Abstract: A method for performing and an apparatus to perform chemical mechanical polishing on a semiconductor wafer are disclosed. The apparatus includes a wafer holder, a polishing member, and a movable table. The movable table is in contact with and is supporting the polishing member. The polishing member includes a polishing pad, a backing layer, and a stiffening layer positioned between the backing layer and the polishing pad. The polishing pad has a polishing surface that is oriented to receive a semiconductor wafer held by the wafer holder. The polishing surface is configured to chemically mechanically polish the semiconductor wafer. The method includes holding a semiconductor wafer, moving a polishing member, and bringing a surface of the semiconductor wafer into contact with the polishing member. The polishing member includes a polishing pad, a backing layer, and a stiffening layer positioned between the polishing pad and the backing layer.