Abstract: A chemical dispensing apparatus for providing a chlorine vapor to a reaction chamber is disclosed. The chemical dispensing apparatus may include: a chemical storage vessel configured for storing a chlorine-containing chemical species, a reservoir vessel in fluid communication with the chemical storage vessel, the reservoir vessel configured for converting the chlorine-containing chemical species to the chlorine vapor, and a reaction chamber in fluid communication with the reservoir vessel. Methods for dispensing a chlorine vapor to a reaction chamber are also disclosed.

Abstract: A film structure with protection against manipulation includes a top film, a laser-inscribable layer which is arranged on the bottom side of the top film, and also a bottom film and a connecting layer for connecting the bottom film to the top film and the laser-inscribable layer. The connecting layer is arranged between the laser-inscribable layer and the bottom film. The film structure has an inscribed region and an uninscribed region. The top film is fused with the bottom film in the inscribed region of the film structure. As a result, it is virtually impossible to separate the top film with the inscribed layer from the bottom film without destruction in the event of a manipulation attempt.

Abstract: Some embodiments include a method in which an assembly is formed to have a first silicon-dioxide-containing-material and a second silicon-dioxide-containing-material. The first silicon-dioxide-containing-material has a higher concentration of dopant therein than does the second silicon-dioxide-containing-material. The first silicon-dioxide-containing-material is selectively removed relative to the second silicon-dioxide-containing-material using a mixture which includes hydrofluoric acid, a second acid and an organic solvent. The organic solvent may include at least one ester and/or at least one ether. The second acid may have a pKa of less than about 5.

Abstract: The present invention is primarily related to the composition of an aqueous etchant containing a precursor of oxidant and patterning methods for conductive circuits, in which the chemical structure of the precursor contains chlorine and can produce oxidants through various reactions. And, the patterned conductive circuits can be used for electronic devices, including printed electronics, sensors, displays, organic light emitting diodes (OLED), touch panels, electronic circuit boards, electrodes, electroluminescent (EL) films, antennas, and solar cells.

Abstract: A method for TEM/STEM sample preparation and analysis that can be used in a FIB-electron microscope system without a flip stage. The method allows a dual beam FIB electron microscope system with a typical tilt stage having a maximum tilt of approximately 60° to be used to extract a TEM/STEM sample to from a substrate, mount the sample onto a sample holder, thin the sample using FIB milling, and rotate the sample so that the sample face is perpendicular to a vertical electron beam column for TEM/STEM imaging.

Abstract: Provided are a photosensitive resin composition which is soluble in an alkaline aqueous solution and which has a good propagation loss in a visible light wavelength region, a photosensitive resin cured matter, a photosensitive resin film, a photosensitive resin film cured matter and an optical waveguide obtained by using the same. Provided are, to be specific, a photosensitive resin composition comprising (A) a vinyl polymer having at least one chain-polymerizable functional group in a molecule, (B) a polymerizable compound and (C) a polymerization initiator, wherein the component (C) is at least one selected from the group consisting of 2-[2-oxo-2-phenylacetoxyethoxy]ethyl oxyphenylacetate, 2-(2-hydroxyethoxy)ethyl oxyphenylacetate and oligo{2-hyroxy-2-methyl-1-[4-(1-methylvinyl)phenyl]}propanone, a photosensitive resin cured matter, a photosensitive resin film, a photosensitive resin film cured matter and an optical waveguide obtained by using the same.

Abstract: A laser-engraveable composition comprises a laser-engraveable resin having dispersed therein non-crosslinked organic porous particles. These non-crosslinked organic porous particles have a non-crosslinked organic solid phase including an external particle surface and at least one set of discrete pores that are dispersed within the non-crosslinked organic solid phase. The laser-engraveable composition further comprises an infrared radiation absorber within at least some of the non-crosslinked organic porous particles.

Abstract: A plasma processing method includes modifying a resist pattern of the substrate; and trimming the modified resist pattern through a plasma etching. The modifying includes: supplying the processing gas for modification from the processing gas supply unit to the inside of the processing chamber while the substrate having a surface on which the resist pattern is formed is mounted on the lower electrode; supplying the high frequency power from the high frequency power supply to generate a plasma of the processing gas for modification; and supplying the negative DC voltage from the DC power supply to the upper electrode.

Abstract: A reticle manufacturing method of the present invention comprises the steps of holding a reference mask blank by a reference chuck to measure a surface shape of the reference mask blank as a first surface shape, holding the reference mask blank by a reticle chuck of the exposure apparatus to measure a surface shape of the reference mask blank as a second surface shape, holding the electron beam drawing mask blank by the reference chuck to measure a surface shape of the electron beam drawing mask blank as a third surface shape, calculating a difference between the measurement values of the first surface shape and the second surface shape as a first deference value, calculating, as a forth surface shape, a surface shape of the electron beam drawing mask blank held by the reticle chuck on the basis of the first deference value and the measurement value of the third surface shape, and drawing the pattern on the electron beam drawing mask blank on the basis of the forth surface shape.

Abstract: A technique executes autofocus adjustment stably even when a plurality of patterns or foreign matter capable of being imaged only by a specific detector are included independently. Such an image as a concavo-convex image having a weak contrast can be picked up. The technique can automatically focus such an image even when it is difficult to find a focus position in the image. A scanning electron microscope includes a plurality of detectors for detecting secondary signals from a specimen when irradiated with an electron beam, and a calculation unit for combining the signals obtained from the detectors. At least two of the detectors are provided to be symmetric with respect to the electron beam. The focus of the electron beam is adjusted based on the signals of the detectors or on a signal corresponding to a combination of the signals.

Abstract: In an embodiment, there is disclosed a product labeling system comprising: a first high energy electromagnetic or particle wave generator, at least one second high energy electromagnetic of particle wave generator; and a controller operatively configured to direct wave produced by said first generator and the wave produced by said second generator onto a portion of the subsurface of the product to mark the product at said subsurface without generating any substantial disruption of the surface of said product.

Abstract: A coating is applied to a work piece in a charged particle beam system without directing the beam to work piece. The coating is applied by sputtering, either within the charged particle beam vacuum chamber or outside the charged particle beam vacuum chamber. In one embodiment, the sputtering is performed by directing the charged particle beam to a sputter material source, such as a needle from a gas injection system. Material is sputtered from the sputter material source onto the work piece to form, for example, a protective or conductive coating, without requiring the beam to be directed to the work piece, thereby reducing or eliminating damage to the work piece.

Abstract: A focused ion beam apparatus includes a sample base for mounting a sample, a three axis stage capable of moving the sample base in three directions: along two axes on a horizontal face and a vertical axis, and a first focused ion beam barrel and a second focused ion beam barrel for irradiating the sample with focused ion beams, the first focused ion beam barrel and the second focused ion beam barrel being arranged such that directions of the focused ion beams are substantially opposed to each other in a plane view thereof and are inclined in substantial line symmetry with regard to the vertical axis in a side view thereof.

Abstract: An exemplary method for fabricating a mold core includes the following steps. First, a substrate is provided. Second, a photo resist layer is formed on the substrate, the photo resist layer has a top surface. Third, the photo resist layer is etched using a direct writing process to form the top surface thereof into a substantially aspherical stepped surface. Lastly, the photo resist layer is softened using a reflow process to transform the substantially aspherical stepped surface into a substantially aspherical smooth molding surface. Thereby, a mold core having the substantially aspherical smooth molding surface is obtained.

Abstract: The invention is a radiation curable liquid resin that can be used to make a clear and colorless, three-dimensional article by a stereolithography process. The clear and colorless three-dimensional articles have a clarity and transmittance of greater than about 67% as measured by UV-Visible spectrophotometer in the 400-500 nm range; and a lack of color as measured by a b* value of between about minus 0.5 (?0.5) and about positive 2.5 (+2.5) in the CIELAB color space using a spectrophotometer in the visible wavelengths of 400-750 nm.

Abstract: A device manufacturing method includes projecting a patterned beam of radiation through an optics compartment and a channel that provides an open connection between the optics compartment and a substrate compartment onto a substrate, maintaining an ionized flush gas at a higher pressure in the channel than in the substrate compartment and in the optics compartment during the projecting, intercepting particles that emanate from the substrate with the ionized flush gas, pumping the flush gas carrying the intercepted particles from the substrate compartment using a pump coupled to a gas outlet coupled to at least one of the compartments, and establishing an electrical potential difference between a wall of the channel and the outlet and/or a rotor of the pump so that the outlet and/or the rotor of the pump attracts positively charged ions that stem from the flush gas in the channel.

Abstract: The present invention relates to the laser inscription of a flexible inner support layer of a multilayered support unit, which is distinguished by the fact that the laser inscription of the inner support layer is carried out through one or more flexible outer laser-inactive support layers which are separate or can be separated from one another.

Abstract: A fabrication method for lines of a semiconductor device provides a substrate with a deposition layer already formed thereon, followed by forming a photoresist layer on the deposition layer. Photolithography is conducted with a mask to pattern the photoresist layer, wherein the photoresist layer is designed with the consideration of both the proximity effect and the microloading effect due to etching. Thereafter, using the patterned photoresist layer as an etching mask, an etching is conducted to form a plurality of lines. Since during the patterning of the photoresist layer, the proximity effect and the microlaoding effect are being considered, the difference in the linewidths between the dense feature region and the scattered feature region is minimized after the etching process.

Abstract: A method of enhancing photoresist anti-etching ability, at least includes follows. Provide a substrate, form a photoresist with a pattern on the substrate, put both photoresist and substrate in a low pressure environment, and treat photoresist by an electron beam to let at least part of photoresist is hardened. This method usually is performed before etch process, but the method also could be modified as follows. Expose photoresist by an electron beam while an etching process being performed, or alternately expose photoresist by an electron beam and perform an etch process.

Abstract: The present invention relates to maskless photolithography using a patterned light generator for creating 2-D and 3-D patterns on objects using etching and deposition techniques. In an embodiment, the patterned light generator uses a micromirror array to direct pattern light on a target object. In an alternate embodiment, the patterned light generator uses a plasma display device to generate and direct patterned light onto a target object. Specifically, the invention provides a maskless photolithography system and method for photo stimulated etching of objects in a liquid solution, patterning glass, and photoselective metal deposition. For photo stimulated etching of objects in a liquid solution, the invention provides a system and method for immersing a substrate in an etchant solution, exposing the immersed substrate to patterned light, and etching the substrate according to the pattern of incident light.

Abstract: A method of enhancing photoresist anti-etching ability, at least includes follows. Provide a substrate, form a photoresist with a pattern on the substrate, put both photoresist and substrate in a low pressure environment, and treat photoresist by an electron beam to let at least part of photoresist is hardened. This method usually is performed before etch process, but the method also could be modified as follows.

Abstract: A metal pattern is prepared by applying a polysilane composition comprising a polysilane, a carbon functional silane, and a solvent onto a substrate to form a patterned coating of the polysilane composition, attaching catalytic metal nuclei to the patterned coating, and immersing the substrate in an electroless plating bath for thereby chemically depositing a metal film on the patterned coating.

Abstract: Substrates are patterned with antibodies attached thereto at discrete locations from which absorption resistant coating is removed by selectively controlled mechanical scribing contact to avoid chemical removal so as to decrease fabrication costs and increase fabrication speed.

Abstract: A laser marking method and an apparatus thereof which realize stamp processing with a beautiful appearance and a high precision, without reducing the manufacturing efficiency. The laser marking method comprises a step of sequentially displaying divisional patterns each corresponding to one scanning line of a first deflector, a step of sequentially scanning the divisional patterns with a laser beam from a laser oscillator by the first deflector, and a step of moving a stamp position on a work surface for every one of scanning transmission beams respectively transmitted through the divisional patterns, in a direction perpendicular to a scanning direction, by a second deflector, thereby to synthesize and stamp the divisional patterns.

Abstract: A polysilane pattern-bearing substrate is prepared by the steps of (1) forming a polysilane film on a substrate, (2) subjecting the polysilane film to selective light exposure in the presence of a first solvent which does not dissolve polysilane, but dissolves siloxane, for converting the polysilane in selected areas to siloxane for thereby forming a pattern, (3) removing only the siloxane from the substrate of step (2) using a second solvent which does not dissolve polysilane, but dissolves siloxane, and (4) completely removing the second solvent. The polysilane pattern has a high degree of definition.

Abstract: This invention relates to film which is lettered with a laser beam comprising at least one protective film which is transparent to the laser beam, at least one opaque layer which is ablated by the laser beam, and at least one contrast-forming layer on its bottom. The abatable layer is preferably a metallic layer and can have a color like the contrast-forming layer. The color of the metallic layer is different from the color of the contrast-forming layer. The contrast-forming layer is either applied, imprinted or varnished onto the metallic layer. The contrast-forming layer can be at least one plastic film. On a side of the contrast-forming layer facing away from the metallic layer there is an adhesive layer which is covered with a carrier material, for example, an adhesive-repellant carrier film.

Abstract: Transparent molded articles having a high-contrast laser inscription thereon are produced from a polymer mixture consisting ofA) from 40 to 99% by weight of a polymer of an alkyl ester of (meth)acrylic acid,B) from 1 to 50% by weight of a copolymer of styrene and acrylonitrile having an acrylonitrile content of from 8 to 30% by weight,C) from 0 to 50% by weight of rubber particles, andD) from 0 to 20% by weight of additives and processing auxiliaries, by preparing a transparent molded article from the polymer mixture, and exposing the transparent molded article to laser radiation.

Abstract: A method for manufacturing a liquid jet recording head includes a first process of forming an ink flow passage pattern on a substrate by a resin layer; a second process of forming a covering resin layer to cover a resin layer on the resin layer; a third process of forming an ink discharging port pattern by a material having resistance to an oxygen plasma on the surface of the covering resin layer; a fourth process of forming ink discharging ports by dry etching the resin layer by the application of the oxygen plasma with the ink discharging port pattern as a mask; and a fifth process of eluting the resin layer. This method enables the ink discharging ports to be formed without cutting the substrate and at the same time, the distance between the ink discharging pressure generating elements and the orifices to be controlled rigidly; hence making it possible to manufacture a liquid jet recording head having a stabilized discharging characteristic.

Abstract: An ultra-fine microfabrication method using an energy beam is based on the use of shielding provided by nanometer or micrometer sized micro-particles to produce a variety of three-dimensional fine structures which have not been possible by the traditional photolithographic technique which is basically designed to produce two-dimensional structures. When the basic technique of radiation of an energy beam and shielding is combined with a shield positioning technique using a magnetic, electrical field or laser beam, with or without the additional chemical effects provided by reactive gas particle beams or solutions, fine structures of very high aspect ratios can be produced with precision. The microfabrication method include radiating a Fast Atomic beam through a patterned photoresist Film to fabricate a pattern of 0.1 to 100 nm in a target object.

Abstract: Disclosed herein is a pattern forming process comprising the steps of coating a substrate with a photosensitive resin composition comprising a polyamic compound having, at each terminal thereof, an actinic ray-sensitive functional group which has substituent groups each having a photopolymerizable carbon-carbon double bond, a photosensitive auxiliary having a photopolymerizable functional group, a photopolymerization initiator, and a solvent to form a film; subjecting the film to pattering exposure; and then developing the thus-exposed film with an alkaline developer or alkaline aqueous solution.

Abstract: A patterned multiple antibody substrate for use in biosensors or immunosensors is produced by (1) coating an antibody-adsorbent substrate with a material that resists antibody adsorption, (2) using ion beam sputtering, laser ablation, or mechanical scribing to remove the coating at specific sites on the substrate, and then (3) adsorbing specific antibodies at the sites. The substrate is capable of detecting multiple chemical species simultaneously.

Abstract: A process for making a multilayer flexographic printing plate which involves reinforcing and laser engraving a multilayer flexographic printing element.

Abstract: A process for making a single layer flexographic printing plate which involves reinforcing and laser engraving a single layer flexographic printing element.

Abstract: A process for preparing an image on a substrate by applying a photoimageable composition on a first substrate, wherein the photoimageable composition, having a solids content from 25 to 60 weight percent, contains a partially neutralized acid-containing polymer formed from a precursor polymer having an acid number from 90 to 160 prior to neutralization and wherein 1 to 15% of acid-containing groups of the precursor polymer are neutralized with base; an ethylenically unsaturated monomer; a photoinitiator or photoinitiating system, water; 0-5% by weight a solution polymer, based on the weight of total polymer present in the composition; and 0-25% by weight of an organic solvent based on the total weight of the organic solvent and water; wherein the liquid composition is present as a stable emulsion, and wherein the liquid composition has a Brookfield viscosity, at 25.degree. C.

Abstract: A method of cleaving a semiconductor wafer is disclosed which includes coating a first photoresist on a front surface of a semiconductor wafer having a plurality of semiconductor laser elements formed on the semiconductor wafer, patterning the first photoresist so as to form guide mark patterns for cleaving, coating a second photoresist on a rear surface of the semiconductor wafer, removing an edge part located at the guide mark patterns for cleaving of the second photoresist, etching through the semiconductor wafer to form guide marks using the patterned first and second photoresists as masks, patterning the second photoresist to form stripe patterns in the rear surface, etching the rear surface of the semiconductor wafer so as to form V-shaped or dovetail shaped grooves, removing the first photoresist and the second photoresist, and cleaving the semiconductor wafer along the V-shaped or dovetail shaped grooves into bars, each bar being a semiconductor laser.

Abstract: An optical proximity correction (OPC) routine that enhances the fidelity of VLSI pattern transfer operations such as photolithography and reactive ion etch (RIE) by predistorting the mask while biasing only critical features and eliminating, as much as possible, the creation of additional vertices. The OPC routine accomplishes corrections in a timely and cost effective manner on realistic data sets without causing unnecessary increase in data volume. The OPC method employs a series of shrink, expand and subtraction operations that separate complex computer aided design (CAD) data for a lithography mask or reticle into sets of basic rectangles. More particularly, the OPC method first identifies a plurality of gate regions in a CAD design. A plurality of design shapes in the CAD design are sorted according to geometric type. A plurality of sorted design shapes share at least one side with a second design shape. The sorted design shapes are then grouped according to width.

Abstract: An optical proximity correction (OPC) routine that enhances the fidelity of VLSI pattern transfer operations such as photolithography and reactive ion etch (RIE) by predistorting the mask while biasing only critical features and eliminating, as much as possible, the creation of additional vertices. The OPC routine accomplishes corrections in a timely and cost effective manner on realistic data sets without causing unnecessary increase in data volume. The OPC method employs a series of shrink, expand and subtraction operations that separate complex computer aided design (CAD) data for a lithography mask or reticle into sets of basic rectangles. More particularly, the OPC method first identifies a plurality of gate regions in a CAD design. A plurality of design shapes in the CAD design are sorted according to geometric type. A plurality of sorted design shapes share at least one side with a second design shape. The sorted design shapes are then grouped according to width.

Abstract: A repaired laser ablation mask is disclosed capable of withstanding laser fluences in the range from about 200 mJ/cm.sup.2 to at least 500 mJ/cm.sup.2. The repaired mask comprises a single or multiple layers of apertured metal, such as, aluminum, on a quartz substrate. The laser mask repair technique and structure are also disclosed. The thickness of the metal layer, such as, aluminum layer, is in the range from about 2 microns to about 6 microns. A laser projection etching technique is also disclosed for using the repaired ablation mask.

Abstract: The present invention provides an optical recording medium using an amorphous-crystalline phase-change for recording and erasing, wherein reflectivity of an optical recording medium-constituting recording film in an amorphous state is larger than that of the optical recording medium-constituting recording film in a crystalline state, or wherein absorptivity of an optical recording medium-constituting recording film in an amorphous state is smaller than that of the optical recording medium-constituting recording film in a crystalline state.

Abstract: A laser ablation mask repair method. Defects (holes) are located in a dielectric mask. The surface of the mask above the defect is melted with a CO.sub.2 laser to form a depression in the surface. The depression forms a lens which diffuses ablation laser energy instead of transmitting it. Thus, the ablation laser is prevented from ablating a polymer ablation layer, because the holes are blocked and, the mask is repaired. The method may also be used to make Engineering Changes (EC) laser ablation masks.

Abstract: Structured polymer layers having nonlinear optical properties are produced by a process wherein either organic compounds containing ethylenically unsaturated groups are subjected to free radical copolymerization (A) with stilbene, azo or azomethine compounds containing ethylenically unsaturated groups and donor and acceptor groups, or organic compounds containing ethylenically unsaturated groups are subjected to free radical polymerization and are mixed (B) with stilbene, azo or azomethine compounds containing ethylenically unsaturated groups and donor and acceptor groups, the copolymers (A) or mixtures (B) thus obtained are exposed imagewise to high-energy radiation, the unexposed parts are removed and the structured polymer layers thus obtained are polarized in an electric field for orientation of the chromophoric structural units in the region of the glass transition temperature of the polymer and crosslinked in an applied electric field.

Abstract: A method of printing an image on a substrate by applying to the substrate a film which is chemically activated by heat, and scanning the film by a beam of radiation according to the image to be printed, to chemically activate the film by heat and thereby to produce a pattern in the film according to the image scanned. The film includes a reagent capable of undergoing a redox reaction when heated in the presence of another reagent present with the film when scanned by the beam, to produce the redox reaction between the two reagents.

Abstract: Dry, laser-based, lithographic techniques and systems for patterning a surface of a wafer or other substrate are disclosed. The techniques and systems are particularly adapted for automated micro-fabrication of integrated circuits on semiconductor wafers. The invention entails dry depositing a resist material on a surface of a substrate, then generating a pattern in the resist material by selectively exposing the resist material to pulsed UV laser radiation, controlling the ambient exposure of the resist material between the resist-depositing and pattern-generating steps, and, finally, transferring the pattern from the resist to the substrate or otherwise employing the pattern to transform the substrate by deposition or implantation of materials.

Abstract: Disclosed is a method which enabled the precise formation of a group of quantum dots. A device which functions on the principle of a transmission type electron microscope is used to produce a beam of electrons which are passed through a thin crystal membrane in order to produce an electron beam diffraction image. The energy distribution of the diffracted electron beam is used to produce masks, enable epitaxial growth and dry etching involved with the microscopic fabrication operations. For example, a thin GaAs membrane is used to form a diffracted electron beam image on a GaAs layer formed on a substrate. Carbon is then supplied and used to form carbon layers on the the locations where the beam energy is strongest. These carbon layers are used as a mask which allow selective etching of the GaAs layer.

Abstract: A method and apparatus for engraving a metal plate in two or more colors. Selected areas of an oxidized aluminum plate are colored by a first dye to which the plate has an affinity. The selected areas may then be sealed by hydration. Portions of the selected areas of the colored oxidized aluminum plate can then be further engraved by the application of a focussed laser beam, which removes any of the first dye and the sealant, thereby restoring the affinity of the selected portions of the plate. The areas of the plate having an affinity for dyes can be colored by secondary and additional colors and shades thereof.

Abstract: An x-ray microlithography method and apparatus for integrated circuit wafers is disclosed in which an isotropic x-ray source is formed at the cross point of two crossed conductors. When a high current is passed through the conductors they vaporize and breakdown to form an ionized plasma which is hot enough at the cross point that K-shell x-ray radiation is released uniformly in all directions. The magnetic pressure caused by the current flow at the cross point is strong enough to collapse or pinch the plasma radially so that the x-ray source spot is very small in size and can provide high resolution exposure of an integrated circuit photoresist pattern. Due to the isotropic nature of the x-ray source, multiple circuit wafers can be exposed with a single x-ray pulse by disposing them radially around the source.

Abstract: An electrical component includes a plurality of laminated layers of ferrite material, each layer having a conductive coil printed thereon. The conductive coil is formed by first printing a conductive sheet material on top of the ferrite layer, and then by exposing the conductive sheet material to a burst of laser energy focused in a predetermined pattern which cuts the coil out of the conductive sheet member.

Abstract: The sensitivity of localized photochemical etching to the optical and electrical properties of multilayered semiconductor materials is utilized for selectively etching a laterally extending undercut in a buried layer. The semiconductor body is immersed in a suitable etching solution and a beam of light of appropriate wavelength and intensity is directed onto the semiconductor solution interface. The buried layer has a longer diffusion length for photogenerated carriers than the layers adjacent thereto, casuing carriers to diffuse away from the illuminated region within the buried layer and thereby etch the buried layer laterally, undercutting the adjacent layers.

Abstract: A process of three dimensional lithography in amorphous polymers to form an instantaneous, permanent image in the polymer by the steps of providing an undoped, non-crystalline layer or film of a polymer having a stable amorphous state under human operating conditions. The film is preferably poly(ethyleneterphthalate) (PET), poly(aryl-ether-ether-ketone) (PEEK), poly(chloro-trifluoroethylene) (Kel-F.RTM.), poly(carbonate) (ie LEXAN 9032.RTM.), poly(sulfone), poly(methylmethacrylate(PMMA, or LUCITE.RTM.), a poly(cyanurate) such as bisphenol A dicyanate, or an epoxy (eg. Epon 820.RTM.). The film can be either self supporting or mounted on a substrate. The film is then covered (and optionally contacted) with a mask which serves to block the radiation from impinging on where no marking is desired. If the mask is in actual contact with the film, it is capable of also acting as a heat sink.

Abstract: Poly(silyl silanes) have been prepared. They have high photosensitivity and excellent resistance to oxygen-reactive ion etching processes. They are useful as photodepolymerizable photoresists, barrier layers, etc.