Patents Represented by Attorney B. Peter Bardnt

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  • Method of assembling compact silicon module for high density integrated circuits
    Patent number: 5144746
    Abstract: A semiconductor module that densely packs integrated circuit chips to provide electronic systems or large memory modules in an array of stacked silicon boards. The semiconductor chips may be flip mounted and the back side of each chip is in thermal contact with an adjacent silicon board to provide heat conduction away from the chip.
    Type: Grant
    Filed: May 10, 1991
    Date of Patent: September 8, 1992
    Assignee: Texas Instruments Incorporated
    Inventor: James M. McDavid
  • Method for etching tungsten
    Patent number: 4915777
    Abstract: A process wherein a thin film of tungsten is anisotropically etched under plasma bombardment conditions by using a feed gas mixture which includes an etchant and a carbon containing gas. This chemistry provides anisotropic high rate fluoro-etching with good selectivity to photoresist.
    Type: Grant
    Filed: March 2, 1989
    Date of Patent: April 10, 1990
    Assignee: Texas Instruments Incorporated
    Inventors: Rhett B. Jucha, Monte A. Douglas, Cecil J. Davis