Patents Represented by Law Firm Amster, Rotthstein & Ebenstein
  • Composite with discontinuous adhesive structure
    Patent number: 5523146
    Abstract: A composite includes a first substrate, a second substrate, and a discontinuous adhesive structure disposed intermediate the first and second substrates for securing the first and second substrates together to form a composite without significantly modifying the properties of either of the first and second substrates. The discontinuous adhesive structure is an array of substantially linear filaments or strands of an adhesive.
    Type: Grant
    Filed: April 11, 1995
    Date of Patent: June 4, 1996
    Assignee: Poly-Bond, Inc.
    Inventors: Carl A. Bodford, Stephen O. Chester, Rahul K. Nayak