Abstract: Disclosed are packages, cartons, cases, and trays comprising a hot melt adhesive, in turn comprising at least one first homogenous linear or substantially linear ethylene polymer having a particular density and melt viscosity at 350° F. (177° C.), up to 60 weight percent wax and up to 40 weight percent tackifier. In particular, disclosed are packages, cartons, cases, and trays comprising a hot melt adhesive characterized by:
a) at least one homogeneous linear or substantially linear interpolymer of ethylene with at least one C3-C20 &agr;-olefin interpolymer having a density from 0.850 g/cm3 to 0.895 g/cm3; and
b) up to 60 weight percent of at least one tackifying resin; and
c) up to 40 weight percent of at least one wax, wherein the hot melt adhesive has a viscosity of less than about 5000 cPs (50 grams/(cm.second)) at 150° C.
Type:
Grant
Filed:
February 2, 2000
Date of Patent:
November 20, 2001
Assignees:
The Dow Chemical Company, H. B. Fuller Licensing & Financing, Inc.
Inventors:
Robert A. Dubois, Cynthia L. Rickey, Steven W. Albrecht, Thomas F. Kauffman, Beth M. Eichler, Maynard Lawrence, Thomas H. Quinn