Abstract: A method for improving user satisfaction with automated response computer driven systems is provided. In one embodiment the automated computer system utilizes a Web browser accessing at least a Web site. In another embodiment, the automated computer system is a telephonic response system with voice recognition and generation capability. In each embodiment the user is first prompted to provide indications of user language usage preferences which are then analyzed and stored in a user profile. Thereafter, subsequent information from the automated system is modified in accordance with the stored user profile before presentation to the user.

Abstract: An apparatus receives a series of locations containing a row address and a column address of a fault detected within an array. A row replacement priority circuit within the apparatus logs the row address of the first fault detected, and thereafter marks a column of any subsequent faults detected in rows other than the row of the first detected fault. Concurrently, a column replacement priority circuit within the apparatus logs the column address of the first fault detected, and thereafter marks a row of any subsequent faults detected in columns other than the column of the first detected fault.

Abstract: Apparatus is provided for precisely positioning and thereafter holding a probe connected to an oscilloscope or the like. The apparatus enables a single operator to position the probe and read and adjust the oscilloscope. The apparatus has a rod like means about which a nonconducting probe holder enjoys several degrees of freedom. The rod is connected to a weighted base by a clamp through which the rod may slide as part the gross positioning of the assembly and which clamp can be adjusted to finely position the rod and probe clamp assembly.

Abstract: A system and method for managing mirrored logical volumes are provided wherein a user designates one mirror of a given logical volume, having a first entry point, as the backup mirror, with a different entry point, for that logical volume; and thereafter, upon user issuance of an I/O command, appropriately valid mirror(s) are selected to be read from or written to as a function of which of the two entry points to the same data is specified.

Abstract: A computer system for providing application program developers a technique for building a plurality of panel displays from a single, comprehensive panel definition source file. The system includes routines for creating panel definition information, acquiring a copy of previously created panel information and displaying panels dynamically created at run time using previously stored panel definition information. The system also allows the specification of modifications to panel displays at run time as well as an option for look ahead processing of previously defined and newly specified panels at run time.

Abstract: A memory system package is provided by placing memory chips face-to-face using as an interposer a thin flexible carrier having through-carrier-connections, vias, for common memory chip I/O pads which are brought out to access external signals, either control, I/O or power. These external signals may also be wired to memory chip pads that are not common.

Abstract: A flexible circuit 10 panel is coated with solder by lowering into a bath of molten solder 4. On removal from the bath excess solder is blown from the panel by air jets from one or more nozzles 22. The panel is pulled towards the nozzle by a region 60 of negative pressure associated with the nozzles, and is held close to the nozzles to obtain an even coating of solder.

Abstract: Methods and apparatus are provided for applying solder in precise amounts to fine pitch leads such as those suitable for direct chip attachment (DCA) or flip-chip applications by using a heated platen to apply pressure to solder overlaying a plurality of lands on circuitized substrate. In one embodiment paste solder screened through a mask having apertures each corresponding to a plurality of land locations. In another embodiment, a web of solder foil is accurately positioned over a plurality of fine pitch lands. In each embodiment, a heated platen includes at least one active element corresponding in size and shape to the area having a plurality of fine pitch lands. A third embodiment includes individual platens for lands to which solder is to be applied.

Abstract: A method and apparatus utilizing one or two cameras are described for visually inspecting a polygonal component located at the end of the robotic end effector for determining presence, position and orientation of component leads prior to placement. Image processing improvements are provided for decreasing computational complexity by representing two dimensional image areas of interest, and each containing leads along one side of a component, by one dimensional summation profiles.

Abstract: A technique for use in an I/O channel to increase bus bandwidth during DMA data transfers between main system memory and a communication link is disclosed, including a pair of buffers, a plurality of counters adapted to selectively contain a count of data increments therein, and enhanced DMA control logic for monitoring buffer data content amount, and at a predetermined time during a given transfer initiating a bus arbitration so that it is completed simultaneously with the given transfer, thereby enabling the next data transfer from the buffer in use to immediately commence.

Abstract: A system for an efficient message handling technique implemented in AIX, an operating system derived from UNIX System V, is described for use in a distributed services network include a plurality of multi-processing, multi-tasking nodes among which interprocess communication occurs via queues, the actual node locations of which are transparent at the application interface.

Abstract: A method is disclosed for determining the presence and position of fiducials on the surface of a printed circuit substrate in grey level images to sub-pixel accuracy. A summation profile technique is utilized to decrease the amount of computation required and thereby increase throughput for enabling real time operation in a total component placement system.

Abstract: A method and apparatus for efficiently and economically using partially good memory modules to construct a memory unit of predetermined aggregate capacity is described, using a universal wiring pattern on a substrate, including positions thereon with circuitry adapted for connecting to data outputs from a plurality of partially good memory modules, memory unit data output circuitry, and selectively interconnectable--during a final manufacturing step--lines associated with memory module data outputs and with the memory unit data outputs, thereby enabling connection of data outputs from good sections of the partially good memory modules to memory unit data outputs.

Abstract: A method of nondestructively testing electronic chips adapted for direct attachment to metallized pads on circuitized substrate is disclosed, wherein an electrically conductive liquid eutectic joint is formed at room temperature with low pressure between electrical terminals on the chip and pads on the substrate. The eutectic joint remains liquid at test temperature, enabling test completion. At the end thereof, chips and pads are separated and any eutectic material residue thereon removed. The eutectic is preferably gallium/indium.

Abstract: An improved method for double sided attachment of components to a printed circuit board is described wherein surface mount components soldered to a first surface of the circuit board (backside) are, once the board is inverted during reflow, retained in place only by force of molten solder surface tension.

Abstract: An acid copper plating bath and process for using with electropositive metals such as aluminum and tungsten is described, wherein the bath contains sulfuric acid, copper sulfate, in solution with urea as a levelling agent, a cationic surfactant as a wetting agent and an ester of a sulfonic acid, Beta-phenylethyltosylate as a brightening agent.

Abstract: Described is an improvement for thermal enhancement technology for high power dissipating plastic packaged electronic circuit chips derived from providing structural features in the plastic package adapted to snap fit with complementarily formed edges of heat sink members.

Abstract: A method is described for attaching circuit chips to a flexible substrate (laminate) using controlled chip collapse connection technology (C-4). The substrate is "tinned" with an alloy of eutectic composition in its contact region with the solder balls on the base of the chip. The alloy and the solder are chosen such that they are miscible. The system temperature is raised above the alloy melting point thus causing the alloy and the solder to mix, the mixture composition moving away from the eutectic composition with time and thus raising its melting point. Eventually the mixture melting point is higher than the temperature at which the system is maintained and the mixture solidifies to form a contact. In this way contact between the chip and the flexible substrate can be effected at a temperature below the melting point of the pure solder and lower than one which would result in degradation of the laminate adhesive.

Abstract: A chemical polishing bath and process are disclosed for pretreating aluminum and its alloys prior to plating or anodizing operations, which bath and process produce a mirrorlike finish.

Abstract: A novel electroless plating bath composition and method for the use thereof, are described for depositing a layer of nickel on anodized aluminum substrates for facilitating direct attachment of electronic chips thereto; the bath composition being a neutralized solution of nickel sulfate, sodium citrate, lactic acid and dimethylbomine in deionized water.