Abstract: A cooling system and method, and a cooled electronics assembly are provided employing a thermal spreader having an inner chamber evacuated and partially filled with a liquid. A phase separator is disposed within the thermal spreader to at least partially divide the inner chamber into a boiling section and a condensing section, while allowing vapor and liquid to circulate between the sections. A heat extraction assembly is disposed at least partially within the inner chamber to extract heat therefrom. When the thermal spreader is coupled to a heat generating component with the boiling section disposed adjacent thereto, liquid within the thermal spreader boils in the boiling section, producing vapor which flows upward from the boiling section and causes liquid to flow into the boiling section from the condensing section, thereby providing circulatory flow between the sections and facilitating removal of heat from the heat generating component.

Abstract: A thermoelectric assembly is provided for an electronic device, having a surface with a non-uniform thermal distribution between at least one first region and at least one second region, with the at least one first region having a higher heat flux than the at least one second region. The assembly includes at least one first area of thermoelectric elements and at least one second area of thermoelectric elements, which are configured to align over the at least one first region of higher heat flux, and the at least one second region, respectively, when the assembly is coupled to the device. The at least one first area of thermoelectric elements includes a greater density of thermoelectric elements than the at least one second area of thermoelectric elements for handling the higher heat flux.

Abstract: An electronic module and method of fabrication are provided employing an integrated thermal dissipation assembly. The thermal dissipation assembly includes a thermoelectric assembly configured to couple to an electronic device within the module for removing heat generated thereby, and a programmable power control circuit integrated with the thermoelectric assembly. The programmable power control circuit allows cooling capacity of the thermoelectric assembly to be tailored to anticipated heat dissipation of the electronic device by adjusting, for a given power source, voltage level to the thermoelectric elements of the thermoelectric assembly. Power to the thermoelectric assembly can be provided through conductive power planes disposed within a supporting substrate. The power control circuit includes one or more voltage boost circuits connected in series between the given power source and the thermoelectric elements of the associated thermoelectric assembly.

Abstract: An impact of configuration changes on controllers is projected. This projection quantifies the impact for each controller affected by the change, such that it is known by a quantifiable value how much the change impacts the controller. In order to project the impact, a projected I/O velocity of the controller is determined.

Abstract: An input pen for a touch panel excellent in a using feeling without causing any flaw in a display, and an input pen. A touch ball made of, for example, an acetal resin is provided at a pen tip of an input pen. The touch ball is held via a first spring and a second spring. Furthermore, respective spring constants of the first spring and the second spring are set in such a manner as to establish the relationship of (a displacement of the first spring)>(a displacement of the second spring)>(a deformation of the touch ball) when pressing force for pressing the touch ball toward a main body shaft acts. Thus, it is possible to suppress any deformation of the soft touch ball even if the input pen is strongly pressed against a screen of a touch panel or the like.

Abstract: A program having a plurality of concurrently executing versions is debugged. A version of the program to be debugged is selected from the plurality of versions of the program, and that selected version is debugged. As one example, the selection is responsive to the receipt of at least one task of the computing environment that is associated with the version to be debugged. The debugging of the selected version does not affect other versions of the program, other programs executing within the computing environment or other tasks using that version.

Abstract: An integrated heat sink system is provided for internal cooling of a closed electronics container. The heat sink system includes a cold plate and a fin assembly thermally coupled to and extending from the cold plate. The cold plate has a surface for thermally coupling to one or more components within the container, such as a processor module. The heat sink system further includes at least one coolant carrier channel thermally coupled to and passing through the fins of the fin assembly. When the heat sink system is operational within the closed container, the cold plate thermally couples to and removes heat from the one or more components, the plurality of fins remove heat from air circulating within the closed container, and coolant within the coolant carrying channel(s) removes heat from the plurality of fins and from the cold plate thermally coupled thereto.

Abstract: To provide a docking station for a portable computer, which increases its heat radiation when the docking station is docked with the portable computer. A docking station is equipped with a fan unit at a back portion of a power supply unit within a station body, and a front surface of a connection portion with which a notebook PC is docked is provided with an air suction opening. Thereby, once the fan unit is driven, high temperature air is exhausted from a station body and the connection portion, then outside air is introduced from the suction opening to stimulate the cooling of the connection portion, and the heat which is transferred from a back side portion of the notebook PC to the connection portion is also dissipated there to stimulate the cooling of the notebook PC side.

Abstract: To provide a back light unit, a liquid display, and a method for manufacturing a light guide plate, in which the occurrence of bright lines can be diminished. An incoming surface 11a of a transparent light guide plate 11 is machined into a smooth surface S to correct a manufacturing tolerance during injection molding in order to form an edge portion E into a designed shape. To effectively reduce occurrence of bright lines, the edge portion E preferably has a curvature of radius or a chamfer dimension of 140 [&mgr;m] or smaller. The transparent light guide plate 11, a diffusion sheet 5, and a prism sheet 12 configure a back light unit 10 for a liquid crystal display.

Abstract: An electronic module is provided having an integrated refrigerant evaporator assembly coupled to a closed-cycle cooling system, as well as a method for controlling the system. The module and integrated assembly includes a plurality of integrated circuit chips arrayed on a substrate. The evaporator assembly is disposed over the chips and substrate such that a chamber is formed between the assembly and the substrate within which the chips reside. A lower plate of the assembly has a plurality of jet orifices which direct coolant onto individual chips of the plurality of chips arrayed on the substrate. In addition, the lower plate includes a plurality of channels formed between at least some of the jet orifices. The plurality of channels remove coolant from the chamber after the coolant has been heated by impinging upon the integrated circuit chips. A control system is provided to prevent excessive pressure from building up within the assembly at startup and shutdown of the closed-cycle cooling system.