Abstract: Air bubbles or foreign objects in a transparent adhesive layer that bonds a transparent plate and a plate-like member together in full-surface contact are detected without fail. For the detection, an optical fiber or the like is used to irradiate the adhesive layer with light from a side, the cast light is guided through the adhesive layer, and a state of the adhesive layer is checked with the guided light. A check that discriminates defects in the adhesive layer from defects in the bonded transparent plate is thus made possible.

Abstract: An apparatus for everting a pipe-lining material for rehabilitating an existing pipe. The apparatus has a storage container for storing a pipe-lining material in an un-everted state, an eversion nozzle for everting the pipe-lining material, and a mounting pipe for removable connection between the storage container and the eversion nozzle. The everting nozzle has a nozzle opening to which the un-everted pipe-lining material is attached and which confronts an opening of the pipeline to be rehabilitated during use of the apparatus. The mounting pipe has an exterior surface, an interior space, a side portion provided with at least one opening communicating the exterior surface with the interior space, and an upper portion with an open end through which the un-everted pipe-lining material is inserted for attachment to the nozzle opening of the eversion nozzle.

Abstract: A lead frame has a pair of side frames each having a plurality of positioning holes and spaced apart from each other in a width direction of the lead frame. At least one section bar extends between the pair of side frames. First lead sections extend from the section bar and are arranged at predetermined intervals along the width direction of the lead frame. Second lead sections extend from the section bar along the width direction of the lead frame and are disposed in confronting and spaced-apart relation to the respective first lead sections in a longitudinal direction of the lead frame to define a frame area extending between the pair of side frames. Each of the second lead sections has a pair of separate and independent protruding portions disposed adjacent one another.

Abstract: An angular velocity sensor amplifies a plurality of detection signals using one amplifying circuit and separates these detection signals after amplification. The angular velocity sensor detects displacements of a mass in the axial directions using x-, y- and z-axis detection circuits. A carrier wave whose phase is shifted 90° from that of a carrier wave of the z-axis detection circuit is applied to the x- and y-axis detection circuits and outputs of the axis detection circuits are collectively inputted to a current/voltage conversion circuit which outputs a combined signal to three synchronous detection circuits that separate the signal into x-, y- and z-axis detection signal components.

Abstract: A speed control mechanism has a balance with hairspring mounted to undergo oscillation movement and a regulator structure for adjusting a position of the balance with hairspring. The regulator structure is formed of a nonmagnetic material to prevent reduction of an oscillation angle of the balance with hairspring during oscillation movement thereof.

Abstract: A lawn mower having a cutter housing for receiving a cutter blade for cutting grass. To make the manufacture of molds easy, the cutter housing is divided into three members: a housing proper for receiving the cutter blade, a bottom member for forming a cut grass carrying passage, and a scroll guide member for forming a portion of a scroll part. The bottom member engages with the housing proper and the scroll guide member. The scroll guide member is co-fastened to the housing proper with an engine. As a result, molds needed for making the cutter housing can be made simple and the assembly of the lawn mower made easy.

Abstract: A semiconductor device manufacturing method comprises etching a front side of a conductive board to form plural sets of a die pad portion and bonding areas, each set corresponding to one semiconductor device. Semiconductor chips are mounted on respective ones of the die pad portions using conductive paste. Electrodes of the respective semiconductor chips are electrically connected with metal wires to the bonding areas, and then the front side of the conductive board, including the semiconductor chips, the bonding areas and the metal wires, are sealed with a molding resin to form a resin-sealed body. Thereafter, the whole back side of the conductive board is removed to a depth sufficient to expose the die pad portions and the bonding areas. Then the resin-sealed body is separated into individual semiconductor devices.

Abstract: A manufacturing method for a semiconductor device which is capable of manufacturing the semiconductor device with a high quality in high yields while reducing variations in electric characteristic is disclosed. The manufacturing method according to the present invention includes a main body wafer manufacturing process for manufacturing a wafer on which a semiconductor device to be completed as a product is formed and a monitor wafer manufacturing process for manufacturing a wafer on which a monitor element is formed, the processes sharing a monitoring step alone, the main body wafer manufacturing process including a variation reduction step, the monitor wafer manufacturing process including a quality check step and a condition setting step.

Abstract: An ICP analyzer has a nebulizer for nebulizing a sample fluid for the purpose of analyzing microscopic impurities within the sample fluid, a plasma torch for introducing nebulized spray into a plasma, and a spray chamber disposed between the nebulizer and the plasma torch for separating spray comprised of microscopic particles from the nebulized spray prior to introduction thereof into the plasma torch. A heating section is provided at a central portion of the spray chamber and a cooling section is provided at a peripheral section of the spray chamber, and the spray is passed between the heating section and the cooling section to improve the efficiency sample introduction into the plasma to enable highly sensitive analysis by suppressing the proportion of a solvent component that reaches the plasma torch.

Abstract: An electronic azimuth meter includes an electronic azimuth meter main body and X-direction and Y-direction magnetic sensors for detecting magnetic field components in orthogonal two directions of the main body, the main body includes a magnetic part magnetized by geomagnetism B0 for forming a magnetic field having components in oblique directions relative to directions of the geomagnetism at locations of the magnetic sensors, approximate equation storing means for storing pluralities with regard to respective directions X, Y, of approximate equations calculated based on magnetic field detected values Vx and Vy of the magnetic sensors with regard to a number of azimuths of the azimuth meter in geomagnetism having magnetic field components Bx and By, which are approximate equations representing relationships between the detected values Vx and Vy of the magnetic sensors and the magnetic field components Bx and By of the geomagnetism, and azimuth calculating means for calculating azimuth by selecting specific app

Abstract: Disclosed is an apparatus that suppresses changes in a temperature distribution in a wafer caused by changes in the light transmittance of a process tube of a lamp annealing furnace. A transmission type sensor including a light emitting section and a light receiving section is arranged so that a process tube is sandwiched between the light emitting section and the light receiving section. The transmission type sensor measures the light transmittance of the process tube, so that it becomes possible to determine when the process tube needs changing. Also, by using a plurality of transmission type sensors and performing feedback control of power of lamps according to measurement results of the transmission type sensors, it becomes possible to suppress changes in the temperature distribution in a wafer.

Abstract: In order to realize accurate analysis with a fluorescent X-ray analyzer characterized by being non-destructive and non-contacting, in a short period of time, there is provided a common X-ray generating source, a collimator for focusing primary X-rays, and, as an energy dispersion type X-ray detection system for analyzing fluorescent X-rays as a means of elemental analysis, an energy dispersion type detector where a sensor with a low count rate but having superior energy resolution and a sensor with poor energy resolution but having a superior count rate are juxtaposed.

Abstract: A method of fabricating a probe comprises disposing a resist film over a base plate. A mask pattern comprised of a cantilever mask pattern and a probe mask pattern is disposed over the base plate for forming a cantilever portion and a probe portion, respectively, of a probe so that the probe mask pattern subtends an angle relative to the base plate that is no greater than an angle made by at least two crystal planes of a tip of the probe portion to the base plate. The mask pattern is then exposed, and an etching operation is conducted using the exposed mask pattern to form the probe having the cantilever portion and the probe portion.

Abstract: To prevent a front end of a slit forming sector of one of an open shutter sector group and a close shutter sector group from colliding with an upper edge portion of a partition opening of a partition plate and preventing leakage of light, a partition plate is provided with a partition plate opening and a projection is formed on the partition plate for preventing sector collision. The projection is formed slightly lower than the level of the upper edge portion of the partition plate opening so that immediately before a slit forming sector of the close shutter sector group comes into contact with the upper edge portion of the partition plate opening, a front end of the slit forming sector rides over the projection and is displaced from the upper edge portion of the partition plate opening.

Abstract: A reset circuit includes an invertor having one control input terminal to which a positive supply voltage and a potential lower than GND are supplied, and an n-channel transistor having a gate terminal connected to an output terminal of the invertor, a source terminal connected to a potential lower than the GND and a drain terminal connected to the GND.

Abstract: There is provided a bipolar transistor integrated circuit device having excellent characteristics by a simple process. A region where an impurity is not introduced is disposed in a part of a buried layer region for separating a collector region from a substrate, so that a bipolar transistor having low collector resistance can be formed. This can be applied also to a BiCMOS where insulated field effect transistors exist on the same substrate. These processes can be realized without adding a number of steps to a conventional process.

Abstract: When fluorescent photography is initiated, a mode switching signal is sent to the image processing section to change the image processing mode to monochrome processing. At the same time, a timer is started that indicates the time elapsed since the fluorescent agent was administered. While the timer is on, fundus images acquired are converted to monochrome images by the image processing section and displayed on a monitor and stored in an image storage device. When the system enters fluorescent photography mode, images are converted to monochrome images automatically. This eliminates the need for a mode switching operation using a mode conversion button or the like to switch from color mode to monochrome mode.

Abstract: A semiconductor substrate is utilized to integrally form a drive circuit and a pixel array to produce a transparent semiconductor device for a light valve. The semiconductor device for a light valve is constructed of a semiconductor substrate composed of a bulk single crystal silicon having an opaque thick portion and a thin transparent portion. A pixel array is formed in the transparent portion. A drive circuit is formed in a top face of the opaque portion. A transparent support substrate is laminated to the top face of the semiconductor substrate for reinforcement. A bulk portion of the semiconductor substrate is removed from a back face thereof by selective etching to provide the transparent portion.

Abstract: A switching regulator of which efficiency is increased while the switching regulator is operated under low load condition is disclosed. The switching regulator is arranged by: a reference voltage circuit for producing a reference voltage; an error amplifier for entering thereinto the reference voltage and a measuring voltage produced by subdividing an output voltage from the switching regulator and for amplifying a difference voltage between the reference voltage and the measuring voltage; an oscillator circuit for outputting an oscillator signal; a PWM comparator for comparing an output voltage of the error amplifier with an output voltage of the oscillator circuit; load detecting means for detecting an output load current; and efficiency varying means for varying an efficiency of the switching regulator in response to load conditions detected by the load detecting means.

Abstract: In order to avoid damage to a switching regulator in the event of short-circuiting of a load, and to reduce power consumption, the maximum duty ratio of a PWM type switching regulator is provided with a supply voltage dependency.