Abstract: An electronic circuit module has an electronic circuit module main body and two signal pedestals, one on each side of the main body. The first signal pedestal is formed at a level higher than the second signal pedestal by an amount equal to the vertical thickness of the second signal pedestal. Signal lines are formed on a bottom surface of the first signal pedestal and on a top surface of the second signal pedestal. When connected to adjacent electronic circuit modules, the first signal pedestal of the electronic circuit module overlaps a second signal pedestal of one adjacent electronic circuit module, and the second signal pedestal underlaps a first signal pedestal of another adjacent electronic circuit module to electrically connect electronic circuit modules in multiple stages, improving signal connections and reducing the size of the electronic circuit module package.
Abstract: A recessed portion 15 for removing a circlip 13 is formed in such a manner as to coincide in location with a broached groove 12 formed in a piston bore 2a for relieving the compression deformation of a piston pin 10 that would be caused by a thrust load.
Abstract: A turning center line is provided at a front edge side of a lid mounted on an upper surface of an instrument panel for permitting spreading of an air bag, and the lid is provided at a rear edge side thereof with a free end which is adapted to abut against a front windshield when the lid is opened.
Type:
Grant
Filed:
July 9, 1992
Date of Patent:
January 3, 1995
Assignee:
Honda Giken Kogyo Kabushiki Kaisha
Inventors:
Kazuhiro Seiki, Yukihiro Yamaguchi, Minoru Kanda