Abstract: An improved carrier for semiconductor chips is described. The carrier includes a base, a substrate including electrical conductors and a rectangular aperture for receiving the semiconductor chip mounted on the base. A transparent cover is installed over the chip and is retained there by a resilient metallic clip.

Abstract: This invention is directed to a machine for unloading micro-electronic beam lead devices from a carrier. The machine removes the resilient clip, base and circuit board from the cover and the chip so that the beam lead chip is exposed and can be picked up and bonded onto a hybrid circuit substrate.

Abstract: A method for enhancing the mechanical properties of beryllium and beryllium alloy bodies by deforming and recrystalizing cast and hot pressed beryllium bodies to a finer grain microstructure than initially present in the bodies without introducing a pronounced crystallographic texture into the bodies. More particularly, the beryllium body undergoes a textureless forging process by which the body is plastically deformed at elevated temperatures with the resulting metal flow being restricted to only one axis of the body. The deformed body is then restored to essentially its original shape and annealed at its recrystalization temperature with a resulting refinement in grain size to a size smaller than that present in the initial body.

Abstract: A closed loop controlled amplifier operable on low power is disclosed. The amplifier utilizes a relatively slow, high voltage transistor that is saturated during the active sweep and cut off during the retrace. A dampening network is included which operates during the active horizontal deflection time. A current feedback is derived from the horizontal deflection yoke to stabilize and control the amplifier.