Abstract: In certain implementations, a method for chip singulation is provided including etching a frontside dicing trench from a front side of a wafer, forming a temporary holding material, in the frontside dicing trench, etching a backside dicing trench from a back side of the wafer along the frontside dicing trench, removing the temporary holding material and releasing the chip from the wafer or an adjacent chip. Certain implementations may include etching through surface deposited layers on the front side of the wafer. Certain implementations may further include completely filling the frontside dicing trench with the temporary holding material and etching the backside dicing trench to the temporary holding material that is in the frontside dicing trench, such that removing the temporary holding material self-dices the wafer. Certain implementations may include surrounding MEMS structures with the temporary holding material so as to hold the structures during etching of the back side of the wafer.

Abstract: In one implementation, a method for operating a plurality of MEMS devices including applying a magnitude of a selected actuation signal equal to a first substantially constant magnitude to an actuator to cause a movable structure to begin to accelerate from a first position to impact a motion stop at a second position. The method also includes decreasing the magnitude of the selected actuation signal in a first manner. The method further includes varying at least one of a start time and a duration of the decreasing magnitude of the selected actuation signal and observing a settling time of the movable structure in response to the step of varying. In some implementations, the method includes ascertaining a range of values for the start times and the corresponding durations for each of the plurality of MEMS devices that are capable of providing settling times of the movable structure in conformance with a predetermined specification based on the steps of varying and observing.

Abstract: A modular three-dimensional (3D) optical switch that is scalable and that provides monitor and control of MEMS mirror arrays. A first switch module includes an array of input channels. Light beams received from the input channels are directed toward a first wavelength selective mirror. The light beams are reflected off of the first wavelength selective mirror and onto a first array of moveable micromirrors. The moveable micromirrors are adjusted so that the light beams reflect therefrom and enter a second switch module where they impinge upon a second array of moveable micromirrors. The light beams reflect off of the second array of moveable micromirrors and impinge upon a second wavelength selective mirror. The light beams reflect off of the second wavelength selective mirror and into an array of output channels. The alignment or misalignment of a data path through the switch is detected by directing two monitor beams through the data path, one in the forward direction and one in the reverse direction.

Abstract: A device capable of receiving an optical fiber through an orifice in the housing of the device. The housing having a gold surface over a substrate material. An indium layer is located on the gold surface. A solder joint is formed with the indium layer covering the gold surface to have indium silver solder surrounding the fiber and maintaining the fiber in a desired position with the housing. The indium layer can be formed of pure indium and the solder joint is formed of indium silver solder having about 97% indium and about 3% silver. The fiber or fibers may be metallized with a pure indium coating. The indium silver solder joint can provide an improved hermetic seal at fiber entrances and exits of the device.

Abstract: In at least one embodiment, an apparatus having a first structure, a second structure, and a hinge coupled between the first and second structures. The hinge has a first flexible member aligned substantially along an axis. The hinge is arranged so that the second structure can rotate relative to the first structure substantially about the axis. The hinge can also include a second flexible member aligned substantially along the axis. The first and second flexible members being positioned on opposite sides of the second structure. In at least one embodiment, a method includes steps of fabrication of the apparatus.

Abstract: In one embodiment, a MEMS apparatus having a MEMS array including a plurality of MEMS devices is provided. In some embodiments, each of the plurality of MEMS devices includes a movable structure and a second structure. In addition, in some embodiments, a plurality of signal sources are coupled to the plurality of MEMS devices so as to be capable of supplying actuation signals for actuating the movable structure to impact the second structure. Further, in some embodiments, at least one processor is coupled to the plurality of signal sources to control the actuation signals, and is configured such that each of the plurality of MEMS devices is provided with a corresponding custom actuation signal.

Abstract: In at least one embodiment, a MEMS optomechanical switch in accordance with the present invention includes a substrate, a signal source capable of transmitting a radiation signal, an electrode coupled to the substrate, and a micromachined plate rotatably coupled to the substrate about a pivot axis. The switch further includes a micromirror having an orientated reflective surface, mounted to the micromachined plate and an electrical source coupled to at least one of the electrode and the micromachined plate.

Abstract: A micromachined plate 11, called a torsion plate, selectively pivots upon a substrate responsively to electrical force so as to move an attached micromirror 12 in a same plane; thereby to accurately selectively intercept, and to reflect, a light beam 2 that is moving parallel to the substrate; forming thus an optomechanical switch 1. The electrical force may be electromagnetic 3 in nature or, preferably, electrostatic. In various embodiments the pivoting torsion plate 11 with the micromirror 12 affixed may be (i) biased off the substrate by a three-dimensional structure 14 and/or by a “reshaped” torsion beam 11c, (ii) bent as plate 11d, and operated push OR pull, push AND pull, or push AND push, in a rocking operation, (iii) elevated above the substrate upon a self-assembling “micro-elevator structure” 16, and/or (iv) moved greatly in angular position by action of a “micro-flap” 11f.

Abstract: A number of micromachined optomechanical switching cells and matrix switches including such switching cells are disclosed herein. One optomechanical switching cell of the present invention includes a parallel plate actuator positioned on a substrate. A mirror coupled to the actuator is disposed to selectively redirect an incident optical beam. The present invention also contemplates an optomechanical matrix switch including a substrate and a plurality of optomechanical switching cells coupled thereto. The matrix switch further includes an arrangement for monitoring the optical power incident upon, and output by, the matrix switch.

Abstract: Various configurations of micromachined optomechanical switching cells are disclosed herein. In accordance with the invention, an optomechanical switching cell is provided which includes an actuator positioned on a substrate and a mirror coupled to the actuator. The switching cell also includes an electrode disposed upon the substrate under the actuator. An insulator may also be interposed between the substrate and the electrode. In another aspect of the present invention the switching cell includes a latch having a first end region connected to the substrate and a second end region engaged by the mirror.

Abstract: Various configurations of optomechanical matrix and broadcast switches are disclosed herein. One such optomechanical matrix switch includes a substrate and a plurality of optomechanical switching cells coupled thereto. Each of the optomechanical switching cells includes a mirror and an actuator. The matrix switch further includes an array of collimator elements, each of the collimator elements being in optical alignment with one of the optomechanical switching cells. Also disclosed herein is a distributed matrix switch including first and second optomechanical matrix switches. The first and second optomechanical matrix switches respectively include first and second pluralities of optomechanical switching cells mounted upon first and second substrates. A collimator array is interposed between the first and second matrix switches in optical alignment with the first and second pluralities of optomechanical switching cells.

Abstract: Various 3-port and 4-port micromachined optomechanical matrix switches are disclosed herein. In accordance with one aspect of the invention there is provided an optomechanical matrix switch including a substrate and a first plurality of optomechanical switching cells coupled thereto. Each of the first plurality of optomechanical switching cells is arranged to be in optical alignment with a first input port. A second plurality of optomechanical switching cells is also coupled to the substrate, each of the second plurality of optomechanical switching cells being in optical alignment with a second input port. In another aspect of the present invention an optomechanical matrix switch is provided which includes a substrate and a first plurality of optomechanical switching cells coupled thereto. Each of the first plurality of optomechanical switching cells is placed in optical alignment with one of a corresponding first plurality of input ports and with one of a corresponding first plurality of output ports.