Abstract: An improved apparatus for debonding temporary bonded wafers includes a debonder, a cleaning module and a taping module. A vacuum chuck is used in the debonder for holding the debonded thinned wafer and remains with the thinned debonded wafer during the follow up processes steps of cleaning and mounting onto a dicing tape. In one embodiment the debonded thinned wafer remains onto the vacuum chuck and is moved with the vacuum chuck into the cleaning module and then the taping module. In another embodiment the debonded thinned wafer remains onto the vacuum chuck and first the cleaning module moves over the thinned wafer to clean the wafer and then the taping module moves over the thinned wafer to mount a dicing tape onto the wafer.

Abstract: A dangle, which plugs into the audio/earpiece jack of host devices, allows them to accept payment cards as a point of sale (POS) terminal. It contains a magnetic stripe (magstripe) card reader, a smart card reader, and/or a proximity card reader (reader(s)); a microprocessor or microcontroller (CPU); and a circuit for drawing power from a digital audio signal (power circuit). Payment card data is collected by the reader(s), passed to the CPU where it is encrypted, encoded, and modulated, sent to the host device through the Microphone input contact of the audio/earpiece jack, then transmitted via one the host device's networks to a merchant account provider for processing. A digital audio signal, constantly generated by the host device, provides power to the dongle via the power circuit. The power circuit converts the digital audio signal to stable DC power with the appropriate voltage for powering the dongle's other components.

Abstract: A system for developing rich internet applications (RIAs) for remote computing devices that utilize a certifying player to invoke server-side web services through a single, secure, certifying intermediary server, includes an integrated development environment (IDE). The IDE includes a toolbox comprising graphical components configured to be dragged and dropped into UI states implementing the RIA process flow and a Web Service Description Language (WSDL) integrator for generating web service call for accessing web services for processing input from the UI states and generating an output result.

Abstract: An endoscopic surgical instrument is used in minimally invasive laparoscopic surgery for inserting a gastric band into a patient's abdomen through a laparoscopic port. The gastric band insertion instrument includes a handle, an elongated shaft and a distal end assembly. The elongated shaft includes an actuator rod that opens and closes a movable jaw at the distal end. A pin at the distal end assembly engages a hole in the front of the gastric band, and the movable jaw is closed thereby securely capturing the front end of the gastric band. The shaft and the captured gastric band are inserted through a laparoscopic port into the patient's abdomen.

Abstract: A method of fabricating a film of magnetic nanocomposite particles including depositing isolated clusters of magnetic nanoparticles onto a substrate surface and coating the isolated clusters of magnetic nanoparticles with an insulator coating. The isolated clusters of magnetic nanoparticles have a dimension in the range between 1 and 300 nanometers and are separated from each other by a distance in the range between 1 and 50 nanometers. By employing PVD, ablation, and CVD techniques the range of useful film thicknesses is extended to 10-1000 nm, suitable for use in wafer based processing. The described methods for depositing the magnetic nanocomposite thin films are compatible with conventional IC wafer and Integrated Passive Device fabrication.

Abstract: An apparatus for debonding two temporary bonded wafers includes a chuck assembly, a flex plate assembly and a contact roller. The chuck assembly includes a chuck and a first wafer holder to hold wafers in contact with the top surface of the chuck. The flex plate assembly includes a flex plate and a second wafer holder configured to hold wafers in contact with a first surface of the flex plate. The flex plate comprises a first edge arranged adjacent to a first edge of the chuck and connected to a hinge. The flex plate is configured to swing around the hinge and to be placed above the top surface of the chuck. The contact roller is arranged adjacent to a second edge of the chuck, which is diametrically opposite to its first edge. A debond drive motor moves the contact roller vertical to the plane of the chuck top surface.

Abstract: An autopilot system includes a navigation application for computing angular position and angular turn rate of a pilot line and an autopilot steering application for calculating steering commands for a ship steering device. The pilot line provides directional guidance to a ship and is a vector having one end attached to a point on the ship and a second end pointing to a desired direction. The autopilot steering application receives the computed pilot line angular position and angular turn rate and calculates angular position steering commands for the steering device. The steering commands are calculated by taking into account the difference between the pilot line angular position and the ship's angular position and the difference between the pilot line angular turn rate and the ship's angular turn rate.

Abstract: Methods and devices for static or dynamic spine stabilization include an anterior plating system that allows longitudinal and pivoting motion of the plates and of the stabilized vertebras. In one embodiment a spine fixation assembly for connecting a first vertebra to a second vertebra includes a first plate configured to be attached to one or more locations of the first vertebra and a second plate configured to be attached to one or more locations of the second vertebra. The first plate is pivotally connected to the second plate and may also allow longitudinal and/or horizontal motion of the plates relative to each other.

Abstract: A spinal fixation element includes a screw and a washer. The screw comprises an elongated body of a first diameter and the body includes a threaded portion at a distal end and a semispherical head of a second diameter at a proximal end. The second diameter is larger than the first diameter. The washer comprises a semispherical through opening of a third diameter at the top, of a fourth diameter in the middle and of a fifth diameter at the bottom. The third diameter is slightly smaller than the second diameter, the fourth diameter is slightly larger than the second diameter and the fifth diameter is smaller than the second diameter. The washer surrounds the semispherical head, is non-removably attached to the semispherical head and is rotatable and positionable at an angle relative to the elongated body.

Abstract: A method for auto-scaling the infrastructure capacity of an application in response to client demands includes providing an application configured to run on an application infrastructure comprising a plurality of server nodes and to be accessed by clients via a first network. Next, providing traffic management means directing traffic from the clients to the server nodes of the application infrastructure. Providing monitoring means gathering performance metrics of the application and metrics of the application infrastructure. Providing controlling means configured to change the application infrastructure. Next, monitoring the performance metrics of the application and the metrics of the application infrastructure via the monitoring means thereby obtaining metrics information and then changing the application infrastructure based on the metrics information via the controlling means.

Abstract: The present invention relates to a pharmaceutical formulation of solid dosage forms comprising a therapeutically effective amount of a pyrrolidone anticonvulsant agent, and in particular Levetiracetam or a pharmaceutical acceptable salt or derivative thereof, in combination with an effective diluent, such as Dibasic Calcium Phosphate, and additional pharmaceutical excipients, and a process for the preparation thereof by wet granulation.

Abstract: An improved apparatus for temporary wafer bonding includes a temporary bonder cluster and a debonder cluster. The temporary bonder cluster includes temporary bonder modules that perform electronic wafer bonding processes including adhesive layer bonding, combination of an adhesive layer with a release layer bonding and a combination of a UV-light curable adhesive layer with a laser absorbing release layer bonding. The debonder cluster includes a thermal slide debonder, a mechanical debonder and a radiation debonder.

Abstract: A posterior spine fixation assembly includes a first elongated plate having first and second ends and a second elongated plate having first and second ends. The first and second elongated plates are arranged in an X-shaped configuration and are attached to each other via a first screw. The assembly also includes a first elongated rod having a first end configured to be removable attached to the second end of the first elongated plate and a second elongated rod having a first end configured to be removable attached to the second end of the second elongate plate. The assembly is attached to a first spine location with the first screw. The first and second plates are configured to rotate around an axis passing through the first screw and the distance between the first elongated rod and the second elongated rod is adjusted via this rotation.

Abstract: An improved wafer-to-wafer bonding method includes aligning an upper and a lower wafer and initiating a bond at a single point by applying pressure to a single point of the upper wafer via the flow of pressurized gas through a port terminating at the single point. The bond-front propagates radially across the aligned oppositely oriented wafer surfaces at a set radial velocity rate bringing the two wafer surfaces into full atomic contact by controlling the gas pressure and/or controlling the velocity of the motion of the lower wafer up toward the upper wafer.

Abstract: An apparatus for aligning semiconductor wafers includes equipment for positioning a first surface of a first semiconductor wafer directly opposite to a first surface of a second semiconductor wafer and equipment for aligning a first structure on the first semiconductor wafer with a second structure on the first surface of the second semiconductor wafer. The aligning equipment comprises at least one movable alignment device configured to be moved during alignment and to be inserted between the first surface of the first semiconductor wafer and the first surface of the second semiconductor wafer. The positioning equipment are vibrationally and mechanically isolated from the alignment device motion.

Abstract: An improved apparatus for direct chill casting of metals includes a mold, a bottom block assembly and a coolant. The mold is configured to surround a molten metal with a mold wall and the mold wall has an outer surface and an inner surface being in contact with the molten metal. The bottom block assembly is arranged at the bottom of the mold and includes a direct chill casting block configured to move away from the mold as the casting forms a solidifying shell of the molten metal. The coolant surrounds the outer surface of the mold wall and is arranged to remove heat away from the molten metal via the inner surface of the mold wall. The outer surface of the mold wall has a circumferential groove filled with a brazing alloy.

Abstract: A system for optimizing the performance of a website that runs on one or more HTTP servers and is configured to receive HTTP requests from one or more clients via user agents and provide HTTP responses to the one or more clients includes an intermediary component configured to connect to the clients and the servers via network connections. The intermediary component includes a traffic management system (TMS) that includes means for managing HTTP requests originating from the clients and targeting the servers and HTTP responses originating from the servers and targeting the clients and means for redirecting the HTTP requests to the intermediary component. The intermediary component further includes a traffic processing system that includes means for receiving the redirected HTTP requests and the HTTP responses and means for applying optimization techniques to the redirected HTTP requests and the HTTP responses.

Abstract: An improved apparatus and a method for semiconductor wafer bumping, that utilizes the injection molded solder process. The apparatus is designed for high volume manufacturing and includes equipment for filling patterned mold cavities formed on a first surface of a mold structure with solder, equipment for positioning and aligning a patterned first surface of a semiconductor structure directly opposite to the solder filled patterned mold cavities of the mold structure, a fixture tool for holding and transferring the aligned mold and semiconductor structures together, and equipment for receiving the fixture tool and transferring the solder from the aligned patterned mold cavities to the aligned patterned semiconductor first surface. The fixture tool includes a frame having a central aperture dimensioned to support a substrate and one or more clamp/spacer assemblies arranged symmetrically around the frame.