Abstract: A system for deterring an attack and adding with identification and apprehension of an attacker is disclosed. A vessel containing materials capable of leaving stain, odor, or other markings on the attacker and the victim are employed. Comparison of the materials found on the victim and on the attacker will help establish the connection between the two and aid in the positive identification of the attacker. The system further provides for an audio and light alarm as additional ways for the victim to discourage the attacker. Also included is a tool that will aid the victim in escaping from the attacker's vehicle or other surroundings and a device that will help attract attention to the victim and the attacker. Alternatively, miniature devices are employed that remove samples of the attacker's skin, bone, hair, tissue or bodily fluids and store the same. Subsequent analysis of these samples enables identification of the attacker. Similar devices are also employed to lodge themselves into attacker's skin.

Abstract: A golf bag having its own wheels for transportation and support is disclosed. The wheels are attached to the back end of the bag by a wheel carrying structure that readily folds for easy carrying and storing, and extends outwardly together with the wheels for transporting the bag and its contents. The structure also serves as a bag stand, thus avoiding the need for separate bag supports. The structure may also be easily separated from the bag and used for other purposes. The bag and the wheel structure are simple in design and inexpensive to manufacture.

Abstract: A contact structure for group III-V and group II-VI compound semiconductor devices, generally used as a light emitting diode (LED), a laser diode (LD), or a photodiode (PD), comprising p-type and/or n-type conduction is disclosed. The contact structure comprises a stack of multiple layers of metals and transparent conducting oxide. The first layer of the contact structure is in direct contact to the semiconductor and comprises at least one of indium, tin, nickel, chromium and zinc, or an alloy or combination of layers thereof. The second layer of the structure is in direct contact to the first layer and comprises at least one of Indium Tin Oxide, Indium oxide, and Tin oxide, or a combination thereof. The optional third layer of the structure contacts the second layer and comprises at least one of Au, Al, Pt, Pd, Mo, Cr, Rh, Ti. The third layer may be a contact pad contacting a smaller portion of the second layer.