Abstract: A cost effective method is provided for assembly of hybrid optoelectronic circuits requiring flip-chip bonding of multiple active optoelectronic devices onto common substrate or optical bench platform with fine pitch and high accuracy “after-bonding” alignment to the alignment features on substrate and/or to other elements of the hybrid circuit. A Flip-Chip Bonder equipped with high precision Bonding Arm and optical and mechanical system, heated substrate chuck and heated pick-up tool may be used both for alignment and thermal bonding of active component dies to corresponding bonding pads on the common substrate using gold-tin (Au—Sn) solder disposed between die bonding pad and the corresponding substrate bonding pad.

Abstract: A point-of-presence (POP) call center system capable of answering, servicing, queuing and routing of calls at local points of presence to reduce communications costs and enhance operational efficiency for toll-free inbound call centers. The POP call center system includes a set of point-of-presence call center gateways distributed at points of presence close to the point of call origination that are connected by a virtual private network to premises call center gateways at business locations where the call centers reside.

Abstract: An address converter that reduces the number of address bit changes between successive sequential addresses is provided to a RAM address bus for a sequentially accessed RAM. In the presently preferred embodiment, the address converter comprises a plurality of XOR gates for converting the access addresses into gray coded access addresses having at most one address bit change between successive access addresses. As a result, the power consumed and the noise generated over the address bus is reduced, thereby conserving power available and minimizing device package pins required by the digital system having the RAM and the RAM address bus.