Abstract: Copper or a copper alloy is removed by chemical-mechanical planarization (CMP) in a slurry of an oxidizer, an oxidation inhibitor, and an additive that appreciably regulates copper complexing with the oxidation inhibitor.
Type:
Grant
Filed:
September 30, 1999
Date of Patent:
October 14, 2003
Assignee:
International Business Machines Corporation
Inventors:
Vlasta Brusic, Daniel C. Edelstein, Paul M. Feeney, William Guthrie, Mark Jaso, Frank B. Kaufman, Naftali Lustig, Peter Roper, Kenneth Rodbell, David B. Thompson