Patents Represented by Attorney, Agent or Law Firm Allison A. Johnson
  • Patent number: 6430898
    Abstract: The present inventors have discovered that an easily measured property, namely complex viscosity, directly relates to physical film compatibility and have further identified a class of polyolefin materials, which are particularly amenable to exhibiting such properties. It is important to note that this discovery assumes that the film material is first chemically compatible with the thermoplastic composition to be packaged. The invention is particularly useful for low viscosity thermoplastic compositions having a Brookfield viscosity of less than about 10,000 cPs at 350° F., such as pressure sensitive hot melt adhesive compositions which are typically applied by melting the packaged adhesive composition in a melt tank wherein the melt tank lacks an active mixing means.
    Type: Grant
    Filed: December 21, 1999
    Date of Patent: August 13, 2002
    Assignee: H.B. Fuller Licensing & Financing, Inc.
    Inventors: Peter Remmers, Joachim Baumung, Michelle M. Chanak, Kevin W. McKay, Thomas Wittkopf
  • Patent number: 6387449
    Abstract: A hot melt curing urethane adhesives with heat stability, green bond strength and fully cured bond strength that are surprisingly compatible in production and use. The reactive hot melt adhesive composition includes a composition including an isocyanate compound; a polyester-polyol compound; a reactive tackifying resin including non-polar polyols; and a thermoplastic polymer. The components of the adhesive composition cooperate in at least some embodiments to form a hot melt compatible adhesive composition that has substantial initial green strength, substantial cured bond strength, chemical and heat resistance when cured, extended pot life, long open times, high heat resistance, (i.e., high PAFT), and good adhesion to plastics.
    Type: Grant
    Filed: December 1, 1999
    Date of Patent: May 14, 2002
    Assignee: H. B. Fuller Licensing & Financing, Inc.
    Inventors: Kevin J. Reid, Gary J. Haider, John M. Zimmel