Abstract: An electronic module, substrate assembly, and fabrication method, the assembly providing thermal conduction between an electronic device to be cooled and an aqueous coolant, while maintaining physical separation between the coolant and electronic device. The assembly includes a substrate, one or more electronic devices to be cooled, and a multilayer, impermeable barrier. The multilayer barrier includes a first layer, providing mechanical support for a second layer. The second, thinner layer provides an impermeable barrier, and a high effective thermal conductivity path between an electronic device and a cooling fluid in contact with an upper surface of the second barrier layer. Mechanical stresses are minimized by appropriate material selection for the first layer, and a thin second layer.

Abstract: Augmenting air cooling of electronics systems using a cooling fluid to cool air entering the electronics system, and to remove a portion of the heat dissipated by the electronics. A cooled electronics system includes a frame, electronics drawers, fans or air moving devices, and an inlet heat exchanger. A cooling fluid such as chilled water is supplied to the inlet heat exchanger, to cool incoming air below ambient temperature. Fans cause ambient air to enter the system, flow through the inlet heat exchanger, through electronic devices, and exit the system. An optional exhaust heat exchanger further transfers heat dissipated by electronic devices to the cooling fluid. Heat exchangers are pivotally mounted, providing drawer access. Segmented heat exchangers provide access to individual drawers. Heat exchangers are integrated into cover assemblies. Airflow guides such as louvers are provided at inlets and outlets. Cover assemblies provide a degree of acoustic and electromagnetic shielding.

Abstract: An enclosure apparatus provides for combined air and liquid cooling of rack mounted stacked electronic components. A heat exchanger is mounted on the side of the stacked electronics and air flows side to side within the enclosure, impelled by air-moving devices mounted behind the electronics. Auxiliary air-moving devices may be mounted within the enclosure to increase the air flow. In an alternative embodiment, air-to-liquid heat exchangers are provided across the front and back of the enclosure, and a closed air flow loop is created by a converging supply plenum, electronics drawers through which air is directed by air-moving devices, diverging return plenum, and a connecting duct in the bottom. In a variant of this embodiment, connecting ducts are in both top and bottom, and supply and return ducts are doubly convergent and doubly divergent, respectively. Auxiliary blowers may be added to increase total system air flow.

Abstract: Method, system and program products for screening a program of a computing environment for debug processing are presented which employ a table that contains information identifying at least some program areas of storage of the computing environment where programs to be debugged may reside and information identifying programs of the computing environment to be excluded from debugging. After detecting a debug trigger point during execution of a program, screening is accomplished by referencing the table to first ascertain whether the trigger point is within a program area of storage meaning that the program under execution may comprise an application program to be debugged, and if so, referencing the table to determine whether the program has been explicitly excluded from the debug processing. If not excluded, debug processing may proceed.

Abstract: An exemplary embodiment of the present invention is a method for dynamically managing a hash pool data structure. A request to insert a new key value into a hash pool data structure that includes at least one index level is received. An insertion location is calculated for the new key value in response to the new key value and to existing key values in the hash pool data structure. The insertion location includes an index level. A new index level is added at the insertion location if the index level is not the maximum number of index levels in the hash pool data structure; if the insertion location contains a chain of existing key values with a length equal to the maximum chain length; and if the new index record locations of the new key value and the existing key values are dispersed. The insertion location is updated in response to adding a new index record and the new key value is inserted into the insertion location.

Abstract: A scalable coolant conditioning unit (SCCU) is designed to accommodate removable modular pumping units (MPU's). The MPU's may comprise one or a plurality of pump/pump motor combinations. The MPU's are connected to coolant supply and discharge mechanisms by an insertion facilitation mechanism comprising an automatic coupling assembly and an isolation valve mechanism and are placed into and removed from the SCCU body with the aid of a seating mechanism. MPU's are added to an operating SCCU as needed to support increased heat loads of electronics frames. A plate heat exchanger is physically integrated within the expansion tank, reducing volumetric requirements for the SCCU and is sized to accommodate the maximum heat load.

Abstract: A cooling system is provided for cooling a heat generating component of an electronic device. The cooling system includes at least two cooling subsystems for a staged reduction of the temperature of a cooling fluid exposed to heat generated by the heat generated component. A first stage cooling subsystem reduces the temperature of the cooling fluid to ambient temperature or above, while a second stage cooling subsystem reduces the temperature of the cooling fluid exiting the first stage cooling subsystem to below ambient temperature. The first stage cooling subsystem is passive while the second stage cooling subsystem is active and can include one or more thermoelectric modules.

Abstract: A cooling system and method of fabrication are provided for cooling a heat-generating electronic element within a portable computer. The cooling system includes a cold plate assembly coupled to a heat-generating electronic element, and a heat exchange assembly disposed within the cover of the portable computer. The heat exchange assembly includes a hollow channel for carrying coolant, as well as a thermally conductive plate and air-cooled fins. The hollow channel is coupled to one main surface of the plate, while the air-cooled fins are coupled to an opposite main surface of the plate. A conduit carries coolant between the cold plate assembly and the hollow channel of the heat exchange assembly, and a circulation pump circulates coolant through the conduit between the cold plate assembly and the heat exchange assembly in a manner to remove heat from the heat-generating electronic component.

Abstract: Changes in locking configurations are managed. A locking configuration includes one or more locking facilities and the one or more locking facilities include one or more locks. When a change in a locking configuration, either planned or unplanned, is detected, one or more of the locks are redistributed. For example, one or more of the locks affected by the change are moved from one or more of the locking facilities to one or more other locking facilities. This redistribution is independent of the location of the data associated with the one or more locks being moved. Thus, data and locks may be moved independently of one another and without affecting one another. Further, the redistribution can take place while the system is available or mostly available, thereby minimizing downtime.

Abstract: Disclosed is a method and computer program device for dynamically managing the assignment of alias addresses to base addresses referencing an input/output (I/O) device, such as a direct access storage device (DASD). Two distinct methods are disclosed. In one method, alias addresses are assigned based on the performance of the I/O devices. In this method, alias addresses are assigned to highly utilized devices, as indicated by device performance data, in order to maximize the efficient utilization of I/O device resources. In a second method, workload management principles are utilized to assign alias addresses. In this method, a correlation is made between each I/O device and the service classes utilizing each device. As in the first method, performance data is generated for each I/O device. Alias addresses are assigned to I/O devices experiencing queue delays as indicated by their performance data, if the device is associated with a service class that has failed to meet one or more processing goals.

Abstract: To obtain connector connecting structure that makes it easy to connect connectors when a mounted part is mounted in a part-receiving part. In a keyboard unit mounted in a PC body of a notebook PC, a connector implemented on a flexible cable is movably supported through a cushion, which is made of urethane rubber and is fixed on a installation side 14B of the keyboard unit, and a support plate fixed to the cushion. Owing to this, by just mounting the keyboard unit in the PC body, the connector is connected to the connector in the PC body side, and hence connection becomes simple. Therefore, even if the misalignment between the connectors and arises, the connector moves according to an amount of the misalignment, and hence adequate connection can be performed.

Abstract: A server instance includes a first region to perform one or more privileged functions and a second region to perform one or more non-privileged functions. Thus, the privileged functions are separate from the non-privileged functions. The first region includes at least a portion of an object request broker, which is used in communicating with one or more clients coupled to the server instance. The second region executes non-privileged application code, and can be replicated within the server instance based on workload management criteria.

Abstract: An electronic module substrate assembly and fabrication method, the assembly providing good thermal conductivity between an electronic device and an aqueous coolant, while maintaining physical separation between the coolant and electronic device, and relieving mechanical stresses caused by mismatches in thermal coefficients of expansion of materials within the device assembly. The assembly includes a substrate, at least one electronic device, and a preformed, thermally conductive, impermeable barrier. The barrier is preformed into a plurality of regions, some of which are bonded to other structures. One barrier region preferably forms a fluid tight seal with the substrate perimeter. At least one other barrier region forms a low thermal resistance bond with the at least one electronic device.

Abstract: A cooling system and method of fabrication are provided for cooling one or more heat-generating electronic elements within a portable computer. The cooling system includes a cold plate assembly thermally coupled to a heat-generating electronic element, and a heat exchange structure disposed within the cover of the portable computer. The heat exchange structure includes a hollow channel and an expansion chamber in fluid communication with the channel. A conduit carries coolant between the cold plate assembly and the hollow channel in the heat exchange structure, and a circulation pump circulates coolant through the conduit between the cold plate assembly and the heat exchange structure in a manner to remove heat from the heat-generating electronic component. The expansion chamber integrated within the heat exchange structure provides a reservoir for the circulation pump from which to draw coolant for circulation through the cold plate assembly.

Abstract: Morphing is performed without self-intersection in a vector space, for the outlines for various types and shapes of figures. The morphing is performed by apparatus containing an outline extractor, for receiving two target figures for the morphing process and for extracting a set of outlines for each of the target figures; an outline tree generator and an outline tree arrangement unit, for retaining one specific outline of each of the two sets of outlines and for deleting the other outlines; an outline editor, for performing a smoothing process for the two outlines for the target figures that are retained by the outline tree arrangement unit in order to prevent self-intersection during the morphing process; and a sequence generator and a morphing viewer, for performing the morphing process in response to the progress made by the smoothing process performed by the smoothing processor.

Abstract: A set of management policies, selectable by the customer at object installation time, is used to manage one or more instances of an object. The set of policies includes at least one of an activation isolation policy, a passivation policy, a flush policy, and a refresh policy. The policies are managed by one or more containers of the computing environment.

Abstract: A heat exchanger using thermoelectric structures is provided for cooling a heat generating component of an electronic device. The heat exchanger includes a row of spaced passages, for example, formed by two or more separate tubes or a single coiled tube, for carrying a first cooling fluid. The heat exchanger further includes a thermoelectric structure disposed between adjacent spaced passages and exposed to a second cooling fluid. In one embodiment, the heat exchange also includes fins disposed between the same adjacent spaced passages so that the thermoelectric structure is disposed between the adjacent passages and the fins.

Abstract: Management functions typically performed by containers of a server instance are delegated to resource managers coupled to the server instance. For example, responsibility for such management functions as locking, security control, multisystem caching and commitment control are removed from the containers and delegated to the resource managers. This enables ongoing improvements and functional extensions provided in the underlying resource managers to be immediately leveraged transparently in the server instance.

Abstract: A transactional name server. One or more objects of the name server are managed as transactional objects, thereby providing a transactional name server. Atomic updates are provided in the name server by the addition of transactional semantics. The transactional semantics include making the objects of the name space managed objects and providing a local interface to a directory service that propagates a transactional context from the name server through a directory down to a resource manager.

Abstract: An electronic module and method of fabrication are provided employing an integrated thermal dissipation assembly. The thermal dissipation assembly includes a thermoelectric assembly configured to couple to an electronic device within the module for removing heat generated thereby, and a programmable power control circuit integrated with the thermoelectric assembly. The programmable power control circuit allows cooling capacity of the thermoelectric assembly to be tailored to anticipated heat dissipation of the electronic device by adjusting, for a given power source, voltage level to the thermoelectric elements of the thermoelectric assembly. Power to the thermoelectric assembly can be provided through conductive power planes disposed within a supporting substrate. The power control circuit includes one or more voltage boost circuits connected in series between the given power source and the thermoelectric elements of the associated thermoelectric assembly.