Abstract: A method of manufacturing a semiconductor device including selecting at least one die on at least one wafer in a manufacturing lot of wafers to scan and inspect, processing the wafers through a first process, mapping detected defects with the at least one die selected to be scanned and inspected and determining if the selected at least one die should be scanned and inspected in the next process. If it is determined that the selected at least one die should not be scanned and inspected in the next process, at least one alternative die is selected to be scanned and inspected in the next process.