side deposits are deposited by way of any metal plating technique of either the electrolytic, electroless or vacuum deposition type, or any galvanic process, abrasive particles being embedded in the metal deposits, a layer of filling material, such as a resin, being present between the deposits which filling material is bonded to said first porous layer and/or the deposits, and at least a second porous layer of mesh, non-woven or perforated sheet, conductive or non-conductive material being present and being laid substantially along one side of the first porous layer. The side edge of the deposit has at least one annular groove along at least part of the circumference of the deposit.