Abstract: A nucleic acid with which expression of a polypeptide having interleukin-16 activity can be achieved or regulated in a prokaryotic or eukaryotic host cell, wherein in the region coding for the polypeptide, the nucleic acid (1) corresponds to the DNA sequence SEQ ID NOS:1 and 5-7 or its complementary strand; (b) hybridizes under stringent conditions with the DNA of sequence SEQ ID NOS:1 and 5-7; (c) or is a nucleic acid sequence which, if there was no degeneracy of the genetic code, would hybridize under stringent conditions with the nucleic acid sequences defined by (a) and (b); (d) and, if it codes for a polypeptide having interleukin-16 activity, is suitable as genomic DNA for the recombinant production of IL-16 in eukaryotic host cells and processes for producing the same and pharmaceutical compositions containing the same.

Abstract: Process for the production of a functional immunoglobulin or functional derivative or fragment thereof with an improved stability in a eukaryotic or prokaryotic organism by transformation with an expression vector which contains a recombinant gene which codes for the said immunoglobulin derivative or fragment which is characterized in that a modified gene is used which contains at least one codon which is substituted compared to the unmodified gene and codes for a more frequent amino acid. In this way it is also possible to produce active antibodies free of disulfide bridges. In a modification of the process it is possible to selectively destabilize antibodies.

Abstract: A compound of formula (II), wherein R1 is chloro, fluoro or trifluoromethyl; R2 is hydrogen, chloro, fluoro or trifluoromethyl; and R is hydrogen or a protective group for the hydroxy moiety useful as an intermediate for the synthesis of antimycotic azole compounnds.

Abstract: An ultraviolet-curable and alkali-developing type photo solder resist ink comprises an epoxy resin obtained by extending chains of an epoxy compound by an isocyanate compound having at least two isocyanate groups per one molecule of the isocyanate compound, an ultraviolet-curable resin having carboxyl group and an ethylenically unsaturated group having a photopolymerization capability, a photopolymerization initiator, and a diluent. The resist ink shows a wide precuring acceptable width for providing an extended shelf life, a good tacky-dry property after a precuring step, excellent light-sensitivity at an exposing step, superior resolution, and improved removability of a film of the resist ink by an alkaline solution at a developing step. In addition, a solder resist obtained by a post-baking step of the resist ink film provides excellent resistances to molten solder and gold plating.

Abstract: A toner resin composition, as well as a toner prepared therefrom, are disclosed which are excellent in fixability, offset resistance and storage stability, and which result in reduced occurrence of DF staining.The toner resin composition includes (a) a vinyl copolymer containing 25 or lower % by weight of molecular species having molecular weights of 200,000 or higher; and (b) 3 to 10% by weight of ethylene-based olefin polymer which has a DSC-determined peak (melting point) within a range of 85-100.degree. C., a weight average molecular weight (Mw) within a range of 500-900, a number average molecular weight (Mn) within a range of 500-900, and a melt viscosity of 10 to 17 cps at 100.degree. C.

Abstract: A thermoelectric piece has an increased adhesive strength between a semiconductor matrix of Bi--Sb--Te or Bi--Te--Se and a diffusion barrier layer deposited thereon for blocking diffusion of a soldering material into the semiconductor matrix. An Sn-alloy layer is provided between the semiconductor matrix and the diffusion barrier layer of Mo, W, Nb and Ni to give the enhanced adhesive strength. The Sn-alloy is formed at the interface with the semiconductor matrix by interdiffusion of Sn with at least one element of the semiconductor. It is found that Sn will not lower the thermoelectric characteristics when diffusing into the semiconductor matrix and provides an sufficient adhesive strength to the metal elements of the diffusion barrier layer.