Patents Represented by Attorney, Agent or Law Firm Arthur J. Samadovitz
  • Free standing, three dimensional, multi-chip, carrier package with air flow baffle
    Patent number: 6256203
    Abstract: An efficient cooling mechanism for a multi-chip carrier can be provided while conserving board surface area. Flexible circuitized material is used to form multi-chip carriers with air baffle capability. The flex is folded or curved into the desired shape and held in position with a support structure. Bonding sites for chips are located on regions through the carrier. Shapes which provide air baffle capabilities include coils, spring-like coils and serpentines.
    Type: Grant
    Filed: November 10, 1999
    Date of Patent: July 3, 2001
    Assignee: International Business Machines Corporation
    Inventors: Anthony P. Ingraham, Glenn L. Kehley, Sanjeev B. Sathe, John R. Slack