Abstract: Photoresist compositions are disclosed.

Abstract: The present application relates to a compound of formula A-X—B, where (i) A-X—B form an ionic compound Ai Xi Bi where Ai and Bi are each individually an organic onium cation; and Xi is anion of the formula Q-R500—SO3? or (ii) A-X—B form a non-ionic compound Ac-Xc-Bc, where Ai, Bi, Q, R500, Ac, Bc, and Xc are defined herein. The compounds are useful as photoactive materials.

Abstract: The present invention discloses novel bottom anti-reflective coating compositions where a coating from the composition has an etch rate that can be regulated by the etch plate temperature.

Abstract: The present invention provides a coating composition, which can simply produce a porous siliceous film having excellent mechanical strength and, at the same time, possessing a stable very low level of dielectric and good chemical resistance to various chemicals, and to provide a process for producing a siliceous material using the same. The coating composition according to the present invention comprises a polyalkylsilazane compound, an acetoxysilane compound, an organic solvent, and, if necessary, a pore forming material. The present invention also provides a siliceous material produced by firing the coating composition and a process for producing the same.

Abstract: Antireflective coating compositions with reduced outgassing are disclosed.

Abstract: The present invention is to provide a coating composition capable of forming a protective film excellent in adhesion properties. Such a coating composition comprises a specific polymer containing carboxyl group, a specific multifunctional epoxide-containing compound having two or more epoxy groups, an organic solvent, and an amino-containing silane coupling agent represented by the following general formula (I): H2N—R1—Si—(OR2)3  (I) wherein, R1 is an unsubstituted alkylene group, and R2's are independently an unsubstituted alkyl group.

Abstract: A method of producing a sintered article of polybenzimidazole by using a polybenzimidazole resin is disclosed. This method comprises the steps of: filling a mold with a polybenzimidazole resin; after closing the mold so that the polybenzimidazole resin can be densely packed in the mold, heating the mold to a predetermined temperature ranging from 500° C. to 600° C. without applying pressure to the mold from the outside; after increasing the pressure on the mold from 0 kg/cm2 to 50-750 kg/cm2, sintering the polybenzimidazole resin while maintaining the temperature and the pressure for 15 to 200 minutes; cooling the mold; and removing the sintered article of the polybenzimidazole resin from the mold. By this method, sintered articles of polybenzimidazole resins having no weak parts can be obtained in high yields.