Abstract: In one embodiment of the present invention, an amplifier circuit is provided which includes a predistorter coupled to a power amplifier. An error detector is coupled to the signal input of the predistorter via a delay circuit and to the power amplifier output. The error detector output is coupled to a delta-sigma modulator and the output of the delta-sigma is coupled to the control input of the predistorter. The predistorter may be constructed to provide an output selected from a set of output characteristic curves, in response to a control signal at the control input. The control input of the predistorter may be a multi-bit discrete input, which may be a binary input, such as for example, a three bit binary input.

Abstract: In at least one embodiment, the invention is a temperature sensor having a temperature sensitive material positioned within a shell. The shell has a first section and a second section, which are attached together by a non-adhesive bond. The non-adhesive bond being an atomic bond, such as a diffusion bond. The temperature sensitive material is capable of emitting a radiation signal which varies in its magnitude and character as the material's temperature changes. The shell allows transmission of the radiation signal through the shell to an external processor. Analysis of the emitted radiation signal by the processor can provide a temperature measurement. The temperature sensitive material is a phosphorescent, such as a phosphor. The shell may be made of a material which can be diffusion bonded, such materials include a silicon comprising material, a glass, a plastic, a sapphire and a quartz.

Abstract: In at least one embodiment, the apparatus includes an actuator arm, a mirror structure, and a latch mounted between the arm and the mirror structure. The latch has a first end mounted to the arm and a fastener connected to the mirror structure. The fastener has a fastener support surface and a fastener side surface, where the fastener support surface is in contact with the mirror structure. The fastener support surface and the fastener side surface are angled to each other to define a fastener corner. At the fastener corner is a fastener notch. Likewise, the mirror structure can include a catch for receiving the latch on a substantially flat catch support surface, which is created by a catch notch at the corner of the catch support and side surfaces. In at least one embodiment, the method includes steps of fabrication of the apparatus.

Abstract: In certain implementations, a method for chip singulation is provided including etching a frontside dicing trench from a front side of a wafer, forming a temporary holding material, in the frontside dicing trench, etching a backside dicing trench from a back side of the wafer along the frontside dicing trench, removing the temporary holding material and releasing the chip from the wafer or an adjacent chip. Certain implementations may include etching through surface deposited layers on the front side of the wafer. Certain implementations may further include completely filling the frontside dicing trench with the temporary holding material and etching the backside dicing trench to the temporary holding material that is in the frontside dicing trench, such that removing the temporary holding material self-dices the wafer. Certain implementations may include surrounding MEMS structures with the temporary holding material so as to hold the structures during etching of the back side of the wafer.

Abstract: In one implementation, a method for operating a plurality of MEMS devices including applying a magnitude of a selected actuation signal equal to a first substantially constant magnitude to an actuator to cause a movable structure to begin to accelerate from a first position to impact a motion stop at a second position. The method also includes decreasing the magnitude of the selected actuation signal in a first manner. The method further includes varying at least one of a start time and a duration of the decreasing magnitude of the selected actuation signal and observing a settling time of the movable structure in response to the step of varying. In some implementations, the method includes ascertaining a range of values for the start times and the corresponding durations for each of the plurality of MEMS devices that are capable of providing settling times of the movable structure in conformance with a predetermined specification based on the steps of varying and observing.

Abstract: In one embodiment, a MEMS apparatus having a MEMS array including a plurality of MEMS devices is provided. In some embodiments, each of the plurality of MEMS devices includes a movable structure and a second structure. In addition, in some embodiments, a plurality of signal sources are coupled to the plurality of MEMS devices so as to be capable of supplying actuation signals for actuating the movable structure to impact the second structure. Further, in some embodiments, at least one processor is coupled to the plurality of signal sources to control the actuation signals, and is configured such that each of the plurality of MEMS devices is provided with a corresponding custom actuation signal.

Abstract: In at least one embodiment, an apparatus having a first structure, a second structure, and a hinge coupled between the first and second structures. The hinge has a first flexible member aligned substantially along an axis. The hinge is arranged so that the second structure can rotate relative to the first structure substantially about the axis. The hinge can also include a second flexible member aligned substantially along the axis. The first and second flexible members being positioned on opposite sides of the second structure. In at least one embodiment, a method includes steps of fabrication of the apparatus.