Abstract: A semiconductor device includes a board and a semiconductor chip which is connected to an upper surface of the board via face-down bonding. The semiconductor device further includes a frame-shape member which is connected to the upper surface of the board with first adhesive, and has an opening to accommodate the semiconductor chip therein, and a plate-shape member which is situated to cover the semiconductor chip and the frame-shape member, and is connected to the semiconductor chip and the frame-shape member with second adhesive, wherein the frame-shape member has such a sufficient sturdiness as to prevent thermal-expansion-induced deformations of the board and the plate-shape member.

Abstract: A plasma display panel assembly comprising a panel, a heat radiation plate and a heat radiation adhesive sheet layer interposed therebetween. A heat radiation adhesive sheet for use in the heat radiation adhesive sheet layer is formed of a heat radiation adhesive composition containing an elastic styrene polymer, an adhesive imparting agent, an oil and a thermal conductivity imparting agent.

Abstract: An ocular lens material comprising a silicone compound having a zwitterionic group (I) represented by the formula (I): wherein R1 is H or an alkyl, R2 is an aliphatic hydrocarbon or an aromatic hydrocarbon, A1 is O, S, NH or direct bond, A2 is POO− or SOO−, A3 is O, S, NH or ═O, in which when A2 is SOO−, A1 and A3 are not S, and when A3 is ═O, R2 is absent, each of p and q is 1 to 20; a zwitterionic group (II) represented by the formula (II): wherein R3 is H or an alkyl, A4 is O, S, NH or direct bond, each of r, s and t is 1 to 20; or a zwitterionic group (III) represented by the formula (III): wherein R4 is H or an alkyl, each of A5 and A6 is O, S, NH or direct bond, in which A5 and A6 are not direct bonds at the same time, u is 1 to 20, and a process for producing the same. The ocular lens material shows excellent transparency, oxygen permeability, deposit resistance and wettability to tears at the same time.

Abstract: A sheet separator to separate sheets of documents supplied as a stack into a single sheet. The sheet separator has a first separating mechanism and a second separating mechanism, each of which has a separating roller. The second separating mechanism is provided at a position downstream from the first separating mechanism. The peripheral velocity of the second separating roller may be set lower than a peripheral velocity of the first separating roller.

Abstract: A hybrid vehicle including an internal combustion engine; a continuously variable transmission for transmitting a force between a first pulley and a second pulley through a metal belt; and a motor. An output shaft of the internal combustion engine is connected to the first pulley. The second pulley is connected to an output shaft of the motor. The output shaft of the motor is connected to a driving force transmitting device for transmitting a driving force from the second pulley and the motor. The motor and the driving force transmitting device are connected to the second pulley via an engaging element for selectively connecting or disconnecting the transmission of the driving force to the second pulley. The engaging element disconnects the transmission of the force when the internal combustion engine is stopped.

Abstract: The present invention relates to a heat sink. More particularly, the present invention relates to a heat sink used for radiating heat from an integrated circuit package such as a micro-processor arranged in a portable type electronic apparatus such as a notebook type personal computer and also used for radiating heat from a hard disk unit used in an electronic apparatus. The heat sink comprises: a heat transmitting member for transmitting heat generated by a heating component; a holding section for holding the heat transmitting member; and a heat sink body having a space in which a cooling fan having at least blades and a drive motor is embedded, wherein a portion of the holding section for holding the heat transmitting member, the portion being located below the space, is cut out.

Abstract: A chip inductor is made up of a coiled conducting wire and a magnetic member which is formed by sintering and in which the coiled conducting wire is embedded. Both end portions of the coiled conducting wire are exposed to both end surfaces of the magnetic member. External electrodes are formed with conducting thin films and are connected to respective end portions of the coiled conducting wire. An inorganic material is interposed in a clearance between winds of both end portions of the conducting wire and external surfaces of the magnetic member and a clearance between adjoining winds of the conducting wire.

Abstract: A semiconductor device comprises a semiconductor element having electrodes and metal bumps are attached to the electrodes. The metal bumps include copper cores and gold surface layers covering the cores. In addition, the metal bumps may include gold bump elements and solder bump elements connected together.

Abstract: In an apparatus for controlling a starting clutch of a vehicle having a function of stopping engine idling so that an engine is automatically stopped, the starting clutch being provided in a transmission of the vehicle in series with a belt type continuously variable transmission mechanism, a load is applied to the transmission mechanism before a rise in a side pressure of the drive pulley and the driven pulley at the time of vehicle start-up from the state of engine stopping, resulting in a slipping of the belt. To avoid such a slipping, at the time of vehicle start-up from the state of engine stopping, the engaging force of the starting clutch is prevented from increasing above the creeping force which gives rise to the creeping of the vehicle until after a lapse of a predetermined time.

Abstract: A turbo-molecular pump has a casing, a stator fixedly mounted in the casing, and a rotor supported in the casing for rotation relatively to the stator. A turbine blade pumping assembly and a thread groove pumping assembly for discharging gas molecules are disposed between the stator and the rotor. The rotor comprises at least two components constituting the turbine blade pumping assembly and the thread groove pumping assembly. The components are separable from each other at a predetermined position, and joined to each other to form the rotor.

Abstract: A swash plate for a swash plate compressor, wherein aluminum alloy containing 12 to 60% of Si and, as required, 0.1 to 30% of Sn is sprayed onto the iron or aluminum base plate of the swash plate compressor to form a seizure-resisting and abrasion-resisting surface layer dispersed with granulated Si.

Abstract: There is provided a hydraulic turbomachine comprising a housing, one or more impellers arranged rotatably around an axis within the housing, one or more resin-made diffusers provided around the one or more impellers for defining diffuser channels around the impellers, respectively, one or more support members provided within the housing and engaged under pressure with corresponding ones of the diffusers for securely supporting the corresponding diffusers in the direction of the above-noted axis within the housing, and elastic members held between surfaces of the support members and the diffusers in the above-noted direction. An O-ring receiving groove is formed in each of the surfaces of the diffusers in such a manner that the groove surrounds the axis, and an O-ring is placed in the groove as the elastic member.

Abstract: A hydrophilic treatment by the use of a surface active agent and the like is not required for a base even the surface of which is water-repellent or thermoplastic when a viscous amorphous type titanium peroxide is used for fixing a base as a binder. In addition, a thin layer of a photocatalyst semiconductor, a dielectrical ceramics or an electrical ceramics can be easily formed by adhering particles of a photocatalyst semiconductor, a dielectrical ceramics or an electrical ceramics to the layer of a viscous amorphous type titanium peroxide, which is a layer as a binder, in a homogeneously floating state gas. Furthermore, a layer of a titanium oxide having a photocatalyst function can be formed when a base is fixed with a viscous amorphous type titanium peroxide.

Abstract: A packaging machine includes a bottom breaker which has first to third prefolding members (41) to (43). The third prefolding member (43), serving to prefold a fold forming portion (27) by bending this portion (27) outward along a base part thereof, is pivotally movable from a nonoperative position P0 to a second operative position P2 via a first operative position P1. The fold forming portion (27) is moved with a first bottom panel (21) by the operation of the second prefolding member (42) so as to be brought into contact with the third prefolding member (43) and thereby bent outward while the third prefolding member (43) is pivotally moved from the nonoperative position P0 toward the first operative position P1. The third prefolding member (43) is pivotally moved from the first operative position P1 toward the second operative position P2 after the operation of the second prefolding member (42) to thereby bend the fold forming portion (27) through an increased angle.

Abstract: A ferroelectric film is formed on a principal surface of an underlying substrate. By the vapor deposition using high density plasma, an insulating protection film is deposited so that the ferroelectric film is covered therewith. The deposited protection film can prevent the ferroelectric film from deteriorating.

Abstract: The object of the invention is to provide a method for producing a photocatalytic material which consists of a titanium oxide, exhibits a higher photocatalytic activity and has excellent appearances. The above object is attained by the provision of a method for preparing a photo catalytic material by oxidizing the surface of a substrate consisting of titanium or a titanium alloy, the method comprising a step of anodizing the substrate in an electrolyte containing an organic acid and/or a salt of the organic acid and a step of further oxidizing the anodized substrate in an atmosphere.

Abstract: A Gunn diode which is formed by sequentially laminating a first semiconductor layer, an active layer and a second semiconductor layer onto a semiconductor substrate. The Gunn diode comprises first and second electrodes arranged on the second semiconductor layer for impressing voltage on the active layer, and a concave portion which is cut from around the first electrode in a direction of the second semiconductor layer and the active layer and which subdivides the second semiconductor layer and the active layer to which the first electrode is connected as a region which functions as a Gunn diode. Since etching for defining a region that is to function as a Gunn diode is performed by self-alignment dry etching utilizing electrode layers formed above this region as masks, variations in characteristics are restricted.

Abstract: At the time of vehicle start-up from the state of engine stopping, a hydraulic oil pressure in a starting clutch sometimes overshoots beyond a creeping pressure as a result of a rise in the hydraulic oil pressure in the hydraulic circuit, resulting in shocks. A hydraulic oil pressure command value to a linear solenoid valve which controls the starting clutch pressure is made smaller than the creeping pressure until the point of time at which the rise in the hydraulic oil pressure in the hydraulic circuit (=the point of time at which a condition of F2=1 is satisfied). Once a discrimination of a rise in the hydraulic oil pressure has been made, the command value is made higher than the creeping pressure for a predetermined period of time (i.e., for the period of YTM3−YTM3B1), and is thereafter made to the creeping pressure.

Abstract: A semiconductor device manufacturing method comprises the steps of forming solder bumps on an underlying metal film of a semiconductor device, and placing the semiconductor device and the solder layer in a reduced pressure atmosphere containing formic acid to form the solder bumps. Accordingly, the solder bumps can be formed without flux generating voids in the solder layer. Furthermore, the cleaning required after the solder bumps are formed can be omitted.