Abstract: A resistance welding apparatus characterized by very low output impedance, and providing a substantially constant voltage source to low impedance (e.g., resistances on the order of 1-100 micro-ohms) materials-to-be-joined. The welding apparatus includes one or more primary and secondary winding pairs disposed about a high permeability core with the secondary coil(s) positioned between the primary coil(s) and the core. In a preferred form, the secondary coil(s) are capable of delivering more than 75,000 amperes of welding current. The welding apparatus is lighter, more cost efficient, and more energy efficient than conventional systems.

Abstract: An orthopedic implantable device articulately connects a first spinal vertebra to an adjacent second spinal vertebra along the midline of the first and second vertebrae or along an axis medial to the facets. The device includes a first component having a male articulation member and a second component having a female articulation member. The first and second components are adapted to be attached to posterior locations of the first and the second vertebrae, respectively. The first component is articulately connected to the second component by engaging the male articulation member to the female articulation member or vice versa. The articulation mechanisms may be a hook and loop or a hinge. First and second components are configured to replace the natural lamina, spinous process, pars interarticularis, and/or facets of the corresponding first and second vertebrae.

Abstract: A ski includes an elongated body having a bottom surface and a surface modifier having a first surface with a smooth texture and a second surface opposite to the first surface with a rough texture. The surface modifier is reversibly attached to the bottom surface of the elongated body thus providing the bottom surface with a smooth texture suitable for downhill skiing when the second rough textured surface is attached to the bottom surface and with a rough texture suitable for uphill and cross country skiing when the first smooth textured surface is attached to the bottom surface.

Abstract: A computer system for executing a rich application over a network connection includes a backend server connected to an application server, a web server connected to the application server and to a client machine. The backend server stores and executes the rich application, which includes a Graphical User Interface (GUI) having a set of controls used to control and execute the application. The application server receives and converts information of the GUI into one or more web pages and one or more client side scripts. A client foundation class running at the client machine receives and converts the one or more web pages and the client side scripts into an application user interface, and executes the client-side scripts thereby controlling interactions of a user with the application user interface. The application user interface includes at least one of the GUI controls.

Abstract: A spine fixation assembly connecting a first and second vertebra includes first and second elongated plates that form an X-shaped structure. The first elongated plate has a first and a second end that are attached to a first location of the first vertebra and to a second location of the second vertebra, respectively. The second elongated plate has a first and a second end that are attached to a second location of said first vertebra and to a first location of the second vertebra, respectively. The ends of the plates are attached to the various locations of the vertebra via screws or hooks. The elongated plates may have adjustable length, may be rotated around a central axis passing through the center of-the X-shaped structure and may be cross-coupled to each other via a screw. A third and fourth elongated plated may be attached horizontally across the top and bottom of the X-shaped structure, respectively.

Abstract: An improved semiconductor wafer processing system includes defect detection equipment and defect eradication equipment. The defect eradication equipment is a supercritical fluid cleaning apparatus. The defect detection equipment creates a record for each wafer indicating defect identification and characterization results at each wafer processing station. The supercritical fluid cleaning apparatus receives the defect data from the defect detection equipment and applies a defect appropriate supercritical fluid cleaning recipe based on generic cleaning recipes and/or defect specific cleaning recipes. The system further includes equipment for transferring a plurality of semiconductor wafer among a plurality of processing stations under computer control. The improved semiconductor wafer processing system produces IC test yields of the order of 68% and a defect density of 0.1 defects/cm2 for a 430 mm2 chip.