Coating Or Impregnation Is Electrical Insulation-providing, -improving, Or -increasing, Or Conductivity-reducing Patents (Class 442/117)
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Patent number: 11577070Abstract: A soft physiotherapy instrument includes a flexible sheet and a controller. The flexible sheet includes a first flexible layer, a second flexible layer, a plurality of functional layers located between the first flexible layer and the second flexible layer, and a plurality of electrodes electrically connected with the plurality of functional layers. The functional layer includes a carbon nanotube layer including a plurality of carbon nanotubes uniformly distributed. The flexible sheet is electrically coupled with the controller via the plurality of electrodes.Type: GrantFiled: September 29, 2020Date of Patent: February 14, 2023Assignee: Beijing FUNATE Innovation Technology Co., LTD.Inventors: Li Fan, Li Qian, Yu-Quan Wang
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Patent number: 11085328Abstract: A system is provided for a nacelle of an aircraft propulsion system. This system includes a tubular outer structure, a tubular inner structure and a seal assembly. The tubular inner structure projects through a bore of the tubular outer structure. The seal assembly is configured to close an end of an annulus between the tubular outer structure and the tubular inner structure. The seal assembly includes a seal land and a seal element. The seal land includes a seal land mount that circumscribes and is attached to the tubular inner structure. The seal land mount is configured with a v-shaped sectional geometry. The seal element is attached to the tubular outer structure. The seal element circumscribes and is sealingly engaged with the seal land. The seal element may be configured from or otherwise includes a polymer material.Type: GrantFiled: September 9, 2019Date of Patent: August 10, 2021Assignee: Rohr, Inc.Inventors: Daniel Kroeger, Jasen Miner
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Patent number: 10745599Abstract: The present invention relates to a polyphenyl ether resin composition and a use thereof in a high-frequency circuit substrate. The polyphenyl ether resin composition comprises a vinyl-modified polyphenyl ether resin and an organic silicon resin containing unsaturated double bonds and having a three-dimensional net structure. The high-frequency circuit substrate of the present invention has a high glass-transition temperature, a high thermal decomposition temperature, a high interlayer adhesive force, a low dielectric constant and a low dielectric loss tangent, and is very suitable as a circuit substrate of high-speed electronic equipment.Type: GrantFiled: March 2, 2016Date of Patent: August 18, 2020Assignee: Shengyi Technology Co., Ltd.Inventors: Guangbing Chen, Xianping Zeng, Chiji Guan
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Patent number: 10632692Abstract: The invention relates to a process for the production of finished parts made of at least one multilayer, fiber-reinforced, flat semifinished-product structure, comprising the following steps: a) heating of the at least one multilayer, fiber-reinforced, flat semifinished-product structure at ambient pressure to a first temperature Ta, where the at least one multilayer, fiber-reinforced, flat semifinished-product structure comprises at least two mutually superposed polymer layers and the individual polymer layers respectively have fiber-reinforcement and do not have coherent bonding to one another or have only partial coherent bonding to one another, and in the event that at least one of the polymer layers comprises a semicrystalline polymer the first temperature Ta is higher than a melting point Tm of the crystalline polymer in accordance with DIN EN ISO 11357-3:2013-04, and in the event that the at least two polymer layers comprise no semicrystalline polymer the first temperature Ta is higher than a glassType: GrantFiled: November 4, 2015Date of Patent: April 28, 2020Assignee: BASF SEInventors: Andreas Radtke, Dagmar Buerckel, Andreas Nixdorf, Oliver Kraemer
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Patent number: 10617932Abstract: A pine tar applicator for use on baseball bats, includes a base sheet having a first side and a second side, a pine tar layer coating at least a portion of the first side of the base sheet, a cover sheet overlying and covering the pine tar layer, an adhesive layer overlying at least a portion of the second side of the base sheet, and a protective sheet overlying and covering the adhesive layer. In use, the protective sheet is removed and the base sheet is wrapped about the baseball bat with the adhesive contacting the bat. The cover sheet is then removed exposing the pine tar layer.Type: GrantFiled: December 8, 2016Date of Patent: April 14, 2020Inventor: Michael Ferraro
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Patent number: 10590598Abstract: A heat-insulating protective member for skid posts contains a needled blanket of inorganic fibers. At least some of the needled blanket has, disposed therein, an impregnation part where an oxide-precursor-containing liquid is adherent in an undried state. The impregnation part has a water content of 50-400 parts by mass per 100 parts by mass of the inorganic fibers of the impregnation part. The water content of the heat-insulating protective member is 50-400 parts by mass per 100 parts by mass of the inorganic fibers of the heat-insulating protective member. The oxide-precursor-containing liquid contains ingredients that, upon burning, yield a composition containing Al2O3 and CaO. The oxide-precursor-containing liquid is adherent in an amount of 2-50 parts by mass in terms of oxide amount per 100 parts by mass of the inorganic fibers of the impregnation part. A molar ratio of Al/Ca, in the whole impregnation part is 10-330.Type: GrantFiled: November 9, 2015Date of Patent: March 17, 2020Assignee: Mitsubishi Chemical CorporationInventors: Yusaku Hata, Mitsuo Suzuki, Tomoyuki Kobayashi, Akihiro Yano
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Patent number: 10118325Abstract: A method of manufacturing a vehicle trim component is provided that includes disposing a fiber panel onto a first surface of a mold cavity. The method also includes compressing the fiber panel between the first surface and a second surface of the mold cavity to form the fiber panel into a desired shape. The method further includes injecting resin into the mold cavity to fill at least one void between the first surface and the second surface adjacent to the fiber panel.Type: GrantFiled: July 24, 2015Date of Patent: November 6, 2018Assignee: Shanghai Yanfeng Jinqiao Automotive Trim Systems Co. Ltd.Inventors: Bart W. Fox, Jeffrey A. Deyoung, Tony M. Pokorzynski
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Patent number: 10023707Abstract: A thermosetting resin composition due to containing a modified PPE resin as a main ingredient is suited for use in making a pregreg or a copper foil substrate, when hardened, featuring a small dielectric constant (Dk), a low dielectric dissipation factor (Df) and a high Tg as well as a high resistance to heat and flame, this outstanding result is because the modified PPE resin is formed with a novel two-dimensional hardenable structure prepared to have side-chain reactive functional groups being provided in addition to those at the terminal ends of the main chain of the PPE resin thereof.Type: GrantFiled: December 18, 2015Date of Patent: July 17, 2018Assignee: NAN YA PLASTICS CORPORATIONInventors: Te-Chao Liao, Dein-Run Fung, Ying-Te Huang, Hao-Sheng Chen, Hung-Yi Chang, Chia-Lin Liu
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Patent number: 9878500Abstract: Provided is a prepreg composed of a fibrous substrate impregnated with a reactive or highly reactive polymer composition as a matrix material. The reactive or highly reactive polymer composition contains a (meth)acrylate-based resin comprising at least one of a hydroxyl group, an amine group, a thiol group, an initiator and/or accelerator, and a di- or polyisocyanate which has been internally capped, capped with a capping agent, or a combination thereof. The (meth)acrylate-based resin contains from 20% by weight to 70% by weight of at least one (meth)acrylate monomer and from 1% by weight to 50% by weight of at least one prepolymer.Type: GrantFiled: December 1, 2011Date of Patent: January 30, 2018Assignee: Evonik Degussa GmbHInventors: Guenter Schmitt, Sandra Reemers, Emmanouil Spyrou, Heike Heeb, Stephan Kohlstruk, Friedrich Georg Schmidt, Elke Gollan
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Patent number: 9611408Abstract: The present disclosure relates to a woven-fabric adhesive tape, more particularly a cable-wrapping tape, comprising a tape-shaped woven-fabric backing having at least one adhesive coating applied to at least one side of the backing. The woven-fabric backing is formed from warp threads and weft threads and the linear density of the weft threads in dtex is greater than the linear density of the warp threads in dtex. The width-based linear density of the warp threads in dtex/cm is less than the length-based linear density of the weft threads in dtex/cm. The width-based linear density of the warp threads is about 2000 to 4000 dtex/cm and the length-based linear density of the weft threads is about 8000 to 20 000 dtex/cm, preferably 8000 to 16 000 dtex/cm. The disclosure further provides a tape-shaped woven-fabric backing for use in a woven-fabric adhesive tape.Type: GrantFiled: November 8, 2010Date of Patent: April 4, 2017Assignee: Coroplast Fritz Muller GmbH & Co. KGInventors: Christoph Lodde, Gülay Wittig
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Patent number: 9534075Abstract: Disclosed are an alkoxysilylated isocyanurate epoxy compound, a composite of which exhibiting low CTE and high glass transition temperature or Tg-less and/or a cured product of which exhibiting good flame retardant property, a method of preparing the same, a composition including the same, a cured product formed of the composition, and a use of the composition. An isocyanurate epoxy compound having an alkoxysilyl group and an epoxy group in a core; a method of manufacturing the epoxy compound by the epoxidation and alkoxysilylation of a starting material; an epoxy composition including the epoxy compound; and a cured product and a use thereof, are provided. A composite of the epoxy composition has improved bonding efficiency between alkoxysilyl group and filler and between alkoxysilyl groups, and has good heat resistance, low CTE, and high glass transition temperature or Tg-less. A cured product formed of the epoxy composition has good flame retardant property.Type: GrantFiled: November 1, 2012Date of Patent: January 3, 2017Assignee: KOREA INSTITUTE OF INDUSTRIAL TECHNOLOGYInventors: Hyun-Aee Chun, Sang-Yong Tak, Su-Jin Park, Yun-Ju Kim, Sung-Hwan Park, Sook-Yeon Park
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Patent number: 9437348Abstract: Provided in at least one embodiment is a nonwoven paper layer directly fused on one or both sides with a nonwoven fabric layer wherein one or both of the nonwoven paper and nonwoven fabric are electrically insulating.Type: GrantFiled: March 23, 2011Date of Patent: September 6, 2016Assignee: 3M Innovative Properties CompanyInventors: Robert H. Turpin, David S. Stankes, Martin H. Fox, Mitchell T. Huang
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Patent number: 9245853Abstract: According to one embodiment, a memory module includes a substrate, a semiconductor memory device, a plate-form conductive member, wire, and a mold member. The substrate includes a ground terminal to which a ground potential is applied. The semiconductor memory device is provided on the substrate. The plate-form conductive member is provided on the semiconductor memory device. The wire that electrically connects the ground terminal to the plate-form conductive member. The mold member seals the semiconductor memory device on the substrate, the plate-form conductive member and the wire.Type: GrantFiled: December 26, 2013Date of Patent: January 26, 2016Assignee: KABUSHIKI KAISHA TOSHIBAInventor: Shiro Harashima
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Patent number: 9125331Abstract: Methods and systems for bonding a flex circuit to a printed circuit board (PCB) using an anisotropic conductive film (ACF) bonding process are disclosed. According to one aspect of the present invention, supports may be attached to an electromagnetic interference (EMI) shielding can in such a way that the EMI shielding can is arranged to support and/or spread forces involved in ACF bonding. The supports may be located proximate to the walls of the EMI shielding can, and positioned such that the supports effectively do not come into contact with components mounted on a PCB along with the EMI shielding can.Type: GrantFiled: August 29, 2012Date of Patent: September 1, 2015Assignee: APPLE INC.Inventors: Kyle Yeates, Teodor Dabov, Stephen Brian Lynch
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Publication number: 20150050472Abstract: The present invention provides a resin composition which can simply provide, with good reproducibility, a laminate, a printed wiring board, and the like that not only have excellent heat dissipation properties but have good moldability, good mechanical drillability and excellent appearance, and a prepreg, a metal foil-clad laminate, and the like using the same. A resin composition having a cyanate ester compound (A), an epoxy resin (B), a first inorganic filler (C), a second inorganic filler (D), and a molybdenum compound (E), wherein an average particle diameter ratio of the first inorganic filler (C) to the second inorganic filler (D) is in a range of 1:0.02 to 1:0.2.Type: ApplicationFiled: March 25, 2013Publication date: February 19, 2015Applicant: MITSUBISHI GAS CHEMICAL COMPANY, INC.Inventors: Chisato Saito, Daisuke Ueyama, Masanobu Sogame, Yoshinori Mabuchi, Yoshihiro Kato
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Publication number: 20140370771Abstract: Provided are a resin composition having excellent electrical characteristics and heat resistance after moisture absorption, and being also excellent in flowing characteristics at the time of production of a laminate, and a prepreg, a metal foil-clad laminate and a resin sheet using the same. Used is a resin composition comprising a bifunctional phenylene ether oligomer (a) having a polyphenylene ether skeleton, an aralkyl-based cyanate ester compound (b), a bisphenol-based cyanate ester compound (c), an epoxy resin (d), a brominated carbonate oligomer (e), an inorganic filler (f), an alkoxynaphthol-based polymerization inhibitor (g) and/or a thioether-based polymerization inhibitor (h).Type: ApplicationFiled: August 24, 2012Publication date: December 18, 2014Applicant: MITSUBISHI GAS CHEMICAL COMPANY, INC.Inventors: Naoki Oka, Syouichi Itoh, Masataka Kudo, Michio Yaginuma
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Publication number: 20140349089Abstract: The present invention provides a resin composition with which a laminate, a printed wiring board, and the like that not only have high thermal conductivity but have good moldability with the occurrence of cracks and voids suppressed can be implemented simply and with good reproducibility, and a prepreg, a laminate, a metal foil-clad laminate, and the like using the same. The resin composition of the present invention is a resin composition comprising at least a cyanate ester compound (A), an epoxy resin (B), a first inorganic filler (C), and a second filler (D), wherein an average particle diameter ratio of the first inorganic filler (C) to the second inorganic filler (D) is in the range of 1:0.02 to 1:0.2.Type: ApplicationFiled: October 26, 2012Publication date: November 27, 2014Inventors: Daisuke Ueyama, Masanobu Sogame, Chisato Saito, Yoshinori Mabuchi, Yoshihiro Kato
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Publication number: 20140151094Abstract: A low dielectric constant, a low dielectric loss tangent, and heat resistance are achieved. An active ester resin that has a resin structure produced by reacting a polyfunctional phenolic compound (a1) with a monofunctional aromatic carboxylic acid or its chloride (a2) and an aromatic dicarboxylic acid or its chloride (a3). The polyfunctional phenolic compound (a1) is represented by structural formula (1) below: (where Ar represents a benzene ring, a naphthalene ring, a benzene ring nuclear-substituted by an alkyl group having 1 to 4 carbon atoms, or a naphthalene ring nuclear-substituted by an alkyl group having 1 to 4 carbon atoms, X represents a methylene group, a divalent cyclic aliphatic hydrocarbon group, a phenylene dimethylene group, or a biphenylene-dimethylene group, and n represents the number of repeating units and the average thereof is in a range of 0.5 to 10).Type: ApplicationFiled: May 25, 2012Publication date: June 5, 2014Applicant: DIC CorporationInventors: Kan Takeuchi, Etsuko Suzuki, Kunihiro Morinaga, Kazuo Arita
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Publication number: 20140138128Abstract: In accordance with the present invention, compositions are described which are useful, for example, for the preparation of metal-clad laminate structures, methods for the preparation thereof, and various uses therefor. Invention metal-clad laminate structures are useful, for example, in the multi-layer board (MLB) industry, in the preparation of burn-in test boards and high reliability boards, in applications where low coefficient of thermal expansion (CTE) is beneficial, in the preparation of boards used in down-hole drilling, and the like.Type: ApplicationFiled: January 24, 2014Publication date: May 22, 2014Applicant: ArlonInventors: Daniel Chang, Sam Najjar
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Publication number: 20140127958Abstract: The invention relates to an electric insulation material including modified nanoparticles, a porous substrate and polymer matrix, wherein the modified nanoparticles include a nanoparticle and a diblock copolymer covalently attached to the nanoparticle, the diblock copolymer including a first block polymer of molecular weight greater than 1000 and a glass transition temperature below room temperature attached to the nanoparticle and a second block polymer of molecular weight greater than 1000 covalently linked to the first block polymer, wherein the second block polymer and the matrix both possess the same chemical functionality. Other electrical insulation materials and methods of making such electrical insulation materials are also disclosed.Type: ApplicationFiled: January 14, 2014Publication date: May 8, 2014Inventors: Linda S. SCHADLER, Henrik HILLBORG, Brian BENICEWICZ, Su ZHAO
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Publication number: 20130337249Abstract: Insulating materials are provided, the insulating materials comprising a nonwoven web comprising a plurality of continuous spunbonded polyester bicomponent fibers. Each of the plurality of bicomponent fibers comprises a) from about 20% by weight to about 80% by weight of poly(ethylene terephthalate) in a core, and b) from about 80% by weight to about 20% by weight of poly(trimethylene terephathalate) in a sheath surrounding the core, wherein the amounts in percent by weight are based on the total weight of each of the plurality of bicomponent fibers. Also provided are electrical apparatuses comprising the insulating materials and a dielectric fluid, as well as a dielectric material comprising the nonwoven web impregnated with at least 10 weight percent of a dielectric fluid.Type: ApplicationFiled: August 24, 2012Publication date: December 19, 2013Applicant: E I DU PONT DE NEMOURS AND COMPANYInventors: Gyorgyi Fenyvesi, Mark Andrew Harmer, Byoung Sam Kang, Lakshmi Krishnamurthy, Serge Rebouillat, Peter A. Brown, Weiming Qiu
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Patent number: 8551628Abstract: A composite material, a high-frequency circuit substrate made from the composite material, and a method of making the high-frequency circuit substrate. The composite material includes: a thermosetting composition including a butadiene styrene copolymer resin with a molecular weight less than 11,000 containing more than 60 percent of vinyl, a polybutadiene resin with polarity groups containing more than 60 percent vinyl, and a maleic anhydride grafted polybutadiene styrene copolymer with a molecular weight of more than 50,000; a fiberglass cloth; a powder filler; and a cure initiator. The composite material permits easy manufacture of the prepreg and high bonding of the copper foil. The high-frequency circuit substrate made from the composite material has low dielectric constant, low dielectric loss tangent, and excellent heat resistance, and is convenient for the processing operation. The composite material is suitable for making the circuit substrate.Type: GrantFiled: November 7, 2008Date of Patent: October 8, 2013Assignee: Guangdong Shengyi Sci. Tech Co., Ltd.Inventor: Min She Su
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Publication number: 20130225023Abstract: Dielectric fluids are provided, the dielectric fluids comprising a mixture of polyol esters derived from a reaction of a) a polyol comprising pentaerythritol, trimethylolpropane, neopentyl glycol, or combinations thereof, and b) a mixture of fatty acid esters derived from a high oleic soybean oil comprising fatty acid moieties, wherein the high oleic soybean oil has a C18:1 content of greater than 65% of the fatty acid moieties in the oil, and a combined C18:2 and C18:3 content of less than 20% of the fatty acid moieties in the oil. Also provided are electrical apparatuses comprising the dielectric fluids, and processes for preparing the mixtures of polyol esters.Type: ApplicationFiled: August 24, 2012Publication date: August 29, 2013Applicant: E I DU PONT DE NEMOURS AND COMPANYInventors: Weiming Qiu, Peter A Brown
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Patent number: 8512417Abstract: Embodiments herein provide a nanoparticle, such as a metal nanoparticle, coupled to a linker molecule to form a nanoparticle-linker construct. In an embodiment, a nanoparticle-linker construct may be further bound to a substrate to take advantage of one or more properties of the nanoparticle. In an embodiment, a functionalized nanoparticle (a nanoparticle having a reactive functionality) may be bound to a linker to form a functionalized nanoparticle-linker construct which may in-turn be bound to a substrate.Type: GrantFiled: November 16, 2009Date of Patent: August 20, 2013Assignee: Dune Sciences, Inc.Inventors: John M. Miller, James E. Hulchison, Scoll F. Sweeney
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Patent number: 8446734Abstract: The invention relates to a circuit board having high density circuit and excellent connection reliability and lamination reliability. A resin fabric cloth (4) is provided by arranging single fibers (4a) or fiber bundles composed of a plurality of single fibers, which single fiber has a linear thermal expansion coefficient smaller than that of silicon, at least in two directions and alternately weaving them. In the board, the resin fabric cloth is covered with a resin portion (5) made of a resin material having a linear thermal expansion coefficient larger than that of silicon.Type: GrantFiled: March 30, 2007Date of Patent: May 21, 2013Assignee: Kyocera CorporationInventors: Katsura Hayashi, Yutaka Tsukada, Kimihiro Yamanaka, Masaharu Shirai, Isamu Kirikihira
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Publication number: 20130105209Abstract: An inorganic filler containing (1) from 50 to 60 parts by weight of SiO2; (2) from 5 to 20 parts by weight of Al2O3; (3) from 0 to 10 parts by weight of CaO; (4) from 15 to 30 parts by weight of B2O3; (5) from 0 to 5 parts by weight of MgO; (6) from 0 to 1 parts by weight of Na2O, K2O or a combination of both; and (7) from 0 to 5 parts by weight of TiO2; based on a total weight of the filler, and having a maximum particle diameter below 100 ?m is introduced. A resin composition containing the inorganic filler and application in printed circuit boards are also introduced. A laminate prepared by the inorganic filler provides a good drilling function, a good dielectric performance and a good high frequency transmission function in high frequency transmission printed circuit board.Type: ApplicationFiled: November 1, 2012Publication date: May 2, 2013Applicant: ELITE ELECTRONIC MATERIAL (KUNSHAN) CO., LTD.Inventor: Elite Electronic Material (Kunshan) CO., LTD.
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Patent number: 8372765Abstract: The present invention relates to a process for producing odor-inhibiting water-absorbing composites comprising water-absorbing polymer particles and fibers, wherein the fibers are premixed with at least one metal peroxide, metal hyperoxide or metal ozonide.Type: GrantFiled: January 21, 2011Date of Patent: February 12, 2013Assignee: BASF SEInventors: Volker Braig, Thomas Daniel
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Patent number: 8367942Abstract: An electrical interposer for connecting two electronic devices includes a plurality of first cores with undulating structure extending in a first direction and a plurality of second cores with undulating structure extending in a second direction angular with the first direction. Each first core has first peaks and first valleys alternately arranged in the first direction and each first peak is electrically connected with a corresponding neighboring first valley but insulated from others. Each second core has second peaks and second valleys alternately arranged in the second direction and each second peak is electrically connected with a corresponding neighboring second valley but insulated from others. The first cores and the second cores interlace with each other to reach a woven structure with the first peaks and the second peaks jointly constituting an upper interface, and the first valleys and the second valleys jointly constituting a lower interface.Type: GrantFiled: October 27, 2009Date of Patent: February 5, 2013Assignee: Hon Hai Precision Ind. Co., Ltd.Inventors: David Gregory Howell, Hao-Yun Ma
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Publication number: 20130012088Abstract: There are provided a cyanate ester resin composition for highly multilayered printed wiring boards for high-frequency applications which exhibits excellent heat resistance and dielectric characteristics and which can yield moldings with an excellent surface appearance, a prepreg prepared using the same, and a metal foil-clad laminated sheet. The resin composition comprises (a) a cyanate ester resin having two or more cyanate groups in the molecule, (b) a bisphenol A epoxy resin having two or more epoxy groups in the molecule, (c) a novolak epoxy resin having two or more epoxy groups in the molecule, (d) a brominated polycarbonate oligomer, (e) a low polymer of styrene and/or a substituted styrene, (f) spherical silica particles having a mean particle diameter of 3 ?m or less, and (g) a wetting and dispersing agent.Type: ApplicationFiled: January 6, 2011Publication date: January 10, 2013Applicant: MITSUBISHI GAS CHEMICAL COMPANY, INC.Inventors: Akifumi Tiba, Satoshi Yoshinaka
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Publication number: 20120318571Abstract: The present disclosure provides a thermosetting resin composition including a benzoxazine component comprising two or more benzoxazine monomer compounds and at least one epoxy resin characterized in that a resultant cured product formed by curing the thermosetting resin composition possesses high heat resistance and low dielectric loss at high frequency. The thermosetting resin composition is especially suited for use in high speed printed circuit boards and semiconductor devices.Type: ApplicationFiled: March 2, 2011Publication date: December 20, 2012Applicant: Huntsman Advanced Materials Americas LLCInventors: Roger Tietze, Yen-Loan Nguyen
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Publication number: 20120315814Abstract: A high-frequency copper claded laminate for use in an operational frequency of at least 1 GHz possesses properties of dielectric constant (Dk) less than 3.2, dissipation factor (Df) less than 0.005, high glass transition temperature, high thermal stability and low moisture absorption; the laminate contains a tack-free prepreg constituted by a reinforcement impregnated with an inventive resin mixture at least comprising a high-molecular-weight polybutadiene resin, a low-molecular-weight polybutadiene resin, a modified thermosetting polyphenylene ether resin and an inorganic powder; and particularly the tack-free prepreg can be processed into the copper claded laminates through automated layup processing to satisfy a long-felt but unmet needs in the filed of producing copper claded laminate.Type: ApplicationFiled: June 1, 2012Publication date: December 13, 2012Applicant: NAN YA PLASTICS CORPORATIONInventors: Dein-Run FUNG, Te-Chao LIAO, Hao-Sheng CHEN, Chun-Lai CHEN
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Patent number: 8263225Abstract: Copper clad laminates having reduced laminate curl include copper foil with a tensile strength of less than 47 ksi.Type: GrantFiled: June 1, 2004Date of Patent: September 11, 2012Assignee: Isola USA Corp.Inventors: Cathy Hendricks, Kathy Kelly, Martin Choate
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Patent number: 8114791Abstract: The present invention relates generally to a static dissipative textile having an electrically conductive surface achieved by coating the textile with an electrically conductive coating in a variety of patterns. The electrically conductive coating is comprised of a conducting agent and a binding agent, and optionally a dispersing agent and/or a thickening agent. The static dissipative textile generally comprises a fabric which may be screen printed or otherwise coated with a conductive coating on the backside of the fabric so that the conductive coating does not interfere with the appearance of the face of the fabric. The economically produced fabric exhibits relatively permanent static dissipation properties and conducts electric charge at virtually any humidity, while the conductive coating does not detrimentally affect the overall appearance or tactile properties of the fabric.Type: GrantFiled: July 27, 2007Date of Patent: February 14, 2012Assignee: Sage Automtive Interiors, Inc.Inventors: Andrew D. Child, Alfred R. Deangelis
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Publication number: 20110162653Abstract: A method of making a fluorinated fibrous web, which method includes providing a nonwoven web 22 that contains polymeric fibers, creating a plasma that contains fluorine atoms at a first location 14, and contacting the nonwoven web with products from the plasma at a second location 26 remote from the first location 14. The method avoids exposure of the web to the plasma and hence expands the manufacturing processing window. Webs so fluorinated have a different C3F4H+ to C2F5+ ratio when compared to locally fluorinated webs having similar levels of surface fluorination. The remote fluorinated webs can be subsequently charged electrically to provide a good performing electret filter 40 suitable for use in an air purifying respirator 30. Webs fluorinated in accordance with this invention also may exhibit good performance even after being “aged” at high temperatures.Type: ApplicationFiled: March 16, 2011Publication date: July 7, 2011Inventors: Seth M. Kirk, Marvin E. Jones, Steven J. Pachuta, Andrew W. Chen, William P. Klinzing, Patrick J. Sager
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Patent number: 7867594Abstract: An endless belt for use in digital imaging systems is provided having edge to edge uniform flatness, and precise circumferential and edge to edge thickness. The layers comprising the belt may be tailored as desired for use in either image recording, image transfer or sheet transport operations. In one embodiment, the belt includes an elastomeric base layer, a reinforcing support layer, and an elastomeric surface ply. The belt is preferably manufactured by building the layers on a workpiece and then curing the layers.Type: GrantFiled: July 9, 2008Date of Patent: January 11, 2011Assignee: Day International, Inc.Inventors: Jeff Jennings, Will Goss, Chris Tice
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Patent number: 7846853Abstract: An electrical insulation paper that is made of mica flakelets (22), having an average size range of 0.01 to 0.05 mm in their thinnest dimension, hexagonal boron nitride (26), which has an average size range of 10 to 1,000 nm in their longest dimension, and a resin matrix. The mica flakelets and the hexagonal boron nitride are mixed and formed into a paper (17), and the resin is added to the paper after formation, the ratio by weight of the hexagonal boron nitride to the mica flakelets is directly proportional to the average size of the hexagonal boron nitride compared to the average size of the mica flakelets, within an adjustment factor.Type: GrantFiled: January 23, 2007Date of Patent: December 7, 2010Assignee: Siemens Energy, Inc.Inventors: Gary Stevens, James D. B. Smith, John W. Wood, Peter Groeppel
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Patent number: 7833916Abstract: The present invention provides several methods and materials for use in building construction that may require air and water barrier, and water vapor permeability along with thermal or acoustic insulation. Several embodiments provide materials for a variety of building construction needs that can help build next generation green buildings.Type: GrantFiled: June 29, 2005Date of Patent: November 16, 2010Assignee: Aspen Aerogels, Inc.Inventors: Daniel Leeser, Christopher Blair, Daniel Bullock, Sara Rosenberg, Poongunran Muthukumaran
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Patent number: 7820945Abstract: Disclosed is a heating fabric comprising a heating fabric element made by weaving woof fibers and warp fibers, a pair of conductive parts being a plain fabric made by a weaving method to extend from one side edge of the heating fabric element, for supplying electric power to the heating fabric element, wherein electrode fibers are woven in rows as warp threads in the conductive parts and a heating fiber is intermittently woven as woof threads at predetermined intervals so as to be conductive with the conductive parts, and wherein the heating fiber is woven in a zigzag pattern on the other side of the plain fabric of the conductive parts, in which one end of the heating fiber is woven into the conductive part, and a portion of the other end of the heating fiber is not woven into the conductive part, thereby forming a jumping portion having a length longer than a width of the conductive part, the jumping portion jumping over the conductive part so as not to be conductive with the conductive part.Type: GrantFiled: November 15, 2005Date of Patent: October 26, 2010Assignee: Pacific Medical Co., Ltd.Inventor: Young Cheol Seo
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Publication number: 20100255742Abstract: Disclosed is a heat radiation substrate, which includes a hybrid layer made of a thermoplastic resin, in particular, a liquid crystal polymer, and thus is lightweight and small thanks to the inherent properties of plastic and also is able to be mass produced, thus reducing the material and process costs.Type: ApplicationFiled: July 13, 2009Publication date: October 7, 2010Inventors: Geum Hee YUN, Jun Rok OH, Sang Jun YOON
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Patent number: 7786029Abstract: A resin composition contains a solvent and a solid content dispersed in the solvent. The solid content does not contain phenolic resin. The solid content contains a benzoxazine resin and a phosphorus-containing epoxy resin. The weight ratio of the benzoxazine resin to phosphorus-containing epoxy resin is about 0.6:1 to about 3.0:1. A circuit board substrate and a copper clad laminate fabricated with the resin composition mentioned above are disclosed too.Type: GrantFiled: January 5, 2009Date of Patent: August 31, 2010Assignee: ITEQ CorporationInventors: Li-Chun Chen, Jeng-I Chen, Bill Weng
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Patent number: 7759264Abstract: Described is a textile sheet, which in particular may be used as an interlining material in the textile industry, having a substrate based on a nonwoven fabric, woven fabric, knitted fabric, or the like. According to the invention, the substrate is provided with a mesh configuration comprising meshes of an electrically conductive material which are interlinked or interconnected in one and/or two dimensions, for example in the longitudinal and/or transverse direction. The textile sheet according to the invention is electrically conductive, and is further characterized by small thickness, low weight, high flexibility, and a very smooth textile feel. Also described is a method for manufacturing a textile sheet according to the invention, and preferred uses thereof.Type: GrantFiled: July 24, 2007Date of Patent: July 20, 2010Assignee: Carl Freudenberg KGInventors: Wolfgang Braun, Eva Schōpping, Oliver Staudenmayer, Klaus Richter
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Patent number: 7651963Abstract: The present invention provides for high thermal conductivity paper that comprises a host matrix (10), and high thermal conductivity materials (12) added to a surface of the host matrix in a specific pattern (12). The high thermal conductivity materials are comprised of one or more of nanofillers, diamond like coatings directly on the host matrix, and diamond like coatings on the nanofillers. In particular embodiments the specific pattern comprises one or more of a grid, edging, banding centering and combinations thereof and the high thermal conductivity materials cover 15-55% of the surface of the host matrix. Multiple surfaces, including sub layers may have patterning.Type: GrantFiled: April 3, 2006Date of Patent: January 26, 2010Assignee: Siemens Energy, Inc.Inventors: James D. B. Smith, Gary Stevens, John W. Wood
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Patent number: 7648758Abstract: Disclosed are composite materials that can exhibit low transmission energy loss and can also be temperature resistant. The composites include reinforcement fibers held in a polymeric matrix. The polymeric matrix can include an amorphous polymer component. Also disclosed are methods of forming the composites. Methods can include forming amorphous thermoplastic polymer fibers, forming a fabric from the fibers, combining the fabric with reinforcement fibers, and molding the structure thus formed under heat and pressure such that the amorphous thermoplastic polymer flows and forms a polymeric matrix incorporating the reinforcement fibers. The composites can be molded from multi-layer structures that can include layers of differing materials, for instance layers formed of polyaramids, fiberglass, or carbon fiber wovens or nonwovens. The composites can advantageously be utilized in low loss dielectric applications, such as in forming circuit board substrates, radomes, antennas, and the like.Type: GrantFiled: February 6, 2007Date of Patent: January 19, 2010Assignee: Innegrity, LLCInventor: Brian G. Morin
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Patent number: 7635439Abstract: The present invention relates generally to a static dissipative textile having an electrically conductive surface achieved by coating the textile with an electrically conductive coating in a variety of patterns. The electrically conductive coating is comprised of a conducting agent and a binding agent, and optionally a dispersing agent and/or a thickening agent. The static dissipative textile generally comprises a fabric which may be screen printed or otherwise coated with a conductive coating on the backside of the fabric so that the conductive coating does not interfere with the appearance of the face of the fabric. The economically produced fabric exhibits relatively permanent static dissipation properties and conducts electric charge at virtually any humidity, while the conductive coating does not detrimentally affect the overall appearance or tactile properties of the fabric.Type: GrantFiled: April 20, 2006Date of Patent: December 22, 2009Assignee: Milliken & CompanyInventors: Andrew D. Child, Alfred R. DeAngelis
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Publication number: 20090227162Abstract: Surface films, paints, or primers can be used in preparing aircraft structural composites that may be exposed to lightning strikes. Methods for making and using these films, paints or primers are also disclosed. The surface film can include a thermoset resin or polymer, e.g., an epoxy resin and/or a thermoplastic polymer, which can be cured, bonded, or painted on the composite structure. Low-density electrically conductive materials are disclosed, such as carbon nanofiber, copper powder, metal coated microspheres, metal-coated carbon nanotubes, single wall carbon nanotubes, graphite nanoplatelets and the like, that can be uniformly dispersed throughout or on the film. Low density conductive materials can include metal screens, optionally in combination with carbon nanofibers.Type: ApplicationFiled: March 9, 2007Publication date: September 10, 2009Applicants: Goodrich Corporation, Rohr, Inc.Inventors: Teresa M. Kruckenberg, Valerie A. Hill, Anthony Michael Mazany, Eloise Young, Song Chiou
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Patent number: 7585794Abstract: The present invention concerns a vapor retarder for indoor sealing of buildings, especially roof structures, with at least one barrier layer (1) retarding passage of moisture vapor, especially water vapor, with the vapor retarder also having an electromagnetic-field-(EMF)-shielding layer (EMF layer) (2).Type: GrantFiled: October 18, 2004Date of Patent: September 8, 2009Assignee: Saint-Gobain IsoverInventors: Lothar Bihy, Birgit Boge, Horst Keller
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Publication number: 20090178832Abstract: A prepreg comprising composite woven cloth or non-woven cloth composed of glass fiber and polyolefin fiber that are a main part of the cloth and a thermosetting resin composition that gives a cured product having a low thermal expansion coefficient, wherein the thermal expansion coefficient of the cured resin composition at 50 to 100 ° C. is 50 ppm/° C. or less. A printed circuit board, multi layered circuit board, and electronic part are disclosed.Type: ApplicationFiled: January 14, 2009Publication date: July 16, 2009Inventors: Satoru Amou, Hiroshi Shimizu, Akinori Hanawa
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Patent number: 7553781Abstract: The present invention facilitates the thermal conductivity of fabrics by surface coating of the fabrics with high thermal conductivity materials 6. The fabrics may be surface coated when they are individual fibers or strands 4, bundles of strands, formed fabric or combinations therefore. A particular type of fibrous matrix used with the present invention is glass. Some fabrics may be a combination of more than one type of material, or may have different materials in alternating layers. HTC coatings of the present invention include diamond like coatings (DLC) and metal oxides, nitrides, carbides and mixed stoichiometric and non-stoichiometric combinations that can be applied to the host matrix.Type: GrantFiled: April 15, 2005Date of Patent: June 30, 2009Assignee: Siemens Energy, Inc.Inventors: James D Smith, Gary Stevens, John W Wood
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Patent number: 7504346Abstract: Aerogel composite materials having a lofty fibrous batting reinforcement preferably in combination with one or both of individual short randomly oriented microfibers and conductive layers exhibit improved performance in one or all of flexibility, drape, durability, resistance to sintering, x-y thermal conductivity, x-y electrical conductivity, RFI-EMI attenuation, and/or burn-through resistance.Type: GrantFiled: May 18, 2006Date of Patent: March 17, 2009Assignee: Aspen Aerogels, Inc.Inventors: Christopher J. Stepanian, George L. Gould, Redouane Begag
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Patent number: 7468332Abstract: The invention relates to an electroconductive textile material and method of preparation thereof. The method consists mainly of two stages: 1) special pretreatment of the fabric substrate for activation and making it suitable for subsequent application and strong attachment of a conductive coating with the use of a layer-by-layer technique (LBL); 2) subsequent application and strong attachment of a conductive coating by means of a layer-by-layer technique. The first stage may be carried out thermally, thermochemically, by treating in hot solutions, or plasma-chemically by plasma treatment. The pre-treatment may be performed, e.g., for swelling and/or for the formation of unsaturated chemical bonds or uncompensated charges in the fabric material. The pretreatment is needed to ensure more efficient penetration of chemical components into the fabric structure during subsequent LBL applications of treatment solutions that contain nano-particles and that determine the density of the molecular layer.Type: GrantFiled: September 2, 2005Date of Patent: December 23, 2008Inventor: Jamshid Avloni