Abstract: There is disclosed a tag making and stacking system, tag stackers and stack trays. To increase tag making capacity, a wide tag web is slit into completely severed narrow tag webs which are cut apart to form tags which are immediately separated and formed into spaced apart stacks. The new system includes a printer and a stacking system to receive and stack tags. The stacking system includes a tag stacker and a removable tag-receiving tray to facilitate transferring a stack of tags from the tag stacker to the place where the tags are to be used. A method of handling tags involves the provision of at least first and second removable trays wherein a first tray with a stack of tags can be replaced by an empty second tray so that the stacking of additional tags can recommence without waiting for the first tray to be emptied.

Abstract: The present invention provides a retroreflective sheet with a discernable image. The retroreflective sheet comprises a transparent polymeric spacing layer having a first surface and a second surface; a layer of transparent microsphere lenses embedded into the first surface of the spacing layer at varying depths forming an image, wherein the spacing layer adheres to and conforms to the microspheres; and a reflective layer adhered to the second surface of the spacing layer. The present invention also provides methods for preparing such retroreflective sheet.

Abstract: There is disclosed a hand-held portable labeler and labeling method that enables the label web supply to be quickly threaded into the labeler. The path of the carrier web for the labels from the nip of the print head and platen roll, about the delaminator, into the nip between the platen roll and a pressure roll, and out of the labeler is short and the pressure roll is widely separable from the platen roll to facilitate threading.

Abstract: A method, system and apparatus for manufacturing radio frequency identification (RFID) devices. An RFID device can be formed with a substrate, a conductor and a laminate or coating. The RFID device can be such that an antenna can be formed on the conductor and the laminate can be applied to insulate or protect the antenna.

Abstract: A merchandise security kit includes a tag body, a first tack adapted to be removably attached to the tag body to form a first reusable hard tag that is limited to electronic article surveillance (EAS) capabilities, and a second tack adapted to be removably attached to the tag body to form a second reusable hard tag that is provided with both EAS and radio frequency identification (RFID) capabilities. The tag body comprises a security inlay that is disposed within a protective casing, the security inlay including an antenna and an EAS marker. The second tack comprises an enlarged head, a sharpened pin connected to the head and an integrated circuit (IC) chip embedded within the head. With the second tack attached to the tag body, the IC chip either conductively or reactively couples to the antenna in the tag body to provide the second hard tag with its RFID capabilities.

Abstract: The present invention describes an RFID tag and a method of making an RFID tag. The RFID tag can include a first substrate with a conductive layer disposed thereon. Further, the RFID tag can be formed with a second substrate that can have any number of components, for example a strap, a processor, a blade and a coupling mechanism mounted thereon. Also, the second substrate can be coupled to the first substrate with a coupling mechanism.

Abstract: Methods of making adhesive articles providing air egress by supplying a route for the air to flow out from under the construction are described. One method includes providing a release liner comprising a moldable layer having a release surface and a back surface; applying a first pattern of a first non-adhesive material to a first portion of the release surface; applying a second pattern of a second non-adhesive material to a second portion of the release surface, wherein the second pattern partially overlaps the first pattern; embedding at least one of the first or second non-adhesive materials into the moldable layer, and transferring an adhesive layer having a front and back surface and end edges onto the release liner, wherein the front surface of the adhesive layer is adhered to the release surface of the release liner.

Abstract: Systems and tabs are provided for labeling a hanging folder having substantially vertical slots. The tab includes three walls. The first wall has a top edge and a flange located below the top edge that is adapted for engagement of the vertical slot on the hanging file folder such that the first wall projects above the file folder. The second wall has a top edge and a flange located below the top edge that is adapted for engagement of the vertical slot on the hanging file folder such that the second wall projects above the file folder. The third wall is located between the first and second walls, and located along a plane that forms an angle with either the first or second walls that is not 90 degrees.

Abstract: Printing stock for use in making a sign that includes a face sheet and a backing sheet. The sign is formed, for example, by overlapping a plurality of face sub-sheets of the printing stock, with the face sub-sheets arranged in a pattern to form a desired image of the sign. The face sheet includes a printing surface for receiving ink and an adhesive surface for receiving the backing sheet. The face sheet includes a face cut forming a margin and the face sub-sheet such that at least a portion of the margin is separable from the face sub-sheet. The backing sheet may include a backing cut forming a border and a backing sub-sheet such that at least a portion of the border is separable from the backing sub-sheet so that at least a portion of the adhesive surface of the face sheet is exposable.

Abstract: A method for assembling a semiconductor device including the steps of providing a penetrable substrate having an adhesive surface and a plurality of dies disposed on the adhesive surface; providing a strap lead substrate having a plurality of strap leads disposed thereon; dispensing a first plurality of strap leads from the plurality of strap leads; providing a plurality of pins; bringing the penetrable substrate into close proximity with the strap lead substrate so as to bringing the first plurality of strap leads into contact with the plurality of dies; pressing the first plurality of strap leads against the plurality of dies using the plurality of pins; and, moving the penetrable substrate away from the strap lead substrate while using the plurality of pins to maintain contact between the first plurality of strap leads and the plurality of dies. An apparatus for assembling a semiconductor device is also disclosed.

Abstract: A label badge sheet construction including a facestock sheet releasably adhered to a liner sheet. A weakened separation line in the facestock sheet defines at least one label. After the sheet construction has been passed through a printer or copier and desired indicia printed on the at least one label the printed label can be removed to be used as a visitor's badge or the like. Preferably, first and second labels are formed with a fold line separating them, and a weakened separation line through the liner sheet forms a liner panel which is adhered to the back of the first label. With the first and second labels and the liner panel removed as a label assembly and the labels folded on the fold line, through-holes through the first and second labels and the liner panel are aligned. A lanyard or clip can be passed through the aligned through-holes. The liner panel thereby reinforces the through-holes.

Abstract: A label includes a first portion that is printable with optically readable information and a detachable second portion that has an RFID tag that can be encoded with corresponding RFID information. The printable portion and the RFID portion can thus be printed and encoded, respectively, with information for the same container or object. Both portions can then be kept together until the label is ready to be applied. This greatly reduces the chances of applying mismatched optical and RFID labels.

Abstract: A process is disclosed for creating semiconductor devices such as RFID assemblies wherein an array of dies mounted to a substrate is spaced apart at a first pitch, and the substrate is removed after the positions of the dies in the array is fixed by a solidifiable substance. The solidifiable substance is then removed without changing the relative positions of the dies in the array. All or a selected portion of the array of dies is then electrically attached to a plurality of straps or interposers arranged in a corresponding array. The spacing, or pitch, between the dies in the die array may be changed before or after the substrate is removed to match the pitch of the straps or interposers in the corresponding array. An RFID device created using the process inventive is also disclosed.