Patents Represented by Attorney, Agent or Law Firm Antonelli, Terry, Stout & Krays, LLP
  • Lead frame and semiconductor device
    Patent number: RE37690
    Abstract: A lead frame and a semiconductor device wherein a through hole is formed in the center of a semiconductor chip-mounting surface of a chip pad at the center of the lead frame, the through hole being tapered or being one which corresponds to a surface area that is greater on the surface of the chip-mounting surface of the chip pad than on the surface of the side opposite to the chip-mounting surface thereof. This prevents the occurrence of cracks in the sealing plastic portion in the step of reflow soldering of the lead frame to the substrate.
    Type: Grant
    Filed: May 24, 1995
    Date of Patent: May 7, 2002
    Assignee: Hitachi, Ltd.
    Inventors: Makoto Kitano, Sueo Kawai, Asao Nishimura, Hideo Miura, Akihiro Yaguchi, Chikako van Koten nee Kitabayashi, Ichio Shimizu, Toshio Hatsuda, Toshinori Ozaki, Toshio Hattori, Souji Sakata