Abstract: A method for selective conductivity etching of a silicon carbide (SiC) semiconductor includes forming a p-type SiC layer on a substrate layer, forming an n-type SiC layer on the p-type SiC layer, and photoelectrochemically etching selected portions of the n-type SiC layer by applying a bias voltage to the n-type SiC layer in a hydrofluoric acid (HF) solution while exposing the layer to a pattern of UV light. The bias potential is selected so that the n-type SiC layer will photo-corrode and the p-type SiC layer will be inert and act as an etch stop. The light pattern exposure of the n-type SiC layer may be done by applying a photolithographic mask to the layer, by projecting a collimated light beam through a patterned mask, or by scanning with a focused micrometer-sized laser beam on the semiconductor surface.
Type:
Grant
Filed:
February 17, 1994
Date of Patent:
March 7, 2000
Assignee:
Kulite Semiconductor Products, Inc.
Inventors:
Joseph S. Shor, Anthony D. Kurtz, David Goldstein