Patents Represented by Attorney Alan Petlin Klein

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  • Electronic package assembly with capillary bridging connection
    Patent number: 3934336
    Abstract: An electronic package assembly comprising a substrate having a central recess in which a semiconductor chip can be mounted. A narrow inclined groove is cut into the edge of the recess and extends from the recess bottom to the location of a screen-printed ground lead on the surface of the substrate. Conductive paste is painted on the bottom of the recess for attachment of a chip and a portion of the paste is drawn up the groove by capillary action to form a tenacious bond with the screen-printed ground lead.
    Type: Grant
    Filed: January 13, 1975
    Date of Patent: January 27, 1976
    Assignee: Burroughs Corporation
    Inventor: Robert S. Morse