Abstract: A concave tapered food product includes a cross section and a second end having a shape defined by a generally concave arc and a generally convex arc. The concave tapered food product has a first side and a second side shaped by a longitudinal cut along the foodstuff. A cutter assembly for cutting a foodstuff to form the concave tapered food product includes a housing member. The cutter assembly also includes a curvilinear blade including a cutting edge for cutting the foodstuff, the cutting edge defining an arc along a first portion of the curvilinear blade and a foot positioned at an end of the curvilinear blade for supporting the curvilinear blade. The foot is configured for being received and secured in the housing member. The housing member is configured for at least partially enclosing the curvilinear blade.
Abstract: An assembly process properly positions and align a plurality of first die within a carrier substrate. The first die are positioned within cavities formed in the carrier substrate. The carrier substrate is then aligned with a second substrate having a plurality of second die fabricated therein. The first die and the second die are fabricated using different technologies. Aligning the carrier substrate and the second substrate aligns the first die with the second die. One or more first die can be aligned with each second die. Once aligned, a wafer bonding process is performed to bond the first die to the second die. In some cases, the carrier substrate is removed, leaving behind the first die bonded to the second die of the second substrate. In other cases, the carrier substrate is left in place as a cap. The second substrate is then cut to form die stacks.
Abstract: A food dispensing apparatus comprises a first shell, at least one second shell disposed within the first shell, a nozzle coupled to the first shell and the at least one second shell, and a check valve disposed in the nozzle and coupled to the at least one second shell. The at least one second shell is suitable for containing a food component. The food dispensing apparatus is suitable for preventing air from entering the at least one second shell.
Type:
Grant
Filed:
February 19, 2008
Date of Patent:
January 8, 2013
Inventors:
Jorge Succar, David C. Sorrick, Mario Mikula, Lorenzo Brescia
Abstract: An integrated circuit package comprising an enclosure including a dielectric housing, a first electrical contact, and a second electrical contact. The dielectric housing, the first electrical contact, and the second electrical contact are configured to form a contact side of the enclosure. In addition, the first and second electrical contacts are sized to be substantially alignment insensitive for electro-mechanical connection to corresponding contacts of an end-use equipment. The enclosure encapsulates an integrated circuit die which is electrically coupled to the first and second electrical contacts. The alignment insensitive first and second electrical contacts may be electro-mechanically connected to corresponding contacts of an end-use equipment (e.g., a printer). Further, the integrated circuit package may be hosted by a peripheral device (e.g., a printer cartridge).
Type:
Grant
Filed:
April 5, 2007
Date of Patent:
December 25, 2012
Assignee:
Maxim Integrated Products, Inc.
Inventors:
Jeff Alan Gordon, Steven Hass, Hal Kurkowski, Scott Jones
Abstract: A dual span center pivot irrigation system comprising first and second center pivot span structures pivotally secured at their inner ends to a fixed center pivot structure. Each of the center pivot span structures are independently operable with the movements thereof being coordinated by suitable controls. The center pivot span structures may be operated in at least three different modes, namely: (1) independent wiper; (2) follow the leader; and (3) independent full circle.
Abstract: An ovenable cooking apparatus for facilitating the cooking of food components while maintaining the separateness thereof may include a first container for holding a first food component, and a second container for holding a second food component. The separation of the first food component from the second food component maintains the surface area for the first and second food components to facilitate heating of the first and second food components. The first food component may have a liquid based content for producing steam when heated, and one or both of the first container and the second container may define a passage for providing airflow and steam flow for contacting the second container and/or the second foodstuff and heating or steaming the second food component. Additionally, the second container may be steam impermeable for cooking bread and the like.
Type:
Grant
Filed:
September 24, 2007
Date of Patent:
November 6, 2012
Assignee:
ConAgra Foods RDM, Inc.
Inventors:
Adam Pawlick, Keith Goerl, Michael R. Opat, Jr., Julia A. Zielke, Steven R. Baker, David W. France
Abstract: A packaging system for pharmaceuticals is provided. The system includes a box having an opening, a pouch strip positioned within the box. The pouch strip includes a continuous series of sealed pouches rolled into a spiral with a first end and a second end. The opening in the box is of a shape configured to accommodate the cross section of the sealed pouches such that the pouch strip may be pulled through the opening outwardly from the box.
Abstract: A circuit is provided that includes a parasitic power circuit that powers a parasitic circuit. The parasitic power circuit derives a supply voltage from an external AC or other signal suitable for use as a communications signal. A PMOS transistor or transistors is utilized to enable a supply voltage capacitor to charge substantially to the same voltage as the channel voltage of the communications signal.
Type:
Grant
Filed:
December 17, 2009
Date of Patent:
October 2, 2012
Assignee:
Maxim Integrated Products, Inc.
Inventors:
Marvin Lyle Peak, Jr., Bradley Mason Harrington, Matthew Ray Harrington
Abstract: A wafer-level packaged semiconductor device is described. In an implementation, the device includes one or more self-assembled resilient leads disposed on an integrated circuit chip. Each of the resilient leads are configured to move from a first position wherein the resilient lead is held adjacent to the chip and a second position wherein the resilient lead is extended away from the chip to interconnect the chip to a printed circuit board. A guard is provided to protect the resilient leads when the resilient leads are in the first position. One or more attachment bumps may also be furnished to facilitate attachment of the device to the printed circuit board.
Type:
Grant
Filed:
February 17, 2010
Date of Patent:
October 2, 2012
Assignee:
Maxim Integrated Products, Inc.
Inventors:
Chiung C. Lo, Arkadii V. Samoilov, Reynante Alvarado
Abstract: A sample tray assembly includes a first tray. The first tray defines a first slot and is disposed on a generally horizontally-oriented plane. The sample tray assembly also includes a second tray adjacent to the first tray. The second tray is configured for translational movement substantially parallel to the generally horizontally-oriented plane of the first tray between a retracted position and an extended position. The second tray defines a second slot. The second slot and the first slot are substantially aligned when the second tray is in the retracted position. The sample tray additionally includes a base member supporting the first tray. The second tray is slidably coupled with the base member.
Abstract: Transport scheduling and transport processes for low microbial (“LM”) bulk products are described. The transport scheduling and processes facilitate low microbial activity in a LM bulk product during the transport of the LM bulk product.
Type:
Grant
Filed:
January 20, 2011
Date of Patent:
September 11, 2012
Inventors:
Robert Mariniello, Edith D. Akins-Lewenthal, Ryan T. Grace