Abstract: A magnetic resonance imaging apparatus having control unit for fetching a plurality of image data and obtaining an image by a calculation. The control unit performs an unwrap processing to a plurality of regions for removing a main value of a phase rotation amount so as to obtain a distribution diagram of a phase rotation amount caused by magnetostatic unevenness, obtains a plurality of evaluation values based on the phase value between a plurality of regions, selects a desired evaluation value based on the phase value from the plurality of evaluation values, and adjusts the phase values between the regions in accordance with the desired evaluation value.

Abstract: A raised portion 32 is provided on an upper face of an end portion of a plate 31 which forms one side of a frame member 30. An end portion of a plate 41 of another frame member 40 is abutted with the plate 31 of the frame member 30. The frame members 30 and 40 are aluminum alloy extruded frame members and the directions of extrusion of the two frame members are orthogonal. A welding padding is carried on an upper face of the plate 41 of the frame member 40. Under this condition, a rotary tool is inserted from above and a friction stir welding is carried out. Accordingly, the padding serves the same function on the plate 41 as the raised portion 32 on the plate 31, so that a good welding can be carried out.

Abstract: An editing system having a dialogue operation type interface directs a next operation by referring an operation history. User information is inputted by using speech input/output, pointing by a finger and 3-D CG. A human image representing the system is displayed as an agent on the image output device, and a user error, availability to a queue and a utilization environment are extracted by the system and informed to the user through the agent. The system responds to the user intent by the image display or the speech output by using the agent as a medium so that a user friendly interface for graphics edition and image edition is provided.

Abstract: A multilayer wiring board for mounting a semiconductor device, which has a multi-bonding-deck cavity, comprises at least two wiring boards and an insulation adhesive layer having an elastic modulus of 1,400 MPa or lower having a coefficient of thermal expansion of 450 ppm/.degree. C. or lower in a direction of thickness and being a cured product of an adhesive film which is a semi-cured product of an adhesive composition comprising (a) 71 to 100 parts by weight of an epoxy group-containing acrylic rubber having a glass transition point of -10.degree. C. or above and a weight average molecular weight of 100,000 or above, (b) 50 to 70 parts by weight of an epoxy resin having a weight average molecular. weight of less than 10,000 and a curing agent, (c) 10 to 60 parts by weight of a high-molecular weight resin being compatible with the epoxy resin and having a weight average molecular weight of 30,000 or above and (d) 0.1 to 5 parts by weight of a cure accelerator.