Patents Represented by Attorney, Agent or Law Firm Ashok E. Janah
  • Sidewall polymer forming gas additives for etching processes
    Patent number: 6583065
    Abstract: A process of reducing critical dimension (CD) microloading in dense and isolated regions of etched features of silicon-containing material on a substrate uses a plasma of an etchant gas and an additive gas. In one version, the etchant gas comprises halogen species absent fluorine, and the additive gas comprises fluorine species and carbon species, or hydrogen species and carbon species.
    Type: Grant
    Filed: August 3, 1999
    Date of Patent: June 24, 2003
    Assignee: Applied Materials Inc.
    Inventors: Raney Williams, Jeffrey Chinn, Jitske Trevor, Thorsten B. Lill, Padmapani Nallan, Tamas Varga, Herve Mace